I. Incazelo yangemuva
Umshini we-Wave solderingi-welding isebenzisa i-solder encibilikisiwe ezingxenyeni zezikhonkwane zokusetshenziswa kwe-solder kanye nokufudumeza, ngenxa yokunyakaza okuhlobene kwegagasi ne-PCB kanye ne-solder encibilikisiwe "okunamathelayo", inqubo ye-wave soldering iyinkimbinkimbi kakhulu kune-reflow soldering, ukuze ifakwe iphakheji. ukuhlukaniswa kwephini, ubude bokuphuma, usayizi wephedi kuyadingeka, ku-PCB Ukuhlelwa kwesiqondiso sebhodi, isikhala, kanye nokufakwa komugqa wembobo nakho kunezidingo, ngamafuphi, inqubo ye-wave soldering impofu, idinga, i-welding isivuno ngokuyisisekelo incike design.
II.Izidingo zokupakisha
1. elungele indawo yokubeka i-wave soldering kufanele ibe nesiphetho se-solder noma isiphetho somthofu sibe sobala;Umzimba wephakheji ovela endaweni evulekile (Yima) <0.15mm;Ubude <4mm izidingo eziyisisekelo.Hlangana nalezi zimo zezingxenye zokubeka zihlanganisa:
0603~1206 ububanzi bephakheji bephakheji lezingxenye eziphikisana ne-chip.
I-SOP enebanga eliphakathi nendawo eliholayo ≥1.0mm nobude obungu-<4mm.
Ama-chip inductors anobude ≤ 4mm.
Ama-coil chip inductors angavezwanga (okungukuthi C, uhlobo lwe-M)
2. ifanele ukusongeshwa kwamagagasi ezingxenyeni zekhatriji yezinyawo eziminyene ibanga elincane phakathi kwezikhonkwane eziseduze ≥ 1.75mm iphakheji.
III.Isiqondiso sokudlulisa
Ngaphambi kwesakhiwo sengxenye ye-wave soldering surface, eyokuqala kufanele inqume i-PCB phezu kwendlela yokudlulisa isithando somlilo, iwukuhlelwa kwezingxenye zekhathriji “inqubo yesilinganiso”.Ngakho-ke, ngaphambi kwe-wave soldering surface components layout, eyokuqala kufanele inqume isiqondiso sokudluliswa.
1. Ngokuvamile, uhlangothi olude kufanele lube isiqondiso sokudlulisela.
2. Uma ukwakheka kunesixhumi sekhatriji yezinyawo eziseduze (iphimbo <2.54mm), isiqondiso sesakhiwo sesixhumi kufanele sibe isiqondiso sokudlulisa.
3. endaweni ye-wave soldering surface, kufanele ihlolwe ngosilika noma ifoyili yethusi eqoshiwe emaka isiqondiso sokudluliswa, ukuze kubonakale lapho i-welding.
IV.Isiqondiso sesakhiwo
Isiqondiso sesakhiwo sezingxenye ikakhulukazi sihilela izingxenye ze-chip nezixhumi zamaphini amaningi.
1. isiqondiso eside sephakheji yedivayisi ye-SOP kufanele ihambisane nesakhiwo sesiqondiso sokudlulisa i-wave soldering, isiqondiso eside sezingxenye ze-chip, kufanele ihambisane nesiqondiso sokudlulisa i-wave soldering.
2. Izingxenye eziningi ze-cartridge yamaphini amabili, isiqondiso somugqa we-jack centre kufanele sibe perpendicular isiqondiso sokudlulisa, ukuze kuncishiswe isenzakalo sokuphela kwesinye sengxenye entantayo.
V. Izidingo zesikhala
Ezingxenyeni ze-SMD, ukuhlukaniswa kwephedi kubhekisela esikhaleni phakathi kwezici zokufinyelela eziphezulu zamaphakheji aseduze (kuhlanganise namaphedi);ezingxenyeni ze-cartridge, isikhala sephedi sibhekisela esikhaleni phakathi kwamaphedi e-solder.
Ezingxenyeni ze-SMD, isikhala sephedi asiveli ngokuphelele ezicini zokuxhumanisa ibhuloho, okuhlanganisa umphumela wokuvinjwa komzimba wephakheji kungase kubangele ukuvuza kwe-solder.
1. Izikhawu zephedi yezingxenye zekhatriji kufanele ngokuvamile zibe ≥ 1.00mm.ukuze uthole izixhumi zekhatriji ye-pitch emihle, vumela ukuncishiswa okufanele, kodwa ubuncane akumele bube ngu-<0.60mm.
2. Amaphedi engxenye ye-cartridge kanye namaphedi engxenye ye-SMD ahlanganisa amaza kufanele abe ≥ 1.25mm isikhawu.
VI.Izidingo ezikhethekile zokuklama iphedi
1. ukuze kuncishiswe ukuvuza kwe-solder, ku-0805/0603, SOT, SOP, tantalum capacitor pads, kunconywa ukuthi umklamo uhambisane nezidingo ezilandelayo.
Ezingxenyeni ze-0805/0603, ngokuvumelana ne-IPC-7351 enconyiwe idizayini (i-pad flare 0.2mm, ububanzi buncishiswe ngo-30%).
Kuma-SOT nama-tantalum capacitor, amaphedi kufanele anwetshwe ngaphandle ngo-0.3mm uma kuqhathaniswa namaphedi aklanywe ngokujwayelekile.
2. for metalized hole plate, amandla solder ngokuhlanganyela ngokuyinhloko incike uxhumano imbobo, pad ring ububanzi ≥ 0.25mm kungaba.
3. Ngepuleti lembobo engeyona eyensimbi (iphaneli elilodwa), amandla okuhlangana kwe-solder anqunywa usayizi wephedi, ububanzi bephedi jikelele kufanele bube ≥ izikhathi ezingu-2.5 ububanzi bembobo.
4. yephakheji ye-SOP, kufanele yakhelwe ekugcineni kwezikhonkwane ezithayini ezintshontsha ama-tin pads, uma i-SOP pitch inkulu ngokuqhathaniswa, idizayini ye-tin pad yokweba nayo ingaba nkulu.
5. ngezixhumi zamaphini amaningi, kufanele zakhelwe ekugcineni kwe-off-tin yamaphedi ethini antshontshiwe.
VII.Ubude bokuhola
1. ubude be-lead out bokwakheka kwebhuloho bunobudlelwano obukhulu, lapho isikhala sephini sincane, kuba mkhulu umthelela wezincomo ezijwayelekile:
Uma ukuphakama kwephini kuphakathi kuka-2~2.54mm, ubude besandiso sokuhola kufanele bulawuleke ku-0.8~1.3mm
Uma ukuphakama kwephinikhodi ku-<2mm, ubude besandiso sokuhola kufanele bulawuleke ku-0.5~1.0mm
2. ubude be-lead out kuphela ekuqondeni kwesakhiwo ukuze kuhlangatshezwane nezidingo zezimo ze-wave soldering zingadlala indima, ngaphandle kwalokho ukuqedwa komphumela wokuxhuma kwebhuloho akubonakali.
VIII.ukusetshenziswa koyinki wokumelana ne-solder
1. sivamise ukubona indawo yehluzo yephedi yesixhumi ephrintwe ngemifanekiso kayinki, idizayini enjalo ngokuvamile ibhekwa njengokunciphisa ukwenzeka kwebhuloho.Indlela engase ibe ungqimba lukayinki olungaphezulu olumaholoholo, kulula ukukhangisa ukuguquguquka okwengeziwe, i-flux ehlangene nezinga lokushisa eliphakeme lokuncibilika kwe-solder encibilikisiwe kanye nokwakheka kwamabhamuza okuzihlukanisa, ngaleyo ndlela kunciphisa ukuvela kwebhuloho.
2. Uma ibanga eliphakathi kwamaphinikhodi angu-1.0mm, ungakwazi ukuklama isendlalelo sikayinki esimelana ne-solder ngaphandle kwamaphedi ukuze unciphise amathuba okuba ibhuloho, okuqeda ikakhulukazi amaphedi aminyene phakathi maphakathi nebhuloho elihlangene le-solder, kanye nokwebiwa kwethayela. pads ikakhulukazi ukuqeda aminyene pad iqembu wokugcina desoldering ekupheleni solder joint ibhuloho imisebenzi yabo ehlukene.Ngakho-ke, ngoba isikhala pin kuyinto pads kuqhathaniswa ezincane aminyene, solder ukumelana inki kanye ukweba solder pad kufanele kusetshenziswe ndawonye.
Isikhathi sokuthumela: Dec-14-2021