Ekukhiqizeni i-PCBAUmshini we-SMT, ukuqhekeka kwezingxenye ze-chip kuvamile ku-multilayer chip capacitor (MLCC), okubangelwa ikakhulukazi ukucindezeleka okushisayo nokucindezeleka kwemishini.
1. ISAKHIWO sama-capacitor e-MLCC sintekenteke kakhulu.Ngokuvamile, i-MLCC yenziwe ngama-capacitor e-ceramic anezendlalelo eziningi, ngakho inamandla aphansi futhi kulula ukuthintwa ukushisa namandla emishini, ikakhulukazi ekufakweni kwe-wave soldering.
2. Ngesikhathi senqubo ye-SMT, ukuphakama kwe-axis ka-zumshini wokukhetha nokubekakunqunywa ubukhulu bezingxenye ze-chip, hhayi inzwa yokucindezela, ikakhulukazi kweminye yemishini ye-SMT engenawo umsebenzi wokufika othambile we-z-axis, ngakho-ke ukuqhekeka kubangelwa ukubekezelelana kokuqina kwezingxenye.
3. Ukucindezeleka kwe-Buckling ye-PCB, ikakhulukazi ngemva kokushisela, kungenzeka kubangele ukuqhekeka kwezingxenye.
4. Ezinye izingxenye ze-PCB zingalimala uma zihlukaniswa.
Izinyathelo zokuvimbela:
Lungisa ngokucophelela ijika lenqubo yokushisela, ikakhulukazi izinga lokushisa lendawo yokushisa akumele libe liphansi kakhulu;
Ukuphakama kwe-z-axis kufanele kulungiswe ngokucophelela emshinini we-SMT;
Ukuma komsiki we-jigsaw;
Ukugoba kwe-PCB, ikakhulukazi ngemuva kokushisela, kufanele kulungiswe ngokufanele.Uma izinga le-PCB liyinkinga, kufanele licatshangelwe.
Isikhathi sokuthumela: Aug-19-2021