Uyini umehluko phakathi komshini we-SMT onesivinini esikhulu kanye nomshini we-SMT onesivinini esimaphakathi?

Umshini we-SMTiyimishini esemqoka kuUmugqa wokukhiqiza we-SMT, esetshenziselwa kakhulu ukubekwa kwezingxenye ze-chip.Ngenxa yejubane elihlukile kanye nemikhiqizo yokubeka, ingahlukaniswa ibe yi-ultra-high-speedumshini wokukhetha nokubeka, umshini wokukhetha nokubeka onesivinini esikhulu, umshini wokukhetha nokubeka endaweni enesivinini esimaphakathi, njll. Okulandelayo umehluko phakathi kwesikhuthazi se-chip esinesivinini esiphezulu nesixhumi se-chip esinesivinini esimaphakathi.

1.kusukela kumehluko wesakhiwo somshini we-SMT

Umshini onesivinini esimaphakathi ngokuvamile wamukela isakhiwo sohlaka lwe-arch, isakhiwo esilula, ukubekwa kokunemba akulungile, ihlanganisa indawo encane, izidingo zemvelo ziyisakhiwo sebhondi esinesivinini esiphansi kaningi kunesakhiwo se-turret esivame ukusetshenziswa kakhulu. isakhiwo esiyinhlanganisela, singahlangabezana nokunemba kokubekwa kwezingxenye ze-micro chip ngaphansi kokugcwaliseka kokubekwa kwesivinini esikhulu.

2.Ngokwehluka kwejubane lokukhweza umshini we-SMT

Isivinini esingokomqondo sokukhweza sesikhwezi sesivinini esimaphakathi ngokuvamile singu-30,000 “ucezu/h (ingxenye yohlobo lwesiqephu) cishe;Isivinini esingokomqondo sokukhweza sesikhwezi sesivinini esikhulu sivamise ukuba yizicucu ezingu-30,000–60,000/h ngehora (lokhu kubhekiselwa ku-mount 0603 ngezansi kwengxenye yohlobo lwesiqephu njengokujwayelekile).

3.Kusuka kumkhiqizo wokukhweza ukuze uhlukanise.

I-Medium speed mounter ingasetshenziswa njengokukhweza izingxenye ezinkulu, izingxenye ezinembayo eziphezulu kanye nezingxenye ezimise okwezimo, futhi ingakhweza izingxenye ezincane ze-chip;I-high speed mounter ingasetshenziswa ukukhweza izingxenye ezincane ze-chip kanye nezingxenye ezincane ezihlanganisiwe.

4.Kusuka kumehluko webanga lohlelo lokusebenza lwesikhwezi.

I-Medium-speed bonder itholakala kumabhizinisi amancane naphakathi nendawo akhiqiza futhi acutshungulwe nge-elekthronikhi, isikhungo sokuklama ucwaningo nentuthuko kanye nezici zomkhiqizo zezinhlobonhlobo zamabhizinisi amancane okukhiqiza amaqoqo asetshenziswa kabanzi;i-high-speed bonder isemabhizinisini amakhulu okukhiqiza ama-elekthronikhi kanye namanye amabhizinisi akhiqiza imishini yoqobo ngenani elikhulu elisetshenziswayo.

Inkulumo engenhla ngokuyinhloko isuka ekungenisweni kwesibopho esikhulu ekuhlukaniseni.Ngalesi singeniso esingenhla singabona ukuthi i-medium speed bonder ne-high speed bonder ingahlukaniswa ikakhulukazi ngesivinini sokubeka, isakhiwo somshini, imikhiqizo yokubeka kanye nobubanzi bokufaka isicelo.Uma ukukhiqizwa kwejubane lokubeka isikhweli se-LED kungafinyelela ku-15000 / h noma ngaphezulu futhi ngisho noma isikhweli esinesivinini esikhulu.

I-NeoDen 8 amakhanda Khetha bese Beka Umshini

Amakhanda azimele angu-1.8 anesistimu yokulawula iluphu evalwe ngokugcwele asekela konke okuphakelayo okungu-8mm ngesikhathi esisodwa, ngesivinini esifika ku-13,000 CPH.

I-2.Ihlomisa ikhamera ye-double mark + ikhamera ye-double side high precision endizayo iqinisekisa isivinini esikhulu nokunemba, isivinini sangempela sifika ku-13,000 CPH.Ukusebenzisa i-algorithm yokubala yesikhathi sangempela ngaphandle kwemingcele ebonakalayo yokubala isivinini.

3.Izingxenye ezisebenzayo zomkhiqizo

Japan: THK-C5 grade grinding screw, Panasonic A6 servo motor, Miki high performance coupling.

I-Korea: Isisekelo se-Sungil, i-WON linear guide, i-Airtac valve nezinye izingxenye zomkhiqizo wezimboni.

Konke kunokuhlanganiswa okunembayo, ukuguga okuncane nokuguga, ukunemba okuzinzile nokuqinile.

4.Sekela ithreyi yephalethi efika ku-4 yama-chips (ukucushwa kokuzikhethela), ububanzi obukhulu kanye nenketho eyengeziwe.