Umshini wokukhetha nokubeka i-SMTibhekisela kusifinyezo sochungechunge lwezinqubo zobuchwepheshe ngesisekelo se-PCB.I-PCB isho Ibhodi Lesekethe Eliphrintiwe.
I-Surface Mounted Technology iyiTekhnoloji nenqubo ethandwa kakhulu embonini yokuhlanganisa i-elekthronikhi njengamanje.I-Printed Circuit Board iwubuchwepheshe bokuhlanganiswa Kwesifunda lapho izingxenye zokuhlanganisa ngaphandle kwezikhonkwane noma imikhondo emifushane zifakwa phezu kwamabhodi Esifunda Aphrintiwe noma amanye ama-substrates futhi ahlanganiswe ndawonye ngokushiselwa kabusha, ukushisela idiphu, njll.
Ngokuvamile, imikhiqizo ye-elekthronikhi esiyisebenzisayo yenziwe nge-PCB kanye nezinhlobonhlobo zama-capacitor, ama-resistors nezinye izakhi ze-elekthronikhi ngokuya ngomklamo womdwebo wesifunda, ngakho zonke izinhlobo zezinto zikagesi zidinga ubuchwepheshe obuhlukahlukene bokucubungula i-SMT ukuze bucutshungulwe.
Izakhi zenqubo eziyisisekelo ze-SMT: ukuphrinta kokunamathisela kwe-solder -> Ukukhweza kwe-SMT ->reflow oven->I-AOIimishiniukuhlolwa kwe-optical -> ukugcinwa -> ibhodi.
Ngenxa yenqubo yobuchwepheshe yokucutshungulwa kwe-SMT okuyinkimbinkimbi, ngakho-ke kunezimboni eziningi zokucubungula i-SMT, ikhwalithi ye-SMT iye yathuthukiswa, futhi inqubo ye-SMT, sonke isixhumanisi sibalulekile, asinakuba nephutha, namuhla ukwakheka okuncane wonke umuntu ehlangene afunde ukugeleza kabusha kwe-SMT. Umshini wokushisela wethulwa kanye nobuchwepheshe obubalulekile ekucubunguleni.
Imishini ye-Reflow soldering iyisisetshenziswa esibalulekile kwinqubo yomhlangano we-SMT.Izinga le-PCBA solder joint lincike ngokuphelele ekusebenzeni kwemishini yokuphinda kufakwe i-solder kanye nokusetha ijika lokushisa.
Ubuchwepheshe be-reflow welding sebubone ukuthuthukiswa kokushisisa kwe-plate radiation, ukushisa kweshubhu ye-quartz infrared, ukufudumeza komoya oshisayo we-infrared, ukufudumeza komoya oshisayo okuphoqelelwe, ukushisa komoya oshisayo okuphoqelekile nokuvikelwa kwe-nitrogen nezinye izinhlobo.
Izidingo ezandisiwe zenqubo yokupholisa ye-reflow soldering nazo zikhuthaze ukuthuthukiswa kwezindawo zokupholisa zemishini yokudambisa i-reflow, kusukela ekupholiseni kwemvelo kanye nokupholisa komoya endaweni yezinga lokushisa kuya kumasistimu okupholisa amanzi aklanyelwe ukusoda ngaphandle komthofu.
I-Reflow soldering imishini ngenxa yenqubo yokukhiqiza yokunemba kokulawula izinga lokushisa, ukufana kwezinga lokushisa endaweni yokushisa, isivinini sokudlulisa nezinye izidingo.Futhi ithuthukiswe kusuka endaweni yokushisa emithathu yendawo yokushisa emihlanu, indawo yokushisa eyisithupha, indawo yokushisa eyisikhombisa, indawo yokushisa eyisishiyagalombili, indawo yokushisa eyishumi nezinye izinhlelo zokushisela.
Imingcele eyinhloko yemishini yokuphinda i-solder
1. Inombolo, ubude nobubanzi bendawo yokushisa;
2. I-Symmetry yama-heaters aphezulu naphansi;
3. Ukufana kokusabalalisa izinga lokushisa endaweni yokushisa;
4. Ukuzimela kokulawulwa kwejubane lokudlulisa izinga lokushisa;
I-5, umsebenzi we-welding we-inert wokuvikela igesi;
6. Ukulawula i-gradient yokwehla kwezinga lokushisa lendawo yokupholisa;
7. Ukushisa okuphezulu kwe-reflow welding heater;
8. Ukunemba kokulawula izinga lokushisa kwe-reflow soldering heater;
Isikhathi sokuthumela: Jun-10-2021