Iningi lefekthri yokucubungula i-pcba izohlangabezana nesenzakalo esibi, izingxenye ze-chip ye-SMT kunqubo yokuphakamisa ukuphela kokucubungula i-chip.Lesi simo senzeke ezingxenyeni ezincane ze-chip capacitive, ikakhulukazi ama-chip capacitor angu-0402, ama-chip resistors, lesi simo sivame ukubizwa ngokuthi "i-monolithic phenomenon".
Izizathu zokwakheka
(1) izingxenye kuzo zombili iziphetho ze-solder unama ukuncibilika isikhathi asivunyelanisiwe noma ukungezwani kwendawo kuhlukile, njengokuphrinta okungalungile kokunamathisela kwe-solder (umkhawulo owodwa unesici), unamathisele ukuchema, izingxenye zobukhulu bokuphela kwe-solder buhlukile.Ngokuvamile njalo unamathisele i-solder ngemva kokuba ukuphela kokuncibilika kukhishwe.
(2) Idizayini yephedi: ubude bokufinyelela kwephedi bunobubanzi obufanelekile, bufushane kakhulu noma bude kakhulu bathambekele entweni yetshe lesikhumbuzo elimile.
(3) I-solder paste ixutshwe kakhulu futhi izingxenye zintanta phezulu ngemva kokuba i-solder paste isincibilikile.Kulokhu, izingxenye zizoshaywa kalula umoya oshisayo ukuze zenzeke into yokuma kwetshe lesikhumbuzo.
(4) Ukulungiselelwa kwejika lezinga lokushisa: ama-monolith ngokuvamile avela ngesikhathi lapho i-solder ehlangene iqala ukuncibilika.Izinga lokushisa elikhuphuka eduze kwendawo yokuncibilika libaluleke kakhulu, kancane kancane kungcono ukuqeda i-monolith phenomenon.
(5) Esinye seziphetho ze-solder zengxenye zine-oxidised noma zingcolile futhi azikwazi ukumanziswa.Naka ngokukhethekile izingxenye ezinongqimba olulodwa lwesiliva ekugcineni kwe-solder.
(6) Iphedi ingcolisiwe (ngesikrini sikasilika, uyinki we-solder resist, unamathele ngento yangaphandle, ene-oxidised).
Indlela yokwakheka:
Lapho i-reflow soldering, ukushisa kusetshenziswa phezulu nangaphansi kwengxenye ye-chip ngesikhathi esifanayo.Ngokuvamile, kuhlale kuyiphedi enendawo enkulu kakhulu eveziwe eshiselwa kuqala ekushiseni okungaphezu kwendawo yokuncibilika ye-solder paste.Ngale ndlela, ukuphela kwengxenye ethi kamuva imanziswe yi-solder ivame ukudonswa ukungezwani okungaphezulu kwe-solder ngakolunye uhlangothi.
Izixazululo:
(1) izici zokuklama
Idizayini enengqondo yephedi - usayizi wokufinyelela kufanele ube ozwakalayo, ngangokunokwenzeka ukuze ugweme ubude bokufinyelela buhlanganisa unqenqema lwangaphandle lwe-engeli yokumanzisa (eqondile) engaphezu kuka-45 °.
(2) Indawo yokukhiqiza
1. sula ngenkuthalo inetha ukuze uqinisekise ukuthi ihluzo zamaphuzu we-solder unama ngokuphelele.
2. indawo yokubeka enembile.
3. Sebenzisa ukunamathisela kwe-solder okungeyona i-eutectic futhi unciphise izinga lokushisa ngesikhathi sokuphinda kufakwe i-solder (ukulawula ngaphansi kuka-2.2℃/s).
4. Nciphisa ubukhulu be-solder paste.
(3) Izinto ezingenayo
Lawula ngokuqinile ikhwalithi yezinto ezingenayo ukuze uqinisekise ukuthi indawo ephumelelayo yezingxenye ezisetshenzisiwe inosayizi ofanayo kuzo zombili iziphetho (isisekelo sokukhiqiza ukungezwani kwendawo).
Izici ze-NeoDen IN12C Reflow Oven
1. Isistimu yokuhlunga intuthu eyakhelwe ngaphakathi, ukuhlunga okusebenzayo kwamagesi ayingozi, ukubukeka okuhle nokuvikelwa kwemvelo, okuhambisana kakhulu nokusetshenziswa kwendawo ephezulu.
I-2.Isistimu yokulawula inezici zokuhlanganiswa okuphezulu, ukuphendula ngesikhathi, izinga lokuhluleka eliphansi, ukugcinwa okulula, njll.
3. Ihlakaniphile, ihlanganiswe ne-algorithm yokulawula ye-PID yohlelo lokulawula oluhlakaniphile oluthuthukisiwe, olusebenziseka kalula, olunamandla.
4. professional, eyingqayizivele 4-indlela uhlelo lokuqapha izinga lokushisa surface ibhodi, ukuze ukusebenza kwangempela ngesikhathi futhi idatha ephelele impendulo, ngisho imikhiqizo eyinkimbinkimbi electronic kungaba ngempumelelo.
5. Ibhande lensimbi engagqwali elakhiwe ngokwezifiso lohlobo lwe-B, eliqinile futhi alikwazi ukugqokwa.Ukusetshenziswa isikhathi eside akulula deformation
6. Kuhle futhi kunomsebenzi we-alamu obomvu, ophuzi nohlaza womklamo wenkomba.
Isikhathi sokuthumela: May-11-2023