Ukubaluleka Komshini Wokuhlola I-X-ray

I-X-ray:Igama eligcwele likaImishini yokuhlola i-X-ray, ukusetshenziswa kwe-X-ray yamandla aphansi, ukuthwebula isithombe sengaphakathi lomkhiqizo, ukuthola imifantu yangaphakathi, imizimba yangaphandle nokunye ukukhubazeka.Zikwenza kanjalo izibhedlela i-X-ray scan.

Ubuhlakani kanye ne-miniaturization yemikhiqizo ye-elekthronikhi yenza usayizi wama-chips ube mancane futhi abe mancane, kodwa amaphinikhodi ayanda, ikakhulukazi inani elikhulu lezinhlelo zokusebenza zezingxenye ze-BGA ne-IC kwezinye izikhungo.Ngenxa yemininingwane yokupakishwa, isimo sokushisela sangaphakathi se-chip singatholwa kuphela ngemishini, futhi ukutholwa kwesistimu yombono wokwenziwa kobuhlakani bokwenziwa akukwazi ukuhlonza ngokuyisisekelo ikhwalithi yamalunga e-solder.Ukuhlola okubonakalayo okwenziwayo kuyindlela enembe kancane futhi ekwazi ukukhiqizwa kabusha uma kuhlangene amajoyinti aminyene, futhi indlela engcono kakhulu yokuhlola iqoqo le-X-ray.

Ama-oda aphuthumayo, ukuqinisekisa okusheshayo kudinga imishini eyengeziwe ukuze kutholwe.Ubuchwepheshe bokuthola i-X-ray busetshenziswa kabanzi ekuhlolweni kwekhwalithi yokushisela ngemuva kwe-BGAreflow ovenwelding, qualitative and quantitative risk analysis of solder joints, izinga elingavamile elitholiwe, ukulungiswa okufika ngesikhathi.Ngokusho kwesifinyezo nokuhlaziywa kwamacala okusebenza kwethiyori, ukunemba kokuhlolwa kwe-X-ray ngaphakathi kwamajoyinti e-solder e-BGA kungadlula i-15% yokutholwa kwe-ICT manual, kanti ukusebenza kahle kungaphezu kuka-50%.

Esigabeni sohlelo lokusebenza, okokusebenza akukwazi ukukhomba kuphela amaphutha okushisela ku-BGA (njengokushisela okungenalutho, ukushisela okubonakalayo), kodwa futhi kungaskena futhi kuhlaziye amasistimu e-microelectronic nezinto zokuvala, izintambo, izinto ezilungiswayo, ingaphakathi lepulasitiki, njll.

Umshini wokuhlola i-NeoDen X-Ray

Ukucaciswa komthombo we-X-Ray Tube:

Thayipha I-Micro-Focus X-Ray Tube Evaliwe

I-voltage Range 40-90KV

Ububanzi bamanje 10-200 μA

Amandla Okukhipha Okuphezulu 8 W

I-Micro Focus Spot Usayizi 15μm

Ukucaciswa komtshina wephaneli eyisicaba:

Thayipha i-TFT Industrial Dynamic FPD

I-Pixel Matrix 768×768

Inkambu yokubuka 65mm×65mm

Ukulungiswa 5.8Lp/mm

Uhlaka (1×1) 40fps

I-A/D Conversion Bit 16bits

Ubukhulu: L850mm×W1000mm×H1700mm

Amandla Okokufaka: 220V 10A/110V 15A 50-60HZ

Ubukhulu Isampula Usayizi: 280mm×320mm

Control System Industrial PC WIN7/ WIN10 64bits

Isisindo Esiphelele Mayelana: 750KG