I-Chip Component Pad Design Amaphutha

1. 0.5mm ubude bephedi ye-QFP yinde kakhulu, okuholela ekusekeni okufushane.

2. Amasokhethi e-PLCC ama-socket pads mafushane kakhulu, okuholela ekuhlanganisweni okungamanga.

3. Ubude bephedi ye-IC bude kakhulu futhi inani lokunamathisela kwe-solder likhulu okuholela ekujikelezeni okufushane ekugelezeni kabusha.

4. Ama-chip pads amise okwephiko made kakhulu ukuthi angathinta ukugcwaliswa kwe-solder esithendeni kanye nokumanzisa okungalungile kwesithende.

5. Ubude bephedi bezingxenye ze-chip bufushane kakhulu, okuholela ekushintsheni, ekujikelezeni okuvulekile, akukwazi ukuthengiswa nezinye izinkinga ze-soldering.

6. Ubude bephedi yezingxenye zohlobo lwe-chip bude kakhulu, okuholela ekumeni kwetshe lesikhumbuzo, isifunda esivulekile, amalunga e-solder angaphansi kwe-tin nezinye izinkinga zokunamathisela.

7. Ububanzi bephedi bukhulu kakhulu okuholela ekususweni kwengxenye, i-solder engenalutho kanye nethini elinganele kuphedi nokunye ukukhubazeka.

8. Ububanzi bephedi bubanzi kakhulu, usayizi wephakheji wengxenye nokungafani kwephedi.

9. Ububanzi bephedi buncane, buthinta usayizi we-solder encibilikisiwe eduze kokuphela kwe-solder yengxenye kanye nokusabalala kokumanzisa kwendawo yensimbi ekuhlanganiseni kwephedi ye-PCB, kuthinta ukuma kwejoyinti le-solder, kunciphisa ukuthembeka kwejoyinti le-solder.

10. I-Pad exhunywe ngokuqondile endaweni enkulu ye-foil yethusi, okuholela ekumeni kwesikhumbuzo, i-solder yamanga nezinye iziphambeko.

11. I-pad pitch inkulu kakhulu noma incane kakhulu, isiphetho se-solder asikwazi ukugqagqana nokugqagqana kwephedi, sizokhiqiza itshe lesikhumbuzo, ukususwa kwendawo, i-solder yamanga nokunye ukukhubazeka.

12. I-pad pitch inkulu kakhulu okuholela ekungakwazini ukwakha i-solder joint.