Izidingo Zokuklanywa Kwesakhiwo Sezingxenye Zokubuthwa Kwe-Wave Soldering

1. Isendlalelo

I-Wave soldering isetshenziswa futhi ishisiswe nge-solder encibilikisiwe kuzikhonkwane zezingxenye.Ngenxa yokunyakaza okuhlobene kwe-wave crest ne-PCB kanye "nokunamathela" kwe-solder encibilikisiwe, inqubo ye-wave soldering iyinkimbinkimbi kakhulu kune-reflow welding.Kunezidingo zesikhala sephini, ubude bephinikhodi kanye nosayizi wephedi wephakheji elizoshiselwa.Kukhona nezidingo zendlela yesakhiwo, isikhala kanye nokuxhumeka kwezimbobo ezifakwayo endaweni yebhodi le-PCB.Ngamafuphi, inqubo ye-wave soldering impofu futhi idinga izinga eliphezulu.Isivuno Welding ngokuyisisekelo incike design.

2. Izidingo zokupakisha

a.Izingxenye zokukhweza ezifanele ukusongelwa kwamagagasi kufanele zibe neziphetho zokushisela noma iziphetho eziholayo zidalulwe;Iphakheji yemvume yomhlabathi womzimba (Yima) <0.15mm;Ubude <4mm izidingo eziyisisekelo.

Izinto zokukhweza ezihlangabezana nale mibandela zihlanganisa:

0603~1206 ukumelana ne-chip kanye nezici ze-capacitance ngaphakathi kwebanga losayizi wephakheji;

I-SOP enebanga eliphakathi nendawo eliholayo ≥1.0mm nobude obungu-<4mm;

I-chip inductor enobude ≤4mm;

I-coil chip inductor engavezwanga (uhlobo C, M)

b.Isici esilinganisa iphinikhodi efanelana ne-wave soldering iyiphakheji enebanga elincane phakathi kwamaphini aseduze ≥1.75mm.

[Amazwana]Isikhala esincane sezingxenye ezifakiwe siyindawo eyamukelekayo yokuhlanganisa amagagasi.Nokho, ukuhlangabezana nemfuneko encane yesikhala akusho ukuthi izinga eliphezulu lokushisela lingafinyelelwa.Ezinye izimfuneko ezinjengokuqondiswa kwesakhiwo, ubude bomthofu ophuma endaweni yokushisela, nesikhala sephedi nakho kufanele kuhlangatshezwane nayo.

Isici sokukhweza se-Chip, usayizi wephakheji <0603 awufanele ukusoda kwegagasi, ngoba igebe phakathi kwamaphethelo amabili e-elementi lincane kakhulu, kulula ukwenzeka phakathi kwamaphethelo amabili ebhuloho.

Isici se-Chip mount, usayizi wephakeji > 1206 ayifanele ukusongeshwa kwegagasi, ngoba i-wave soldering ayilinganisi ukushisa, ukumelana ne-chip yosayizi omkhulu kanye nesici se-capacitance kulula ukuqhekeka ngenxa yokungafani kokwanda kokushisa.

3. Isiqondiso sokudlulisa

Ngaphambi kokuhlelwa kwezingxenye endaweni engaphansi kwe-wave soldering, indlela yokudlulisela ye-PCB ngokusebenzisa isithando somlilo kufanele kunqunywe kuqala, “okuyinkomba yenqubo” yokwakheka kwezingxenye ezifakiwe.Ngakho-ke, isiqondiso sokudlulisa kufanele sinqunywe ngaphambi kokuhlelwa kwezingxenye endaweni ye-wave soldering surface.

a.Ngokuvamile, isiqondiso sokudlulisela kufanele sibe uhlangothi olude.

b.Uma isakhiwo sinesixhumanisi sokufaka iphinikhodi eliminyene (isikhala esingu-<2.54mm), isiqondiso sesakhiwo sesixhumi kufanele kube isiqondiso sokudlulisa.

c.Endaweni ehlanganisiwe ye-wave soldering, isikrini sikasilika noma umcibisholo we-copper foil oqoshiwe usetshenziselwa ukumaka isiqondiso sokudluliselwa ukuze kukhonjwe ngesikhathi sokushisela.

[Amazwana]Ukuqondisa kwesakhiwo kubaluleke kakhulu ekuhlanganisweni kwe-wave soldering, ngoba i-wave soldering ine-tin in and tin out process.Ngakho-ke, ukuklama nokushisela kufanele kube ngendlela efanayo.

Lesi yisizathu sokumaka isiqondiso sokudluliswa kwe-wave soldering.

Uma ungakwazi ukunquma isiqondiso sokudluliswa, njengokuklama kwephedi lethini elibiwe, isiqondiso sokudlulisela asikwazi ukubonakala.

4. Isiqondiso sesakhiwo

Isiqondiso sesakhiwo sezingxenye ikakhulukazi sihilela izingxenye ze-chip nezixhumi zamaphini amaningi.

a.Ukuqondiswa okude kwe-PACKAGE yamadivayisi we-SOP kufanele kuhlelwe ngokuhambisana nesiqondiso sokudluliselwa kwe-wave peak welding, futhi isiqondiso eside sezingxenye ze-chip kufanele sihambisane nesiqondiso sokudlulisa i-wave peak welding.

b.Ezingxenyeni eziningi ze-plug-in enamaphini amabili, isiqondiso sokuxhuma kwesikhungo sikajeke kufanele sibe yi-perpendicular kundlela yokudlulisela ukuze kuncishiswe into entantayo yomkhawulo owodwa wengxenye.

[Amazwana]Ngenxa yokuthi indikimba yephakeji ye-patch element inomphumela wokuvinjwa ku-solder encibilikisiwe, kulula ukuholela ekushiseleni kokuvuza kwezikhonkwane ngemuva komzimba wephakheji (i-destin side).

Ngakho-ke, izidingo ezijwayelekile zomzimba wokupakisha akuthinti isiqondiso sokugeleza kwesakhiwo se-solder esincibilikisiwe.

Ukuhlanganiswa kwezixhumi zamaphini amaningi kwenzeka ngokuyinhloko ekugcineni/eceleni kwephinikhodi.Ukuqondanisa izikhonkwane zokuxhuma lapho kudluliswa khona kunciphisa inani lamaphini wokuhlukanisa futhi, ekugcineni, inani lamabhuloho.Bese ususa ibhuloho ngokuphelele ngomklamo we-tin pad eyebiwe.

5. Izidingo zesikhala

Ezingxenyeni zepheshi, isikhala sephedi sibhekisela esikhaleni phakathi kwezici eziphezulu kakhulu (okuhlanganisa namaphedi) wamaphakheji aseduze;Ezingxenyeni ze-plug-in, isikhala sephedi sibhekisela esikhaleni phakathi kwamaphedi.

Ezingxenyeni ze-SMT, isikhala sephedi asicatshangelwa nje kuphela kusici sebhuloho, kodwa futhi sihlanganisa umphumela wokuvinjwa komzimba wephakheji ongabangela ukuvuza kokushisela.

a.Isikhala sephedi sezingxenye ze-plug-in kufanele ngokuvamile sibe ngu-≥1.00mm.Ukuze uthole izixhumi ze-plug-in ze-fine-pitch, ukunciphisa okulinganiselwe kuvunyelwe, kodwa ubuncane akumele bube ngaphansi kuka-0.60mm.
b.Isikhawu phakathi kwephedi yezingxenye ze-plug-in kanye nephedi yezingxenye zepetshi ye-wave soldering kufanele kube ≥1.25mm.

6. Izidingo ezikhethekile zokuklama iphedi

a.Ukuze kuncishiswe ukuvuza kokushisela, kunconywa ukuthi udizayine amaphedi angu-0805/0603, SOT, SOP kanye nama-tantalum capacitors ngokuvumelana nezidingo ezilandelayo.

Ezingxenyeni ze-0805/0603, landela idizayini enconyiwe ye-IPC-7351 (iphedi inwetshwe ngo-0.2mm futhi ububanzi buncishiswe ngo-30%).

Kuma-SOT nama-tantalum capacitor, amaphedi kufanele anwetshwe ngo-0.3mm ngaphandle kunalawo omklamo ojwayelekile.

b.ngepuleti lembobo ene-metalized, amandla okuhlangana kwe-solder ancike ikakhulukazi ekuxhumekeni kwembobo, ububanzi bendandatho yephedi ≥0.25mm.

c.Ngezimbobo ezingezona ezensimbi (iphaneli eyodwa), amandla ejoyinti le-solder ancike kusayizi wephedi, ngokuvamile ububanzi bephedi kufanele bube ngaphezu kokuphindwe izikhathi ezingu-2.5 ukuvuleka.

d.Ngokupakishwa kwe-SOP, iphedi yokwebiwa kwethayela kufanele yakhelwe ekugcineni kwephinikhodi ye-destin.Uma isikhala se-SOP sisisikhulu uma kuqhathaniswa, umklamo wephedi lokweba uthayela nawo ungaba mkhulu.

e.okwesixhumi esinamaphini amaningi, kufanele sakhelwe ekugcineni kwethini lephedi lethayela.

7. ubude bokuhola

a.Ubude bokuhola bunobudlelwano obuhle nokwakheka koxhumano lwebhuloho, lapho isikhala sephini sincane, ithonya elikhulu.

Uma isikhala sephini singu-2~2.54mm, ubude bokuhola kufanele bulawuleke ngo-0.8~1.3mm

Uma isikhala sephini singaphansi kuka-2mm, ubude bomthofu kufanele bulawuleke ngo-0.5~1.0mm.

b.Ubude bokunwetshwa komthofu bungadlala indima kuphela ngaphansi kombandela wokuthi isiqondiso sesakhiwo sengxenye sihlangabezana nezidingo ze-wave soldering, ngaphandle kwalokho umphumela wokuqeda ibhuloho awubonakali.

[Amazwana]Umthelela wobude bomthofu ekuxhumekeni kwebhuloho yinkimbinkimbi kakhulu, ngokuvamile >2.5mm noma <1.0mm, umthelela ekuxhumekeni kwebhuloho mancane uma kuqhathaniswa, kodwa phakathi kuka-1.0-2.5m, umthelela mkhulu uma kuqhathaniswa.Okusho ukuthi, kungenzeka kakhulu ukuthi ibangele ukwenzeka kwebhuloho uma ingekude kakhulu noma imfushane kakhulu.

8. Ukusetshenziswa kweyinki yokushisela

a.Sivamise ukubona ihluzo ze-inki ephrintiwe yephedi yesixhumi, idizayini enjalo ngokuvamile ikholakala ukuthi yehlisa ukwenzeka kwebhuloho.Indlela ingase ibe ukuthi ingaphezulu lesendlalelo sikayinki lukhuni, kulula ukumunca ukugeleza okwengeziwe, ukugeleza kwezinga lokushisa eliphezulu okuncibilikisiwe kwe-solder volatilization kanye nokwakheka kwamabhamuza okuzihlukanisa, ukuze kuncishiswe ukuvela kwebhuloho.

b.Uma ibanga eliphakathi kwamaphinikhodi angu-1.0mm, ungakwazi ukuklama isendlalelo sikayinki esivimbile ngaphandle kwephedi ukuze unciphise amathuba okuba ibhuloho, ikakhulukazi ukususa iphedi eliminyene phakathi kwebhuloho phakathi kwamalunga e-solder, kanye nengxenye enkulu. ukuqedwa kweqembu lephedi eliminyene ekupheleni kwamajoyinti e-solder yebhuloho imisebenzi yabo ehlukene.Ngakho-ke, i-pin spacing incane kakhulu, i-solder inki kanye nephedi ye-solder kufanele isetshenziswe ndawonye.

Umugqa wokukhiqiza we-K1830 SMT


Isikhathi sokuthumela: Nov-29-2021

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