Yiziphi Izixazululo Zebhodi Lokugoba le-PCB kanye Nebhodi Le-Warping?

reflow ovenI-NeoDen IN6

1. Yehlisa izinga lokushisareflow ovennoma ulungise izinga lokushisa nokupholisa kwepuleti ngesikhathireflow soldering umshiniukunciphisa ukwenzeka kokugoba kwepuleti nokuwa;

2. Ipuleti eline-TG ephakeme lingakwazi ukumelana nezinga lokushisa eliphakeme, likhulise ikhono lokumelana nokuguqulwa kwengcindezi okubangelwa izinga lokushisa eliphezulu, futhi uma kuqhathaniswa, izindleko zezinto ezibonakalayo zizokhula;

3. Khulisa ukushuba kwebhodi, lokhu kusebenza kuphela kumkhiqizo ngokwawo akudingi ukushuba kwemikhiqizo yebhodi le-PCB, imikhiqizo engasindi ingasebenzisa ezinye izindlela kuphela;

4. Yehlisa inani lamabhodi futhi unciphise ubukhulu bebhodi lesifunda, ngoba ibhodi elikhulu, ubukhulu obukhulu, ibhodi ekugelezeni kwendawo ngemuva kokushisa okuphezulu, ukucindezela kwendawo kuhlukile, kuthinteke isisindo salo, kulula. ukubangela ukuwohloka kokucindezeleka kwendawo phakathi;

5. I-tray fixture isetshenziselwa ukunciphisa ukuguqulwa kwebhodi lesifunda.Ibhodi lesifunda liyapholiswa futhi linciphe ngemva kokunwetshwa kwezinga lokushisa eliphezulu ngokushisela kabusha.I-tray fixture ingazinzisa ibhodi lesifunda, kodwa isihlungi sethreyi sibiza kakhulu, futhi sidinga ukukhuphula ukubekwa okwenziwa ngesandla kwethreyi.


Isikhathi sokuthumela: Sep-01-2021

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