Ukucutshungulwa kwe-SMD kuqala kudinga ukuklebhula ungqimba lwe-solder pad phezu kwe-pcb pad, ukuphrinta kwe-solder paste kudinga ukwenziwa ngemuva kwekhwalithi yokuhlolwa, hlola igama lomshini ubizwa nge-spi (umshini wokuhlola we-solder paste), oyinhloko. ukuhlolwa kokuphrinta kokunamathisela kwe-solder ukuthi kukhona yini i-offset, donsa ithiphu, ubukhulu kanye nokuqina, njll., ngoba izinga lokuphrinta lokunamathisela le-solder lithinta ngqo ikhwalithi yekhwalithi ye-weld ngemuva, imboni yeld the reason for poor ngaphezu kwe-60% yezinkinga ukuphrinta kwe-solder paste!Kubangelwa ezingaphezu kuka-60% izimbangela soldering abampofu embonini iyona solder unama izinkinga zokunyathelisa, okwanele ukufakazela ukuthi kubaluleke kangakanani solder unama ukuphrinta ukuhlolwa.
Incazelo ye-SPI ngesilinganiso
I-Solder Paste Printing Inspection (SPI) kanye nokuhlola kwe-AOI kunesilinganiso esiqondile, isilinganiso esiqondile esivela egameni singaqondwa kahle, ngokuqondile ngokusebenzisa amathuba, kungase futhi kube izinga lokuphumelela, ukuphakama kwesilinganiso esiqondile, ukukhiqiza okuphezulu. kanye namandla okukhiqiza, uma izinga eliqondile liphansi, kusho ukuthi inqubo ayisebenzi, okuthinta amandla okusebenza kahle.
Ukubaluleka kokulawula isilinganiso esiqondile
Izinga eliqondile libuye libonise izinga lokuphumelela, izinga eliphezulu eliqondile ngokusebenzisa izinga, izinga lobuchwepheshe bokukhiqiza liphakeme, amathuba okudlula okuqondile, futhi akubiki njalo okubi noma okungalungile, isilinganiso esiqondile siphezulu, ukukhiqiza okuphezulu, umthamo ophezulu, ngqo ngokusebenzisa izinga liphansi, ukuntuleka kobuchwepheshe bokukhiqiza, futhi kuzothinta ukusebenza kahle kokukhiqiza kanye nezindleko zesikhathi, kodwa futhi ngokungaqondile kuholele ezindlekweni zabasebenzi abengeziwe, izindleko ezibonakalayo zokugcinwa.Ngakho-ke, ukulawulwa kwesilinganiso okuqondile kwemboni yokucubungula akumeli nje izinga lekhwalithi yokukhiqiza, kodwa futhi kuhlobene nokusebenza kahle kwefekthri.
Izinto ezithinta i-spi ngesilinganiso
I-Solder Namathisela
Uma i-liquidity ye-solder paste inkulu kakhulu, kulula ukubangela ukuthi i-solder paste iguqe futhi iwe ku-pad, okuholela ekuphrinteni okungalungile, sidinga ukusebenzisa i-solder paste ukuze sibuyele ngokugcwele ekushiseni nasekuvuseleleni.
Squeegee
Ingcindezi ye-Squeegee, isivinini, i-angle izothinta inani le-solder paste ephrintiwe ku-pcb pad (ubukhulu kanye nokuqina), uma ubukhulu bukhulu kakhulu noma buncane kakhulu, kuzodala isifunda esifushane noma i-solder engenalutho.
Usayizi wembobo ye-stencil kanye nokushelela kodonga lwembobo kuzothinta i-solder paste seepage, futhi uma udonga lwembobo ye-stencil lunezinwele, kuzoba lula futhi ukubangela izinsalela ze-solder paste.
Izici zomshini we-NeoDen SPI
Uhlelo lwesoftware:
Uhlelo lokusebenza: Windows 7 Ultimate 64bit
1) Uhlelo lokuhlonza:
Isici:Ikhamera ye-raster ye-3d(okuphindwe kabili kuyakhethwa)
Isixhumi esibonakalayo esisebenzayo: Uhlelo lwezithombe, kulula ukulusebenzisa, uhlelo lwesiShayina nesiNgisi luyashintsha
Isixhumi esibonakalayo: isithombe se-2D KANYE ne-3D truecolor
UMAMA: Ungakhetha iphoyinti eli-2 le-commom mark
2) Uhlelo: I-gerber yokusekela, okokufaka kwe-CAD, okungaxhunyiwe ku-inthanethi nohlelo lwemanuwali
3) SPC
I-SPC engaxhunyiwe ku-inthanethi: Ukusekela
Umbiko we-SPC: Umbiko wanoma yisiphi isikhathi
Control Graphic: Ivolumu, indawo, ukuphakama, offset
Thumela okuqukethwe: Excel, image(jpg,bmp)
Isikhathi sokuthumela: Aug-01-2023