Izingxenye ze-chip ziyizingxenye ezincane nezincane ezingenawo umkhondo noma imikhondo emifushane, ezifakwe ngqo ku-PCB futhi zingamadivayisi akhethekileubuchwepheshe bokuhlanganisa ubuso.Izingxenye ze-chip zinezinzuzo zosayizi omncane, isisindo esilula, ukuminyana okuphezulu kokufakwa, ukuthembeka okuphezulu, ukumelana nokuzamazama komhlaba okuqinile, izici ezinhle zemvamisa ephezulu, ikhono eliqinile lokulwa nokuphazamiseka, kodwa futhi ngenxa yevolumu yazo encane kakhulu, ukwesaba ukushisa, ukwesaba ukuthinta. , ezinye izikhonkwane zokuhola ziningi, kunzima ukuziqaqa, okuletha ubunzima obukhulu ekunakekeleni.
Izindlela ezijwayelekile zokuqaqa zimi kanje.Kubalulekile ukuqaphela ukuthi: ekushiseni kwendawo, kufanele sivimbele ugesi omile, futhi amandla ensimbi kagesi kanye nobukhulu bekhanda lensimbi kufanele kube ngokufanele.
I. Indlela yemeshi yethusi emunca isono
Inetha lethusi elimuncwayo lenziwe ngocingo lwethusi olucolisekileyo olulukwe ebhandeni elihlanganisiwe, lingashintshwa ngomugqa wokuvikela wensimbi wekhebula noma izintambo eziningi zocingo oluthambile.Uma isetshenziswa, vala ikhebula ku-multi-pin bese usebenzisa i-rosin alcohol flux.Ukushisa nge-soldering iron, bese udonsa ucingo, i-solder ezinyaweni ifakwe ngocingo.Sika ucingo nge-solder bese uphinda izikhathi eziningana ukuze ubambe i-solder.I-solder ephinini iyancipha kancane kancane kuze kube yilapho iphini lengxenye lihlukaniswa nebhodi eliphrintiwe.
II.Indlela ekhethekile yokuhlukanisa ikhanda lensimbi yokukhetha nokuthenga ikhanda lensimbi elimise okwe-“N” elikhethekile, ukuphela kobubanzi benotshi (W) nobude (L) kunganqunywa ngokuya ngosayizi wezingxenye ezihlakaziwe.Ikhanda lensimbi elikhethekile lingenza i-solder yezikhonkwane zokuhola ezinhlangothini zombili zezingxenye ezihlakaziwe zincibilike ngesikhathi esifanayo, ukuze kube lula ukukhishwa kwezingxenye ezihlakaziwe.Indlela yokuzenzela yekhanda lensimbi ukukhetha ithubhu lethusi elibomvu elinobubanzi obungaphakathi obuhambisana nengaphandle lekhanda lensimbi, qinisa umkhawulo owodwa nge-vice (noma isando) bese ubhoboza imbobo encane, njengoba kuboniswe kuMfanekiso 1 ( a).Khona-ke amapuleti amabili ethusi (noma amashubhu ethusi asikwa ngobude futhi aba isicaba) asetshenziselwa ukuwacubungula aze afike kusayizi ofanayo nezingxenye ezihlakaziwe, bese kubhojwa izimbobo, njengoba kuboniswe kuMfanekiso 1 (b).Ubuso bokugcina bepuleti lethusi bafayilwa buyisicaba, bapholishwa bahlanzeka, futhi ekugcineni babuhlanganiswe busesimweni njengoba kuboniswe kuMfanekiso 1 (c) namabhawudi, afakwa ekhanda elisodayo.Ikhanda le-soldering lingasetshenziswa ngokufudumeza nokucwilisa ithini.Ezingxenyeni ze-flake elingunxande elinamabala amabili e-solder, inqobo nje uma ikhanda lensimbi ehlanganisiwe lishaywa libe yisimo esiyisicaba, ukuze ububanzi bobuso bokuphela bulingane nobude bengxenye, izindawo ezimbili ze-solder zingashiswa futhi zincibilike ngasikhathi sinye. , futhi izingxenye ze-flake zingasuswa.
III.Indlela yokuhlanza i-solder
Lapho i-solder ishisa nge-antistatic soldering iron, i-solder ihlanzwa nge-toothbrush (noma ibhulashi lamafutha, ibhulashi lokupenda, njll.), Futhi izingxenye zingasuswa ngokushesha.Ngemuva kokuthi izingxenye zisusiwe, ibhodi eliphrintiwe kufanele lihlanzwe ngesikhathi ukuze kuvinjelwe umjikelezo omfushane wezinye izingxenye ezibangelwa izinsalela zamathini.
I-NeoDen inikeza izixazululo zomugqa womhlangano we-SMT ogcwele, ohlanganisaI-oven ye-SMT egeleza kabusha, umshini wokunamathisela amagagasi, umshini wokukhetha bese ubeka, iphrinta yokunamathisela i-solder, i-oven ye-Reflow, isilayishi se-PCB, isikhiphi se-PCB, isikhweli se-chip, Umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, okokusebenza komugqa womhlangano we-SMT, Izinsiza zokukhiqiza ze-PCB Izisetshenziswa ze-SMT eziyisipele, njll.
I-Zhejiang NeoDen Technology Co., Ltd
Iwebhu:www.smtneoden.com
I-imeyili:info@neodentech.com
Isikhathi sokuthumela: Jun-17-2021