Geza kabusha ihhaviniI-reflow iyinqubo yokunamathisela kwe-solder ekufinyeleleni indawo yokuncibilika yokunamathisela, ekucindezelekeni kwayo kwendawo ye-liquid kanye nendima ye-flux flux emuva kumaphini wengxenye ukwenza i-solder joint, ukuze amaphedi webhodi lesifunda kanye nezingxenye ezithengiswa zibe zizonke. , ebizwa nangokuthi inqubo yokugeleza kabusha.Inqubo ye-reflow soldering igeleza ngokuqonda okunembile.
1. Lapho PCB wesifunda ibhodi phakathireflow soldering umshiniindawo yokushisa, i-solvent ku-solder paste, igesi iyahwamuka, ngasikhathi sinye, ukugeleza kwe-solder namathisela okumanzisa amaphedi, amathiphu engxenye nezikhonkwane, unamathisele we-solder wathamba, wawa, wamboza iphedi, iphedi, izikhonkwane zengxenye nokuhlukaniswa komoya-mpilo. .
2. PCB wesifunda ibhodi endaweni reflow ukwahlukanisa, ukuze PCB kanye izingxenye ukuze uthole preheating ngokwanele, ukuvimbela PCB kungazelelwe endaweni soldering high-lokushisa kanye nokulimala PCB kanye izingxenye.
3. Lapho i-PCB ingena endaweni yokugeleza kabusha, izinga lokushisa likhuphuka ngokushesha ukuze i-solder inamale ifinyelele esimweni esincibilikisiwe, i-solder ewuketshezi kumaphedi e-PCB, amathiphu engxenye nezikhonkwane zokumanzisa, ukusabalalisa, ingxube ye-liquid tin reflow ukuze yakhe amalunga e-solder.
4. I-PCB ingene endaweni yokupholisa egeleza kabusha, ngemva kokugeleza kabusha komphumela womoya obandayo wethayela eliwuketshezi futhi ugeleze kabusha ukwenza amajoyinti e-solder afingqiwe;ukuqinisa kuleli phuzu kuqedele ukuphinda kufakwe i-solder.
I-Reflow soldering yonke inqubo yomsebenzi ayikwazi ukuhlukaniswa nomoya oshisayo ekamelweni lokugeleza kabusha, ukuthuthwa kabusha kwe-reflow soldering ukuthembela endimeni yokugeleza komoya oshisayo endaweni ehlangene ye-solder, i-gel-flux efana nejeli ekugelezeni komoya okungaguquki ukuze kutholakale ukusabela komzimba. Ukushisa kwe-SMD;okubizwa ngokuthi “i-reflow soldering” ngenxa yokuthi igesi egeleza iye emuva naphambili emjikelezweni womshini wokushisela ukuze ikhiqize izinga lokushisa eliphezulu ukuze kuzuzwe injongo yokushisela ebizwa ngokuthi i-reflow soldering.
Izici zeI-NeoDen IN6 i-reflow oven
Idizayini yezindawo ezi-6, ilula futhi ihlangene.
Ukulawula okuhlakaniphile okunenzwa yokushisa ezwelayo ephezulu, izinga lokushisa lingakwazi ukuzinza ngaphakathi kuka + 0.2 ℃.
Ipuleti lokushisisa ingxubevange ye-aluminium esebenza kahle kakhulu esikhundleni sepayipi lokushisisa, kokubili ukonga amandla nokusebenza kahle kakhulu, kanye nomehluko wokushisa oguquguqukayo ungaphansi kuka-2℃.
Ijika lezinga lokushisa le-PCB le-soldering lingaboniswa ngokusekelwe esilinganisweni sesikhathi sangempela.
Igunyazwe yi-TUV CE, inegunya futhi inokwethenjelwa.
Inzwa yangaphakathi yezinga lokushisa iqinisekisa ukulawula okugcwele kwegumbi lokushisa futhi ingafinyelela izinga lokushisa elilungile ngemizuzu eyishumi nanhlanu.
Idizayini isebenzisa ipuleti lokushisisa ingxubevange ye-aluminium enyusa ukusebenza kahle kwamandla kwesistimu.Isistimu yokuhlunga intuthu yangaphakathi ithuthukisa ukusebenza komkhiqizo futhi inciphisa okukhiphayo okuyingozi, nayo.
Isikhathi sokuthumela: Dec-21-2022