Injongo yokupakishwa kwe-semiconductor chip ukuvikela i-chip ngokwayo kanye nokuxhuma amasignali phakathi kwama-chip.Esikhathini eside esidlule, ukuthuthukiswa kokusebenza kwe-chip kwakuncike kakhulu ekuthuthukisweni kokuklama kanye nenqubo yokukhiqiza.
Kodwa-ke, njengoba isakhiwo se-transistor se-semiconductor chips singena enkathini ye-FinFET, ukuqhubeka kwe-node yenqubo kubonise ukwehla okukhulu kwesimo.Nakuba ngokomkhombandlela wokuthuthukiswa kwemboni, sisesiningi isikhala sokukhuphuka kwe-node yenqubo, singakuzwa ngokucacile ukwehla koMthetho kaMoore, kanye nengcindezi elethwa ukwanda kwezindleko zokukhiqiza.
Ngenxa yalokho, sekuyindlela ebaluleke kakhulu yokuqhubeka nokuhlola amandla okuthuthukiswa kokusebenza ngokulungisa ubuchwepheshe bokupakisha.Eminyakeni embalwa eyedlule, imboni iye yavela ngokusebenzisa ubuchwepheshe bokupakisha okuthuthukisiwe ukuze kufezeke isiqubulo esithi "beyond Moore (More than Moore)"!
Okubizwa ngokuthi ukupakishwa okuthuthukisiwe, incazelo evamile yembonini jikelele yilena: konke ukusetshenziswa kwezindlela zenqubo yokukhiqiza yeshaneli yangaphambili yobuchwepheshe bokupakisha.
Ngokusebenzisa ukupakisha okuthuthukile, singakwazi:
1. Yehlisa ngokuphawulekayo indawo ye-chip ngemva kokupakishwa
Kungakhathaliseki ukuthi inhlanganisela yama-chips amaningi, noma iphakheji ye-chip Wafer Levelization, inganciphisa kakhulu usayizi wephakheji ukuze kwehliswe ukusetshenziswa kwayo yonke indawo yebhodi lesistimu.Ukusetshenziswa kokupakisha kusho ukunciphisa indawo ye-chip emnothweni kunokuthuthukisa inqubo ye-front-end ukuze ibe nezindleko ezithe xaxa.
2. Faka amachweba e-chip I/O engeziwe
Ngenxa yokwethulwa kwenqubo yangaphambili, singasebenzisa ubuchwepheshe be-RDL ukuze kufakwe izikhonkwane ezengeziwe ze-I/O endaweni ngayinye ye-chip, ngaleyo ndlela sinciphise ukumosheka kwendawo ye-chip.
3. Yehlisa izindleko zokwenziwa kwe-chip
Ngenxa yokwethulwa kwe-Chiplet, singahlanganisa kalula ama-chips amaningi nemisebenzi ehlukene futhi sicubungule ubuchwepheshe/amanodi ukuze sakhe i-system-in-package (SIP).Lokhu kugwema indlela ebizayo yokusebenzisa okufanayo (inqubo ephezulu kakhulu) kuyo yonke imisebenzi nama-IP.
4. Thuthukisa ukuxhumana phakathi kwama-chips
Njengoba isidingo samandla amakhulu ekhompyutha sikhula, ezimweni eziningi zohlelo lokusebenza kuyadingeka ukuthi iyunithi yekhompyutha (CPU, GPU…) kanye ne-DRAM yenze ukushintshana kwedatha okuningi.Lokhu kuvame ukuholela ekutheni kumoshwe cishe uhhafu wokusebenza kanye nokusetshenziswa kwamandla esistimu yonke ekusebenzelaneni kolwazi.Manje njengoba sesingakwazi ukunciphisa lokhu kulahlekelwa kube ngaphansi kuka-20% ngokuxhuma iphrosesa ne-DRAM eduze ngangokunokwenzeka ngamaphakheji ahlukahlukene e-2.5D/3D, singakwazi ukunciphisa ngokumangalisayo izindleko zekhompuyutha.Lokhu kwanda kokusebenza kahle kuyidlula kude intuthuko eyenziwe ngokwamukelwa kwezinqubo zokukhiqiza ezithuthuke kakhulu
I-Zhejiang NeoDen Technology Co., LTD., yasungulwa ngo-2010 inabasebenzi abayi-100+ kanye no-8000+ Sq.m.ifekthri yamalungelo omhlaba ezimele, ukuqinisekisa ukuphathwa okujwayelekile kanye nokuzuza imiphumela yezomnotho eminingi kanye nokonga izindleko.
Uphethe isikhungo semishini, umhlanganisi onekhono, umhloli nonjiniyela be-QC, ukuqinisekisa amakhono aqinile okukhiqiza imishini ye-NeoDen, ikhwalithi kanye nokulethwa.
Onjiniyela abanekhono nabaqeqeshiwe besiNgisi nonjiniyela benkonzo, ukuze baqinisekise impendulo esheshayo phakathi kwamahora ayi-8, isixazululo sihlinzeka kungakapheli amahora angama-24.
Eyingqayizivele phakathi kwabo bonke abakhiqizi baseShayina ababhalise futhi bagunyaza i-CE nge-TUV NORD.
Isikhathi sokuthumela: Sep-22-2023