Kuzokwenzekani Uma I-PCB Material Nosayizi Kungafanele?

1. Ngokuya ngezinhlinzeko ze-GJB3835, ngemuva kwe-warping kanye ne-deformation welding ye-PCBAreflow oveninqubo Welding, warping esiphezulu kanye ukuhlanekezela ngeke kweqe 0.75%, futhi warping kanye ukuhlanekezela PCB nge izingxenye emihle-spacing ngeke kudlule 0.5%.
2. I-PCBA ene-warping esobala, uma i-PCBA enezingqimba eziningi inengcindezi yokuguquguquka, okuhlanganisa ukuqiniswa kokufakwa kohlaka lwensimbi, ukufakwa kwesikulufu seplatifomu ye-chassis, ukufakwa kwe-chassis guide rail guide groove kanye nokunye ukufakwa kokuhlehla kokushintsha (ukufakwa), Kungenzeka kubangele umonakalo noma ukuphuka emigodini ye-metalization yezintambo eziphrintiwe ezifana ne-IC ephezulu kanye nezinye izingxenye ezihamba phambili, amajoyinti e-solder e-BGA/CCGA kanye nezimbobo zokudlulisa ze-PCB ye-multilayer.

3. I-PCBA enokuhlanekezela noma ukukhothama kuze kufike ku-0.75% izofakwa ngokuhambisana nalezi zinhlinzeko ezilandelayo uma kuqinisekiswa ukuthi ukucindezeleka kwe-deformation akubangeli ukulimala kwengxenye kanye nezinkinga zokuthembeka futhi idinga ukuqhubeka isetshenziswa.
Faka (faka) futhi ubophe ngezikulufu ngokuqondile endaweni ye-chassis, i-groove eqondisayo, isitimela somhlahlandlela noma insika akufanele yenziwe ukuze kugwenywe ukulimala okwengeziwe ezingxenyeni nezimbobo ezenziwe ngensimbi okubangelwa ukucindezeleka kokuhlehla kokufakwa komhlangano we-PCB.
Izinyathelo zokulala zendawo (izinto ezisebenza ngogesi noma ezishisayo) zizothathwa endaweni lapho igebe lokuguquguquka lokugoba lilikhulu kakhulu, ngaphandle kokuthinta ukuthembeka kokufakwa nokuqinisekisa iziteshi ezishisayo noma ezihambisayo.Ingxenye ye-warping ingafakwa futhi iboshwe kuphela ngaphansi kwesimo sokuthi umhlangano webhodi lesifunda okhubazekile awunakuthwala ukucindezeleka kwe-deformation.

4. Ukuqina nokuqina komthamo wezinto ezikhethelwe ukwakheka kokufakwa kwe-PCB kanye nohlaka lokuqinisa angeke kubangele ukuhlanekezela noma ukuguquguquka komnsalo noma ukuhlehla kwe-PCB.

5. I-PCBA enezingqimba eziningi ngokuhlanekezela okusobala noma ukukhothama, noma ukuhlanekezela (ukukhothama) okungaphansi kuka-0.75%, ikakhulukazi i-PCBA ehlonyiswe nge-IC ephezulu, izingxenye ze-BGA/CCGA, ukulungiswa noma ukufakwa kokulwa nokuguqulwa kwe-PCB kufanele kuvinjelwe ngokuqinile. .