1. Khumbuza wonke umuntu ukuthi ahlole ukubukeka kuqala ngemva kokuthola ibhodi elingenalutho le-PCB ukuze abone ukuthi kukhona yini ukujikeleza okufushane, ikhefu lesifunda nezinye izinkinga.Bese ujwayelana nomdwebo wohlelo lwebhodi lokuthuthukisa, bese uqhathanisa umdwebo wohlelo nongqimba lokuphrinta lwesikrini se-PCB ukuze ugweme umehluko phakathi komdwebo wohlelo ne-PCB.
2. Ngemuva kwezinto ezidingekayoreflow ovenzilungile, izingxenye kufanele zihlukaniswe.Zonke izingxenye zingahlukaniswa ngezigaba eziningana ngokusho kobukhulu bazo ukuze kube lula ukushisela okulandelayo.Uhlu lwezinto eziphelele ludinga ukuphrintwa.Enqubweni yokushisela, uma i-welding ingaqediwe, khipha izinketho ezihambisanayo ngepeni, ukuze kube lula ukusebenza kokushisela okulandelayo.
3. Ngaphambilireflow soldering umshini, thatha izinyathelo ze-esd, njengokufaka indandatho ye-esd, ukuvimbela ukulimala kwe-electrostatic ezingxenyeni.Ngemuva kokuthi yonke imishini yokushisela isilungile, qinisekisa ukuthi ikhanda lensimbi yokunamathisela lihlanzekile futhi lihlelekile.Kunconywa ukukhetha i-Angle eyisicaba ye-solder iron ye-welding yokuqala.Lapho welding izingxenye encapsulated ezifana uhlobo 0603, insimbi soldering ingathintana kangcono pad Welding, okuyinto elula Welding.Yiqiniso, ku-master, lokhu akuyona inkinga.
4. Lapho ukhetha izingxenye zokushisela, zibophe ngokulandelana ukusuka phansi kuye phezulu futhi kusukela ezincane kuye ezinkulu.Ukuze ugweme ukuphazamiseka kokushisela kwezingxenye ezinkulu ezishiselwe ezingxenyeni ezincane.Ikakhulukazi weld edidiyelwe ama-chips esekethe.
5. Ngaphambi kokushisela ama-chips esekethe ahlanganisiwe, qinisekisa ukuthi ama-chips abekwe ngendlela efanele.Okwesendlalelo sokuphrinta sesikrini se-chip, iphedi elivamile elingunxande limelela ukuqala kwephini.Ngesikhathi sokushisela, iphinikhodi eyodwa ye-chip kufanele ilungiswe kuqala.Ngemuva kokulungisa kahle isikhundla sezingxenye, izikhonkwane ze-diagonal ze-chip kufanele zilungiswe ukuze izingxenye zixhunywe ngokunembile endaweni ngaphambi kokushisela.
6. Ayikho i-electrode enhle noma engalungile kuma-ceramic chip capacitors kanye nama-diode okulawula kumasekhethi okulawula ama-voltage, kodwa kuyadingeka ukuhlukanisa i-electrode enhle nengalungile yama-leds, ama-tantalum capacitors nama-electrolytic capacitors.Kuma-capacitor nezingxenye ze-diode, isiphetho esimakiwe ngokuvamile sizoba negethivu.Ephaketheni le-SMT LED, kukhona isiqondiso esihle - esingalungile eduze kwesiqondiso sesibani.Ezingxenyeni ezihlanganisiwe ezinomfanekiso wesikrini sikasilika somdwebo wesifunda se-diode, ukudlulela kwe-diode okunegethivu kufanele kubekwe ekugcineni komugqa oqondile.
7. ku-crystal oscillator, i-passive crystal oscillator ngokuvamile amaphinikhodi amabili kuphela, futhi awekho amaphuzu amahle noma amabi.I-crystal oscillator esebenzayo ngokuvamile inamaphini amane.Naka incazelo yephini ngalinye ukuze ugweme amaphutha e-welding.
8. Ukuze kushiswe izingxenye ze-plug-in, njengezingxenye ezihlobene nemojula yamandla, iphinikhodi yedivayisi ingashintshwa ngaphambi kokushisela.Ngemuva kokuthi izingxenye zibekwe futhi zilungiswe, i-solder iyancibilika nge-solder iron ngemuva futhi ihlanganiswe ngaphambili nge-solder pad.Ungafaki i-solder kakhulu, kodwa okokuqala izingxenye kufanele zizinzile.
9. Izinkinga zokuklama i-PCB ezitholwe ngesikhathi sokushisela kufanele zirekhodwe ngesikhathi, njengokuphazamiseka kokufaka, ukwakheka kosayizi wephedi okungalungile, amaphutha okupakisha engxenye, njll., ukuze kuthuthukiswe okwalandela.
10. ngemva kokushisela, sebenzisa ingilazi yokukhulisa ukuze uhlole amajoyinti e-solder futhi uhlole ukuthi ingabe kukhona iphutha lokushisela noma isifunda esifushane.
11. ngemva kokuphothulwa umsebenzi wokushisela ibhodi wesifunda, utshwala kanye nezinye i-ejenti yokuhlanza kufanele isetshenziselwe ukuhlanza ebusweni ibhodi wesifunda, ukuvimbela ibhodi wesifunda surface exhunywe i-iron chip wesifunda iDemo, kodwa futhi kungenza ibhodi wesifunda. ehlanzekile futhi emuhle kakhulu.
Isikhathi sokuthumela: Aug-17-2021