Umgomo Oyisisekelo we-BGA Rework Station

Isiteshi sokusebenza kabusha se-BGAiyimishini yobungcweti esetshenziselwa ukulungisa izingxenye ze-BGA, evame ukusetshenziswa embonini ye-SMT.Okulandelayo, sizokwethula isimiso esiyisisekelo sesiteshi sokusebenza kabusha se-BGA futhi sihlaziye izici ezibalulekile zokuthuthukisa izinga lokulungisa le-BGA.

Isiteshi sokusebenza kabusha se-BGA singahlukaniswa sibe ithebula lokulungisa le-optical counterpoint kanye netafula lokulungisa le-non-optical counterpoint.I-Optical counterpoint ibhekisela ekuqondaneni kwe-optics ngesikhathi sokushisela, okungaqinisekisa ukunemba kokulungiswa kwe-welding futhi kuthuthukise izinga lokuphumelela lokushisela.I-non-optical counterpoint, eyenziwa ngokubonakalayo, ayinembile kakhulu uma i-welding.

Njengamanje, izindlela zokushisa eziyinhloko ze-BGA rework station zifaka i-infrared egcwele, umoya oshisayo ogcwele nomoya oshisayo oshisayo kanye ne-infrared eyodwa.Izindlela zokushisa ezihlukene zinezinzuzo ezahlukene kanye nokubi.Indlela yokushisisa ejwayelekile yesiteshi sokusebenza kabusha se-BGA e-China imvamisa umoya oshisayo ezindaweni ezingaphezulu neziphansi kanye nokushisa kwe-infrared ngezansi, okubizwa ngakho ngendawo yokushisa emithathu.Amakhanda okushisa aphezulu naphansi ashiswa ngocingo lokushisisa futhi umoya oshisayo uthunyelwa ngaphandle ngokugeleza komoya.Ukushisa kwangaphambi kwesikhathi kwangaphansi kungahlukaniswa kube ishubhu yokushisisa yangaphandle emnyama emnyama, ipuleti lokushisisa le-infrared kanye nepuleti lokushisisa legagasi lokukhanya kwe-infrared.

1. Ukushisa phezulu naphansi ukukhanya

Ngokusebenzisa ukushisa kwentambo yokushisa, umoya oshisayo uzodluliselwa ezingxenyeni ze-BGA ngokusebenzisa i-nozzle yomoya, ukufeza inhloso yokushisa izingxenye ze-BGA, futhi ngokusebenzisa umoya oshisayo oshisayo ophezulu naphansi, ungavimbela ibhodi lesifunda ukungalingani kokushisa.

2. Ukushisa okungaphansi kwe-infrared

Ukushisa kwe-infrared ikakhulukazi kudlala indima yokushisa kuqala, ukususa umswakama ebhodini lesifunda kanye ne-BGA, futhi kunganciphisa ngempumelelo umehluko wokushisa phakathi kwesikhungo sokushisa nendawo ezungezile, kunciphise amathuba okuguqulwa kwebhodi lesifunda.

3. Ukusekelwa kanye nokulungiswa kwesiteshi sokusebenza kabusha se-BGA

Le ngxenye ngokuyinhloko isekela futhi ilungise ibhodi lesifunda futhi idlala indima ebalulekile ekuvimbeleni ukuguqulwa kwebhodi.

4. Ukulawula izinga lokushisa

Lapho udiliza futhi ushisela i-BGA, kunesidingo esibalulekile sokushisa.Uma izinga lokushisa liphezulu kakhulu, kulula ukushisa izingxenye ze-BGA.Ngakho-ke, itafula lokulungisa ngokuvamile lilawulwa ngaphandle kwethuluzi, kodwa lamukela ukulawula kwe-PLC nokulawula okugcwele kwekhompyutha, okungalawula izinga lokushisa ngesikhathi sangempela.

Lapho ulungisa i-BGA ngesiteshi sokusebenza kabusha, ngokuyinhloko ukulawula izinga lokushisa lokushisa nokuvimbela ukuguqulwa kwebhodi lesifunda.Kuphela ngokwenza lezi zingxenye ezimbili kahle izinga lokuphumelela lokulungisa i-BGA lingathuthukiswa ngempela.

Umugqa wokukhiqiza we-SMT

I-Zhejiang NeoDen Technology Co., Ltd. ibikhiqiza futhi ithumela kwamanye amazwe amancane ahlukahlukeneukukhetha nokubeka imishinikusukela ngo-2010. Sisebenzisa i-R&D yethu ecebile enesipiliyoni, ukukhiqizwa okuqeqeshwe kahle, i-NeoDen izuza idumela elihle kumakhasimende omhlaba wonke.

① Imikhiqizo ye-NeoDen: Umshini we-Smart series PNP, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, i-reflow oven IN6, IN12, Iphrinta yokunamathisela ye-Solder FP26406, 3 PM

② Ifakwe ohlwini lwe-CE futhi yathola amalungelo obunikazi angu-50+


Isikhathi sokuthumela: Oct-15-2021

Thumela umlayezo wakho kithi: