Leli phepha libala amagama athile ajwayelekile ochwepheshe kanye nezincazelo zokucutshungulwa komugqa wokuhlanganisaUmshini we-SMT.
1. PCBA
I-Printed Circuit Board Assembly (PCBA) ibhekisela kunqubo lapho amabhodi e-PCB acutshungulwa futhi enziwe, okuhlanganisa imicu Ephrintiwe ye-SMT, ama-plugin e-DIP, ukuhlola okusebenzayo, kanye Nokuhlanganiswa komkhiqizo oqediwe.
2. Ibhodi le-PCB
I-Printed Circuit Board (PCB) iyisikhathi esifushane sebhodi lesifunda Eliphrintiwe, elivame ukuhlukaniswa libe iphaneli eyodwa, iphaneli ekabili kanye nebhodi elinezingqimba eziningi.Izinto ezisetshenziswa kakhulu zifaka i-FR-4, i-resin, indwangu ye-fiber yengilazi kanye ne-aluminium substrate.
3. Amafayela e-Gerber
Ifayela le-Gerber lichaza ngokuyinhloko ukuqoqwa kwefomethi yedokhumenti yesithombe se-PCB (ungqimba lomugqa, ungqimba lokumelana ne-solder, ungqimba lomlingiswa, njll.) idatha yokumba neyokugaya, okudingeka ihlinzekwe ku-PCBA processing plant lapho ikhotheshini ye-PCBA yenziwa.
4. Ifayela le-BOM
Ifayela le-BOM liwuhlu lwezinto.Zonke izinto ezisetshenziswa ekucubunguleni i-PCBA, okuhlanganisa nenani lezinto zokwakha kanye nomzila wenqubo, ziyisisekelo esibalulekile sokuthengwa kwezinto ezibonakalayo.Uma i-PCBA icashuniwe, idinga futhi ukuhlinzekwa endaweni yokucubungula ye-PCBA.
5. I-SMT
I-SMT isifinyezo se-“Surface Mounted Technology”, esisho inqubo yokuphrinta i-solder paste, ukufakwa kwezingxenye zeshidi kanyereflow oveni-soldering ebhodini le-PCB.
6. Iphrinta yokunamathisela ye-solder
Ukuphrinta kwe-solder paste kuyinqubo yokubeka i-solder paste enetha lensimbi, ukuvuza unamathisele we-solder ngembobo yenethi yensimbi nge-scraper, futhi uphrinte ngokunembile unamathisele we-solder kuphedi ye-PCB.
7. SPI
I-SPI ingumtshina we-solder unama ukujiya.Ngemuva kokuphrinta kwe-solder paste, ukutholwa kwe-SIP kuyadingeka ukuze kutholwe isimo sokuphrinta sokunamathisela kwe-solder nokulawula umphumela wokuphrinta we-solder paste.
8. Reflow welding
I-Reflow soldering ukufaka i-PCB enamathiselwe emshinini we-reflow solder, futhi ngokushisa okuphezulu ngaphakathi, ukunamathisela kwe-solder yokunamathisela kuzoshiswa kube uketshezi, futhi ekugcineni ukushisela kuzoqedwa ngokupholisa nokuqiniswa.
9. AOI
I-AOI isho ukutholwa okuzenzakalelayo.Ngokuqhathanisa ukuskena, umphumela wokushisela webhodi le-PCB ungatholwa, futhi amaphutha ebhodi le-PCB angatholwa.
10. Ukulungisa
Isenzo sokulungisa i-AOI noma amabhodi abonakale engasebenzi.
11. DIP
I-DIP imfushane yokuthi “Iphakheji Elingaphakathi Komugqa Elibili”, elibhekisela kubuchwepheshe bokucubungula bokufaka izingxenye ezinamaphinikhodi ebhodini le-PCB, bese lizicubungula ngokusebenzisa i-wave soldering, ukusika izinyawo, i-post soldering, nokugeza amapuleti.
12. I-Wave soldering
I-Wave soldering iwukufaka i-PCB esithandweni sokushisa samagagasi, ngemva kokushintshashintsha kwesifutho, ukushisa kuqala, ukusoda kwegagasi, ukupholisa nezinye izixhumanisi ukuqedela ukushisela kwebhodi le-PCB.
13. Sika izingxenye
Sika izingxenye ebhodini le-PCB elishiselwe usayizi ofanele.
14. Ngemuva kokucubungula i-welding
Ngemuva kokucubungula ukushisela ukulungisa ukushisela nokulungisa i-PCB engashiselwe ngokugcwele ngemva kokuhlolwa.
15. Ukugeza amapuleti
Ibhodi yokuwasha iwukuhlanza izinto eziyingozi ezisele ezifana nokugeleza emikhiqizweni eqediwe ye-PCBA ukuze kuhlangatshezwane nenhlanzeko evamile yokuvikela imvelo edingwa amakhasimende.
16. Ukufafaza ama-anti paint
Ukufafaza kwe-anti kapende okuthathu ukufafaza ungqimba lwe-coating ekhethekile ebhodini lezindleko ze-PCBA.Ngemva kokwelapha, ingadlala ukusebenza kokufakwa kwe-insulation, ubufakazi bomswakama, ubufakazi bokuvuza, ubufakazi bokushaqeka, ukuvikela uthuli, i-corrosion proof, ubufakazi bokuguga, i-mildew proof, izingxenye ezixekethile kanye nokumelana ne-corrosion.Inganweba isikhathi sokugcina se-PCBA futhi ihlukanise ukuguguleka kwangaphandle nokungcola.
17. I-Welding Plate
Ukuphenduka i-PCB surface yasendaweni enwetshiwe imikhondo, ayikho isembozo sikapende wokufakelwa, engasetshenziselwa izinto zokushisela.
18. Encapsulation
Ukupakisha kubhekisela endleleni yokupakisha yezingxenye, ukupakishwa kuhlukaniswe ikakhulukazi i-DIP kabili - umugqa kanye ne-SMD patch packaging ezimbili.
19. Isikhala sephini
Isikhala sephinikhodi sibhekisela ebangeni eliphakathi kwemigqa emaphakathi yamaphinikhodi asondelene wengxenye yokukhweza.
20. QFP
I-QFP imfushane ye-“Quad Flat Pack”, okusho ukuthi isekethe ehlanganisiwe ehlanganiswe phezulu ephaketheni lepulasitiki elincanyana eline-airfoil emfushane ezinhlangothini ezine.
Isikhathi sokuthumela: Jul-09-2021