Kungani i-capacitor izoma isikhumbuzo solder yamanga?

1.Inkinga yokuphrinta i-solder paste
Ngesikhathi sokuphrinta ukunamathisela kwe-solder, ngenxa yokuthi ukuphrinta kwe-solder paste akusicaba, inani lokunamathisela le-solder ekugcineni lingaphezulu, inani elilodwa lokunamathisela le-solder lincane, kuholelageleza kabushaihhavinii-soldering hot melt ibonakala isikhathi esingaguquki, usayizi we-tension awulingani, i-wap yokuqala yokuqala.
2.Khetha nendawoumshiniukubeka ukutsheka noma okungacacile
Umshini we-SMD wokukhweza ukutsheka noma okungacacile, iphoyinti lepuleti le-solder livela endaweni eyodwa ngaphezulu, liholela esikhathini sokushisela esincibilikayo, isiphetho esisodwa esishisayo sincibilike ngokushesha, isiphetho esisodwa asikakancibiliki, sibonakala sishubile sihlukile, isiphetho esisodwa sisontekile.
Geza kabusha ijika lokushisa likahhavini

3.I-Reflow solderingumshiniinezindawo zokushisa ezi-4, i-preheating, izinga lokushisa elingaguquki, ukufudumeza, indawo yokupholisa, indima yendawo ngayinye yokushisa ihlukile, ezinye izingxenye zingathinteka ngokuphrinta kwe-solder paste engalingani noma eduze kwesici esiphezulu se-elekthronikhi, okuholela ekumunceni ukushisa okungalingani, Ngakho-ke ekushiseni ngaphambi komehluko wokushisa, okuholela esiteji sokushisa esinye isiphetho se-solder unamathisele kuncibilike kuqala, kanti omunye umkhawulo awuncibilikisiwe noma unamathisele we-solder uncibilike kancane, ngaleyo ndlela iphedi zombili iziphetho ukungezwani kuhlukile, okuholela etsheni lesikhumbuzo elimile noma i-wap.

Amaphuzu angenhla ezinye zezizathu eziyinhloko chip processing capacitor emi isikhumbuzo solder yamanga, Yebo, kukhona ezinye izizathu eziyinkimbinkimbi futhi eziguquguqukayo, kudingeka sinake kakhudlwana futhi irekhodi lapho ukukhiqizwa nsuku zonke.
I-NeoDen IN12Cizici ze-oven reflow
I-1.Isistimu yokuhlunga intuthu eyakhelwe ngaphakathi, ukuhlunga okusebenzayo kwamagesi ayingozi, ukubukeka okuhle nokuvikelwa kwemvelo, okuhambisana kakhulu nokusetshenziswa kwendawo ephezulu.

I-2.Isistimu yokulawula inezici zokuhlanganiswa okuphezulu, ukuphendula ngesikhathi, izinga lokuhluleka eliphansi, ukugcinwa okulula, njll.
I-3.Umklamo we-module wokushisa oyingqayizivele, ngokunemba okuphezulu kokulawula izinga lokushisa, ukusatshalaliswa kokushisa okufanayo endaweni yesinxephezelo esishisayo, ukusebenza kahle okuphezulu kwesinxephezelo esishisayo, ukusetshenziswa kwamandla aphansi nezinye izici.
I-4.I-convection yomoya oshisayo, ukusebenza kahle kwe-welding.
I-5.Idizayini yepuleti yokushisa eyingqayizivele iqinisekisa ngempumelelo ukupholisa okufanayo ngemva kokuba okokusebenza kuyeka ukushisa, ukuvimbela ngokuphumelelayo izingxenye ukuthi zingonakaliswe ukwehla okusheshayo kwezinga lokushisa kanye nokuguqulwa okubangelwayo.
.6.Ibhokisi lokushisa langaphakathi lenziwe ngensimbi engagqwali, enobungani bemvelo futhi engenaphunga, futhi uhlangothi lwangaphakathi lufakwe ukotini wokushisa ukushisa ukuze kuvinjelwe ngokuphumelelayo ukulahlekelwa ukushisa.
I-7.Idizayini yesikrini efihliwe ilungele ukuthutha, kulula ukuyisebenzisa, inhle futhi iyaphana.
8.isistimu yokulawula isebenzisa ama-chips angenisiwe, ukunemba kokulawula izinga lokushisa kuka-± 0.5%
I-9.Zonke izindawo zokushisa kanye nesivinini somoya esibandayo somoya siyalungiseka, sibhekane kalula nezidingo ezihlukahlukene zokushisela.
10.Umkhawulo ozenzakalelayo ngemva kokuvulwa kwekhava ephezulu, qinisekisa ngempumelelo ukuphepha kokukhiqiza.