Ukuhlolwa kwe-SPI kuyinqubo yokuhlola yobuchwepheshe bokucubungula i-SMD, ethola ngokuyinhloko ikhwalithi yokuphrinta kokunamathisela kwe-solder.
Igama lesiNgisi eliphelele le-SPI lithi Solder Paste Inspection, umgomo wayo ufana ne-AOI, ngokusebenzisa ukutholwa okubonakalayo bese kukhiqizwa izithombe ukuze kutholwe ikhwalithi yayo.
Umgomo wokusebenza we-SPI
Ekukhiqizweni kwe-pcba ngobuningi, onjiniyela bazophrinta amabhodi ambalwa we-pcb, i-SPI ngaphakathi kwekhamera yomsebenzi izothatha izithombe ze-PCB (ukuqoqwa kwedatha yokuphrinta), ngemuva kokuthi i-algorithm ihlaziya isithombe esikhiqizwe isikhombimsebenzisi somsebenzi, bese iqinisekisa ngokubonakalayo ukuthi kulungile.uma kulungile, kuzoba idatha yokuphrinta ye-solder yokunamathisela njengendinganiso yereferensi yokukhiqiza ngobuningi okwalandela izosuselwa kudatha yokuphrinta ukwenza isahlulelo!
Kungani ukuhlolwa kwe-SPI
Embonini, ngaphezu kwe-60% yeziphambeko ze-soldering kubangelwa ukuphrinta okungahambi kahle kwe-solder paste, ngakho-ke ukwengeza isheke ngemva kokuphrinta kwe-solder paste kunangemva kwezinkinga ze-soldering bese ubuyela kunyunyana ukuze ulondoloze izindleko.Ngenxa yokuthi ukuhlolwa kwe-SPI kutholakale kubi, ungakwazi ngokuqondile esiteshini se-docking ukuze wehlise i-pcb embi, ugeze unamathisele we-solder kuma-pads ungaphrinta kabusha, uma ingemuva le-soldering lilungisiwe bese litholakala, khona-ke udinga ukusebenzisa insimbi. ukulungisa noma ngisho nokulahlwa.Uma sikhuluma, ungakwazi ukonga izindleko
Yiziphi izici ezimbi ezitholwa yi-SPI
1. I-solder unama ukuphrinta i-offset
I-Solder Namathisela ukuphrinta i-offset izobangela isikhumbuzo esimile noma i-welding engenalutho, ngoba i-solder paste isusa umkhawulo owodwa we-pad, ekuncibilikeni kokushisa kwe-soldering, iziphetho ezimbili ze-solder unama ukushisa zincibilika zizovela umehluko wesikhathi, zithinteke ukungezwani, umkhawulo owodwa. ingase isonteke.
2. I-solder unama ukuphrinta ukucaba
I-solder unamathisele ukuphrinta flatness kubonisa ukuthi pcb pad surface solder unama akuyona flat, tin ngaphezulu kwesinye ekupheleni, tin kancane ekupheleni komunye, kuzophinde kubangele isifunda iDemo noma ingozi yokuma lesikhumbuzo.
3. Ukuqina kokuphrinta kwe-solder paste
Ukuphrinta kokuphrinta kwe-Solder kuncane kakhulu noma kuningi kakhulu ukuphrinta kokunamathisela kokunamathisela okuvuza, kuzodala ubungozi bokufaka i-solder engenalutho.
4. Ukuphrinta kokunamathisela kwe-solder noma ukudonsa ithiphu
Ithiphu yokuphrinta yokuphrinta ye-Solder nokunamathisela kwe-solder kufana, ngoba unamathisele we-solder ngemva kokuphrinta ukuze ukhulule isikhunta, uma kushesha kakhulu kungase kubonakale ithiphu lokudonsa.
Imininingwane yomshini we-NeoDen S1 SPI
Uhlelo lokudlulisa lwe-PCB: 900±30mm
Ubuncane besayizi ye-PCB: 50mm×50mm
Ubukhulu be-PCB ubukhulu: 500mm×460mm
Ubukhulu be-PCB: 0.6mm ~ 6mm
I-plate edge clearance: phezulu: 3mm phansi: 3mm
Isivinini sokudlulisa: 1500mm/s (MAX)
Isinxephezelo sokugoba amapuleti: <2mm
Imishini yomshayeli: I-AC servo motor system
Ukusetha ukunemba: <1 μm
Isivinini sokuhamba: 600mm/s
Isikhathi sokuthumela: Jul-20-2023