I-Circuit Board Thermal Conductivity kanye Nezidingo Zokucutshungulwa Kwedizayini Yokushabalalisa Ukushisa

1. Ukwakheka kukasinki wokushisa, ukujiya kanye nendawo yomklamo

Ngokusho kwezidingo ezishisayo zomklamo wezingxenye ezidingekayo zokushisa ukushisa kufanele zicatshangelwe ngokugcwele, kufanele kuqinisekiswe ukuthi izinga lokushisa lokuhlangana lezingxenye ezikhiqiza ukushisa, izinga lokushisa le-PCB ebusweni ukuze lihlangabezane nezidingo zokuklama umkhiqizo.

2. Idizayini yokufaka usinki wokushisa wokuqina

Ngezidingo zokulawula okushisayo kwezingxenye ezikhiqiza ukushisa okuphezulu, usinki wokushisa kanye nezingxenye zokuqina kwendawo ekhuphukayo kufanele kuqinisekiswe ukuthi kufika ku-3.2µm noma ngisho no-1.6µm, kukhuphule indawo yokuthintana yendawo yensimbi, kusetshenziswa ngokugcwele ukuguquguquka okuphezulu kwe-thermal. izici zensimbi, ukunciphisa ukuthintana ukumelana nokushisa.Kodwa ngokuvamile, ukuqina akufanele kudingeke kuphezulu kakhulu.

3. Ukugcwalisa ukukhetha kwezinto

Ukuze kuncishiswe ukumelana okushisayo kwendawo yokuxhumana yengxenye yamandla aphezulu okufakwa phezulu kanye nosinki wokushisa, i-interface insulation kanye nezinto ze-thermal conductivity, izinto zokugcwalisa i-thermal conductivity ezine-conductivity ephezulu ye-thermal kufanele zikhethwe, isibonelo, ukufakwa kwe-insulation kanye ne-thermal conductivity. izinto ezifana ne-beryllium oxide (noma i-aluminium trioxide) ishidi le-ceramic, ifilimu ye-polyimide, ishidi le-mica, izinto zokugcwalisa ezifana ne-thermal conductive silicone grease, i-one-component vulcanized silicone rubber, i-two-component ye-silicone conductive rubber, i-thermal conductive silicone rubber pad.

4. Ukufakwa kwendawo yokuxhumana

Ukufakwa ngaphandle kokwahlukanisa: indawo yokukhweza ingxenye → indawo yokukhweza usinki wokushisa → I-PCB, indawo yokuxhumana enezendlalelo ezimbili.
Ukufakwa okugqunyiwe: indawo yokukhweza ingxenye → indawo yokukhweza usinki wokushisa → isendlalelo sokufakelwa → I-PCB (noma igobolondo le-chassis), izendlalelo ezintathu zendawo yokuthintana.I-insulation layer efakwe kuliphi izinga, kufanele isekelwe endaweni ekhwezwayo noma izimfuneko ze-PCB zokuvala ugesi.

umshini wokukhetha nokubeka isivinini esikhulu


Isikhathi sokuthumela: Dec-31-2021

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