PCB cloning, PCB reverse design

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Njengamanje, ukukopisha kwe-PCB kubuye kubizwe ngokuthi yi-PCB cloning, i-PCB reverse design, noma i-PCB reverse R&D embonini.Kunemibono eminingi mayelana nencazelo yokukopisha kwe-PCB embonini nasezifundweni, kodwa ayiphelele.Uma sifuna ukunikeza incazelo enembile yokukopisha kwe-PCB, singafunda kulabhorethri yokukopisha ye-PCB e-China: Ibhodi lokukopisha le-PCB, okungukuthi, ngesisekelo semikhiqizo ekhona ye-elekthronikhi namabhodi wesekethe, ukuhlaziywa okuhlanekezelwe kwamabhodi wesifunda kuyenziwa. ngobuchwepheshe be-R & D obuhlanekezelwe, kanye nemibhalo ye-PCB, imibhalo ye-BOM, imibhalo ye-schematic diagram kanye nemibhalo yokukhiqiza isikrini sikasilika se-PCB semikhiqizo yasekuqaleni abuyiselwa ngesilinganiso esingu-1:1, bese amabhodi e-PCB nezingxenye zenziwa ngokusebenzisa le mibhalo yobuchwepheshe. kanye nemibhalo yokukhiqiza Izingxenye zokushisela, ukuhlolwa kwephinikhodi endizayo, ukulungisa iphutha lebhodi lesifunda, ikhophi ephelele yesifanekiso sokuqala sebhodi lesifunda.Ngenxa yokuthi imikhiqizo ye-elekthronikhi yonke yenziwe ngazo zonke izinhlobo zamabhodi esekethe, yonke isethi yedatha yobuchwepheshe yanoma yimiphi imikhiqizo ye-elekthronikhi ingakhishwa futhi imikhiqizo ingakopishwa futhi ihlanganiswe ngokusebenzisa inqubo yokukopisha kwe-PCB.

Inqubo yokusetshenziswa kobuchwepheshe yokufunda ibhodi le-PCB ilula, okungukuthi, okokuqala ukuskena ibhodi lesifunda okufanele likopishwe, ukurekhoda indawo enemininingwane yengxenye, bese uqaqa izingxenye zokwenza i-BOM futhi uhlele ukuthengwa kwezinto ezibonakalayo, bese uskena ibhodi elingenalutho ukuthatha izithombe. , bese uwacubungula nge-software yokufunda ibhodi ukuze uwabuyisele kumafayela omdwebo webhodi le-PCB, bese uthumela amafayela e-PCB efekthri eyenza amapuleti ukuze enze amabhodi.Ngemuva kokuthi amabhodi enziwe, azothengwa Izingxenye zishiselwe ku-PCB, bese zihlolwa futhi zilungiswe.

 

Izinyathelo ezithile zobuchwepheshe zimi kanje:

Isinyathelo 1: thola i-PCB, qala ngokuqopha amamodeli, imingcele, kanye nendawo yazo zonke izingxenye ephepheni, ikakhulukazi isiqondiso se-diode, ishubhu yezigaba ezintathu, kanye nenotshi ye-IC.Kungcono ukuthatha izithombe ezimbili zendawo yesici segesi ngekhamera yedijithali.Manje ibhodi lesifunda le-PCB selithuthuke kakhulu, futhi i-diode triode kuyo ayibonakali.

Isinyathelo sesi-2: Susa zonke izingxenye kanye nethini emgodini wephedi.Hlanza i-PCB ngotshwala bese uyifaka kusithwebuli.Uma isithwebuli siskena, sidinga ukuphakamisa kancane amaphikseli athile ukuze sithole isithombe esicacile.Bese upholisha ungqimba olungaphezulu kanye nongqimba olungezansi kancane ngephepha le-gauze lamanzi kuze kube yilapho ifilimu yethusi ikhanya, uyibeke kusithwebuli, qala i-Photoshop, bese ushanela izendlalelo ezimbili ngombala.Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile kusikena, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe.

Isinyathelo sesi-3: Lungisa ukugqama nokukhanya kwekhanvasi ukuze wenze umehluko phakathi kwengxenye enefilimu yethusi nengxenye engenafilimu yethusi iqine.Bese uphendulela isithombe sesibili sibemnyama nokumhlophe ukuze uhlole ukuthi imigqa icacile yini.Uma kungenjalo, phinda lesi sinyathelo.Uma kucacile, gcina umdwebo njengamafayela aphezulu e-BMP ne-BOT BMP ngefomethi ye-BMP emnyama nemhlophe.Uma kukhona inkinga ngomdwebo, ungasebenzisa i-Photoshop ukuyilungisa futhi uyilungise.

Isinyathelo sesine: guqula amafayela amabili efomethi ye-BMP abe amafayela efomethi ye-PROTEL, futhi uwadlulisele abe izendlalelo ezimbili ku-PROTEL.Uma indawo ye-PAD ne-VIA ngaphezu kwamazinga amabili ngokuyisisekelo iqondana, kubonisa ukuthi izinyathelo ezimbalwa zokuqala zinhle kakhulu, futhi uma kukhona ukuchezuka, phinda izinyathelo zesithathu.Ngakho-ke ukukopisha kwebhodi le-PCB kuwumsebenzi onesineke kakhulu, ngoba inkinga encane izothinta ikhwalithi kanye neziqu ezifanayo ngemva kokukopishwa kwebhodi.Isinyathelo sesi-5: guqula i-BMP yesendlalelo esiphezulu iye kwi-PCB ephezulu.Naka ukuyiguqula ibe ungqimba lukasilika, okuwungqimba oluphuzi.

Khona-ke ungakwazi ukulandelela umugqa kungqimba eliphezulu, bese ubeka idivayisi ngokusho komdwebo esinyathelweni sesi-2. Susa isendlalelo sikasilika ngemva kokudweba.Phinda kuze kube yilapho zonke izendlalelo zidwetshiwe.

Isinyathelo sesi-6: dlulisela ku-PCB ephezulu ne-BOT PCB ku-Protel futhi uwahlanganise abe yisibalo esisodwa.

Isinyathelo sesi-7: sebenzisa iphrinta ye-laser ukuze uphrinte isendlalelo esiphezulu nesendlalelo esingezansi kwifilimu ebonisa ngale (isilinganiso esingu-1:1), kodwa ifilimu kuleyo PCB, bese uqhathanisa ukuthi kukhona yini iphutha.Uma uqinisile, uzophumelela.

Ibhodi lokukopisha elifana nebhodi lokuqala lazalwa, kodwa laqedwa nje ingxenye.Kudingeka futhi sihlole ukuthi ukusebenza kobuchwepheshe be-elekthronikhi kwebhodi kuyefana nalokhu kwebhodi lokuqala.Uma kuyafana, kwenziwa ngempela.

 

Qaphela: uma ibhodi le-multilayer, kufanele lipholishwe ngokucophelela kungqimba lwangaphakathi, bese uphinda izinyathelo zokukopisha kusukela kusinyathelo sesi-3 kuya kusinyathelo sesi-5. Yiqiniso, ukuqanjwa kwesibalo nakho kuhlukile.Kufanele kunqunywe ngokuya ngenani lezendlalelo.Ngokuvamile, ukukopishwa kwebhodi elinezinhlangothi ezimbili kulula kakhulu kunebhodi le-multilayer, futhi ukuqondanisa kwebhodi le-multilayer kuthambekele ekubeni kungalungile, ngakho-ke ukukopishwa kwebhodi le-multilayer kufanele kuqaphele futhi ngokucophelela (lapho imbobo yangaphakathi kanye ne-Kulula ukuba nezinkinga ngezimbobo zokuphumela).

 

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Indlela yokukopisha yebhodi enezinhlangothi ezimbili:

1. Skena indawo engaphezulu nephansi yebhodi lesekhethi, bese ulondoloza izithombe ezimbili ze-BMP.

2. Vula isofthiwe yebhodi lokukopisha, chofoza “ifayela” kanye “nebalazwe eliyisisekelo elivulekile” ukuze uvule isithombe esiskeniwe.Khulisa isikrini ngekhasi, bona iphedi, cindezela u-PP ukuze ubeke iphedi, ubone umugqa, bese ucindezela u-PT ukuze umzila Njengomdwebo wengane, dweba kanye kule softhiwe, bese uchofoza okuthi “londoloza” ukuze ukhiqize ifayela le-B2P.

3. Chofoza “ifayela” kanye “novula ngezansi” futhi ukuze uvule imephu yombala eskeniwe yesinye isendlalelo;4. Chofoza “ifayela” futhi “uvule” futhi ukuze uvule ifayela le-B2P elondolozwe ngaphambilini.Sibona ibhodi esanda kukopishwa, ehlanganiswe kulesi sithombe - ibhodi le-PCB elifanayo, izimbobo zisesimweni esifanayo, kodwa uxhumano lwesifunda luhlukile.Ngakho-ke sicindezela "izinketho" - "Izilungiselelo Zesendlalelo", lapha vala isifunda nokuphrinta kwesikrini kwesendlalelo esiphezulu sokubonisa, ushiye kuphela ama-vias anezendlalelo eziningi.5. Ama-vias asongqimbeni olungaphezulu ayafana nalawo angaphansi kongqimba.

 

 

I-athikili nezithombe ezivela ku-inthanethi, uma kukhona ukwephulwa komthetho pls okokuqala xhumana nathi ukuze ukususe.
I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.

 

I-Hangzhou NeoDen Technology Co., Ltd

I-Web1: www.smtneoden.com

I-Web2:www.neodensmt.com

I-imeyili:info@neodentech.com

 


Isikhathi sokuthumela: Jul-20-2020

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