5. Ukudangala
I-Delamination noma i-bonding engeyinhle isho ukwehlukana phakathi kwe-plastic sealer kanye nesixhumi esibonakalayo esiseduze.I-Delamination ingenzeka kunoma iyiphi indawo ye-microelectronic device ebunjiwe;kungase futhi kwenzeke phakathi nenqubo ye-encapsulation, isigaba sokukhiqiza ngemuva kwe-encapsulation, noma phakathi nesigaba sokusebenzisa idivayisi.
Ukuxhumana okungalungile kokubopha okubangelwa inqubo ye-encapsulation kuyisici esikhulu ekunciphiseni.I-interface voids, ukungcoliswa kwendawo ngesikhathi sokugqunywa, kanye nokwelashwa okungaphelele konke kungaholela ekuhlanganeni okubi.Ezinye izici ezinomthelela zihlanganisa ingcindezi yokuncipha kanye ne-warpage ngesikhathi sokwelapha nokupholisa.Ukungafani kwe-CTE phakathi kwe-plastic sealer nezinto eziseduze ngesikhathi sokupholisa kungase kuholele ekucindezelekeni komshini oshisayo, okungase kubangele ukubola.
6. Izikhala
Ama-Voids angenzeka kunoma yisiphi isigaba senqubo ye-encapsulation, okuhlanganisa ukubunjwa kokudlulisa, ukugcwaliswa, ukubumba, nokuphrinta kwenhlanganisela yokubumba ibe yindawo yomoya.Izikhala zingancishiswa ngokunciphisa inani lomoya, njengokuphuma noma ukucofa.Izingcindezi ze-vacuum ezisukela ku-1 kuye ku-300 Torr (760 Torr yendawo eyodwa) kubikwe ukuthi ziyasetshenziswa.
Ukuhlaziywa kokugcwalisa kuphakamisa ukuthi ukuxhumana kwengaphambili elincibilikayo elingaphansi ne-chip elibangela ukuthi ukugeleza kuvinjwe.Ingxenye yangaphambili encibilikayo igeleza iye phezulu futhi igcwalise ingxenye engaphezulu yengxenye endaweni evulekile esemkhawulweni we-chip.Ingaphambili elincibilikayo elisanda kwakhiwa kanye nengaphambili le-adsorbed elincibilikayo lingena endaweni ephezulu yengxenye yokufa, okuholela ekuqhumeni.
7. Ukupakisha okungalingani
Ugqinsi lwephakeji elingafani yunifomu lungaholela ku-warpage kanye ne-delamination.Ubuchwepheshe bokupakisha obujwayelekile, obufana nokubunjwa kokudlulisa, ukubumba ingcindezi, nobuchwepheshe bokupakisha bokufaka, mancane amathuba okuthi bukhiqize ukukhubazeka kokupakisha okunogqinsi olungafani.Ukupakishwa kwezinga le-wafer kusengozini enkulu ekugqineni kwe-plastisol engalingani ngenxa yezimpawu zayo zenqubo.
Ukuze uqinisekise ukujiya kophawu olufanayo, isithwali se-wafer kufanele simiswe ngokutsheka okuncane ukuze kube lula ukukhwezwa kwe-squeegee.Ukwengeza, ukulawulwa kwesikhundla se-squeegee kuyadingeka ukuze kuqinisekiswe ukucindezela okuzinzile kwe-squeegee ukuthola ukushuba kophawu olufanayo.
Ukwakheka kwezinto ezihlukene noma ezihlukene kungabangela lapho izinhlayiya zokugcwalisa ziqoqa ezindaweni zendawo zenhlanganisela yokubumba futhi zenze ukusabalalisa okungeyona into efanayo ngaphambi kokuqina.Ukuxuba okunganele kwe-sealer yepulasitiki kuzoholela ekuveleni kwekhwalithi ehlukile kunqubo yokuhlanganisa kanye ne-potting.
8. Unqenqema oluluhlaza
Ama-Burrs ipulasitiki ebunjiwe edlula emugqeni wokuhlukanisa futhi ifakwe ezikhonkwaneni zedivayisi ngesikhathi sokubumba.
Ukucindezela okubambezelayo okunganele kuyimbangela eyinhloko yama-burrs.Uma izinsalela zezinto ezibunjiwe ezikhonkwane zingasuswa ngesikhathi, kuzoholela ezinkingeni ezihlukahlukene esigabeni somhlangano.Isibonelo, ukubopha okunganele noma ukunamathela esigabeni esilandelayo sokupakisha.Ukuvuza kwe-resin kuyindlela encane yama-burrs.
9. Izinhlayiya zakwamanye amazwe
Enqubweni yokupakisha, uma impahla yokupakisha ivezwa endaweni engcolile, okokusebenza noma izinto zokwakha, izinhlayiya zakwamanye amazwe zizosabalala ephaketheni futhi ziqoqe ezingxenyeni zensimbi ezingaphakathi kwephakheji (njengama-IC chips namaphoyinti okubopha umthofu), okuholela ekugqwaleni nokunye. izinkinga zokwethenjelwa ezilandelayo.
10. Ukwelapha okungaphelele
Isikhathi sokwelashwa esinganele noma izinga lokushisa eliphansi lokuphulukisa kungaholela ekwelapheni okungaphelele.Ngaphezu kwalokho, ukushintsha okuncane kwesilinganiso sokuxuba phakathi kwama-encapsulants amabili kuzoholela ekwelapheni okungaphelele.Ukuze ukwandise izakhiwo ze-encapsulant, kubalulekile ukuqinisekisa ukuthi i-encapsulant iphulukisiwe ngokugcwele.Ezindleleni eziningi ze-encapsulation, ukuphulukiswa kwangemuva kuvunyelwe ukuqinisekisa ukuphulukiswa okuphelele kwe-encapsulant.Futhi ukunakekelwa kufanele kuthathwe ukuze kuqinisekiswe ukuthi izilinganiso ze-encapsulant zilingana ngokunembile.
Isikhathi sokuthumela: Feb-15-2023