1. 0.5mm iphimbo lephedi le-QFP ubude kakhulu, libangela ukujikeleza okufushane.
2. Amasokhethi e-PLCC ama-socket pads mafushane kakhulu, okuholela ekuhlanganisweni okungamanga.
3. Ubude bephedi be-IC bude kakhulu futhi inani le-solder paste likhulu elibangela ukujikeleza okufushane ekugelezeni kabusha.
4. Amapayipi e-Wing chip made kakhulu athinta ukugcwaliswa kwe-solder esithendeni kanye nokumanzisa isithende esibi.
5. Ubude bephedi bezingxenye ze-chip bufushane kakhulu, okuholela ezinkingeni zokuhlanganisa ezifana nokugudluka, ukujikeleza okuvulekile, nokungakwazi ukudayiswa.
6. Ubude obude kakhulu bamaphedi engxenye ye-chip kubangela izinkinga zokunamathisela njengetshe lesikhumbuzo elimile, isifunda esivulekile, kanye nethini elincane emajoyintini e-solder.
7. Ububanzi bephedi bukhulu kakhulu okuholela ekulimaleni okufana nokugudluzwa kwengxenye, i-solder engenalutho kanye nethini elinganele kuphedi.
8. Ububanzi bephedi bukhulu kakhulu futhi usayizi wephakheji wengxenye awufani nephedi.
9. Ububanzi bephedi ye-Solder buncane, buthinta usayizi we-solder encibilikisiwe eduze kwengxenye ye-solder ekupheleni kanye namaphedi e-PCB ekuhlanganiseni kwe-metal surface wetting spread angafinyelela, okuthinta ukuma kwejoyinti le-solder, kunciphisa ukwethembeka kwejoyinti le-solder. .
10.Amaphedi e-solder axhunywe ngokuqondile ezindaweni ezinkulu ze-foil yethusi, okuholela ekushiyekeni okufana nezikhumbuzo ezimile kanye ne-solder yamanga.
11. Iphimbo lephedi ye-solder likhulu kakhulu noma lincane kakhulu, isiphetho se-solder asikwazi ukudlulana nokugqagqana kwephedi, okuzoveza izici ezifana netshe lesikhumbuzo elimile, ukugudluzwa, nokunamathelisa okungamanga.
12. Isikhala se-solder pad sikhulu kakhulu okuholela ekungakwazini ukwakha amalunga e-solder.
Isikhathi sokuthumela: Jan-14-2022