Amaphuzu abalulekile alesi sihloko
- Amaphakheji e-BGA ahlangene ngosayizi futhi anephini eliphakeme lokuminyana.
- Kumaphakheji e-BGA, i-crosstalk yesiginali ngenxa yokuqondanisa kwebhola nokungaqondani kahle kubizwa nge-BGA crosstalk.
- I-BGA crosstalk incike endaweni yesiginali yesigebengu kanye nesiginali yesisulu ohlwini lwegridi yebhola.
Kuma-IC anamasango amaningi kanye namaphinikhodi, izinga lokuhlanganisa liyakhula kakhulu.Lawa ma-chips asethembeke kakhulu, aqinile, futhi asebenziseka kalula ngenxa yokuthuthukiswa kwamaphakheji we-ball grid array (BGA), amancane ngosayizi nokujiya futhi amakhulu ngenani lamaphini.Kodwa-ke, i-BGA crosstalk ithinta kakhulu ubuqotho besignali, ngaleyo ndlela ikhawulela ukusetshenziswa kwamaphakheji e-BGA.Ake sixoxe nge-BGA yokupakisha kanye ne-BGA crosstalk.
Amaphakheji we-Ball Grid Array
Iphakheji ye-BGA iyiphakheji yokukhweza ngaphezulu esebenzisa amabhola ensimbi amancane ukukhweza isekethe ehlanganisiwe.Lawa mabhola ensimbi akha igridi noma iphethini ye-matrix ehlelwa ngaphansi kwe-chip futhi ixhunywe ebhodini lesifunda eliphrintiwe.
Iphakheji yegridi yebhola (BGA).
Amadivayisi apakishwe kuma-BGA awanawo amaphinikhodi noma imikhondo kuma-periphery ye-chip.Esikhundleni salokho, uhlu lwegridi yebhola lubekwe phansi kwe-chip.Lawa maqembu afanayo egridi yebhola abizwa ngokuthi amabhola e-solder futhi asebenza njengezixhumi zephakheji ye-BGA.
Ama-Microprocessors, ama-WiFi chips, nama-FPGA avame ukusebenzisa amaphakheji e-BGA.Ku-chip yephakheji ye-BGA, amabhola e-solder avumela ukuthi okwamanje kugeleze phakathi kwe-PCB nephakheji.Lawa mabhola e-solder axhunywe ngokomzimba ku-semiconductor substrate ye-electronics.I-lead bonding noma i-flip-chip isetshenziselwa ukusungula uxhumano lukagesi ku-substrate bese iyafa.Ukuqondanisa kwe-conductive kutholakala ngaphakathi kwe-substrate evumela amasignali kagesi ukuthi adluliselwe kusukela lapho kuhlangana khona i-chip ne-substrate kuya enhlanganweni ephakathi kwe-substrate ne-ball grid array.
Iphakheji ye-BGA isabalalisa imikhondo yokuxhuma ngaphansi kwephethini ye-matrix.Lolu hlelo luhlinzeka ngenombolo enkulu yokuhola kuphakheji ye-BGA kunamaphakheji ayisicaba kanye nemigqa emibili.Ephaketheni eliholayo, izikhonkwane zihlelwe emingceleni.iphinikhodi ngayinye yephakheji ye-BGA iphethe ibhola le-solder, elitholakala endaweni engezansi ye-chip.Lokhu kulungiselelwa endaweni engezansi kunikeza indawo eyengeziwe, okuholela kumaphini amaningi, ukuvinjelwa okuncane, nezikhindi ezimbalwa zokuhola.Ephaketheni le-BGA, amabhola e-solder aqondaniswe kude kakhulu kunasephaketheni elinomkhondo.
Izinzuzo BGA amaphakheji
Iphakheji ye-BGA inobukhulu obuhlangene kanye nokuminyana kwamaphini aphezulu.iphakheji ye-BGA ine-inductance ephansi, evumela ukusetshenziswa kwama-voltages aphansi.Uhlu lwegridi yebhola luhlukaniswe kahle, okwenza kube lula ukuqondanisa i-chip ye-BGA ne-PCB.
Ezinye izinzuzo zephakheji ye-BGA yilezi:
- Ukushisa okuhle kokushisa ngenxa yokumelana okuphansi kokushisa kwephakheji.
- Ubude bokuhola kumaphakheji we-BGA bufushane kunamaphakheji anomkhondo.Inombolo ephezulu yokuhola ehlanganiswe nosayizi omncane yenza iphakheji ye-BGA iqhube kakhulu, ngaleyo ndlela ithuthukise ukusebenza.
- Amaphakheji e-BGA anikeza ukusebenza okuphezulu ngesivinini esiphezulu uma kuqhathaniswa namaphakheji ayisicaba kanye namaphakheji angaphakathi komugqa.
- Isivinini kanye nesivuno sokukhiqiza kwe-PCB siyenyuka uma usebenzisa amadivaysi apakishwe nge-BGA.Inqubo ye-solder iba lula futhi ilula, futhi amaphakheji e-BGA angenziwa kabusha kalula.
I-BGA Crosstalk
Amaphakheji e-BGA anezithiyo ezithile: amabhola e-solder awakwazi ukugoba, ukuhlola kunzima ngenxa yokuminyana okuphezulu kwephakheji, nokukhiqizwa kwevolumu ephezulu kudinga ukusetshenziswa kwemishini yokudambisa ebizayo.
Ukuze kuncishiswe i-BGA crosstalk, ukuhlelwa kwe-BGA ye-low-crosstalk kubalulekile.
Amaphakheji we-BGA avame ukusetshenziswa enanini elikhulu lamadivayisi we-I/O.Amasignali adluliswayo futhi atholwe yi-chip edidiyelwe kuphakheji ye-BGA ingaphazanyiswa ukuhlanganisa amandla esignali ukusuka komunye umthofu kuya komunye.I-crosstalk yesignali ebangelwa ukuqondanisa nokungahambi kahle kwamabhola e-solder kuphakheji ye-BGA ibizwa ngokuthi i-BGA crosstalk.I-inductance enomkhawulo phakathi kwamalungu afanayo egridi yebhola ingenye yezimbangela zemiphumela ye-crosstalk kumaphakheji e-BGA.Lapho ama-transient amanje e-I/O aphezulu (amasiginali okungena) kwenzeka kumkhondo wephakheji ye-BGA, inductance enomkhawulo phakathi kwamalungu afanayo egridi yebhola ehambisana nesignali nezikhonkwane zokubuyisela kudala ukuphazamiseka kwe-voltage ku-chip substrate.Lokhu kuphazamiseka kwe-voltage kubangela ukuphazamiseka kwesignali edluliselwa ngaphandle kwephakheji ye-BGA njengomsindo, okuholela kumphumela we-crosstalk.
Kuzinhlelo zokusebenza ezifana namasistimu okuxhumana anama-PCB awugqinsi asebenzisa izimbobo, i-BGA crosstalk ingaba yinto evamile uma zingekho izinyathelo ezithathwayo ukuvikela izimbobo.Kumasekhethi anjalo, izimbobo ezinde ezibekwe ngaphansi kwe-BGA zingabangela ukuhlangana okubalulekile futhi kudale ukuphazamiseka okuphawulekayo kwe-crosstalk.
I-BGA crosstalk incike endaweni yesiginali yesigebengu kanye nesignali yesisulu kuhlu lwegridi yebhola.Ukuze unciphise i-BGA crosstalk, ukuhlelwa kwephakheji ye-BGA ye-low-crosstalk kubalulekile.Ngesofthiwe ye-Cadence Allegro Package Designer Plus, abaklami bangakwazi ukuthuthukisa imiklamo eyinkimbinkimbi ye-single-die kanye ne-multi-die wirebond kanye ne-flip-chip;i-radial, i-engeli egcwele yokucindezela ukuze kubhekwane nezinselele eziyingqayizivele zomzila zemiklamo ye-substrate ye-BGA/LGA.kanye ne-DRC/DFA ethize ihlola umzila onembe kakhudlwana futhi osebenza kahle.Ukuhlolwa okuqondile kwe-DRC/DFM/DFA kuqinisekisa ukuthi imiklamo ye-BGA/LGA iphumelele ngokudlula okukodwa.ukukhishwa okunemininingwane yokuxhumana, ukumodela kwephakheji ye-3D, nobuqotho besignali nokuhlaziya okushisayo okuhambisana nokunikezwa kwamandla nakho kuhlinzekiwe.
Isikhathi sokuthumela: Mar-28-2023