Isiphi isakhiwo esiqukethe ihhavini lokugeleza kabusha?

I-NeoDen IN12

Geza kabusha ihhaviniisetshenziselwa ukwenza i-solder circuit board patch components inUmugqa wokukhiqiza we-SMT.Izinzuzo zomshini we-reflow soldering ukuthi izinga lokushisa lilawulwa kalula, i-oxidation igwenywa ngesikhathi senqubo yokushisela, futhi izindleko zokukhiqiza zilawulwa kalula.Kukhona isifunda sokushisa ngaphakathi kwe-oven reflow, futhi i-nitrogen ifudunyezwa ekushiseni okuphezulu ngokwanele bese ishaywa ebhodini lesifunda elihlanganiswe nezingxenye, ukuze i-solder ezinhlangothini zombili zezingxenye izoncibilika futhi ibophe i-motherboard.Siyini isakhiwo sesithando somlilo sokugeleza kabusha?Sicela ubone okulandelayo:
I-ovini yokugeleza kabusha ngokuyinhloko yakhiwe uhlelo lokugeleza komoya, uhlelo lokushisa, uhlelo lokupholisa, uhlelo lokudlulisela, uhlelo lokubuyisela i-flux, ukwelashwa kwegesi yokukhipha kanye nedivayisi yokutakula, idivayisi yokuphakamisa umoya we-cap, idivayisi yokukhipha kanye nezinye izakhiwo kanye nezakhiwo zokuma.

I. Uhlelo lokugeleza komoya lwehhavini lokugeleza kabusha
Iqhaza lesistimu yokugeleza komoya ukusebenza kahle okuphezulu kokuhambisa, kufaka phakathi isivinini, ukugeleza, uketshezi kanye nokungena.

II.Gcwalisa kabusha isistimu yokushisa kahhavini
Isistimu yokushisa yakhiwe injini yomoya oshisayo, ishubhu yokushisa, i-thermocouple, i-solid state relay, idivayisi yokulawula izinga lokushisa nokunye.

III.Ukupholisa uhlelo lwereflow oven
Umsebenzi wesistimu yokupholisa ukupholisa i-PCB evuthayo ngokushesha.Ngokuvamile kunezindlela ezimbili: ukupholisa umoya nokupholisa amanzi.

IV.Reflow soldering machine drive system
Uhlelo lokudlulisa luhlanganisa ibhande elinenetha, ujantshi wesitimela, usekelo oluphakathi nendawo, iketango, imoto yezokuthutha, isakhiwo sokulungiswa kobubanzi bethrekhi, indlela yokulawula isivinini sokuthutha nezinye izingxenye.

Isistimu yokutakula ye-Flux ye-oven yokugeleza kabusha
I-Flux exhaust gas recovery system ngokuvamile ifakwe i-evaporator, ngokusebenzisa i-evaporator izoshisa igesi yokukhipha igesi ibe ngaphezu kuka-450 ℃, i-flux volatiles gasification, bese umshini wokupholisa amanzi ngemva kokujikeleza nge-evaporator, ugeleze ngokusebenzisa isizinda se-fan esiphezulu, ngokusebenzisa i-evaporator epholisa uketshezi ukugeleza ethangini lokubuyisela.

VI.Ukwelashwa kwegesi eyimfucuza kanye nedivayisi yokubuyisela kuhhavini lokugeleza kabusha
Inhloso yokwelashwa kwegesi engcolile kanye nedivaysi yokutakula ngokuyinhloko inamaphuzu amathathu: izidingo zokuvikelwa kwemvelo, ungavumeli ukuguquguquka kwe-flux ngqo emoyeni;Ukuqina kanye nemvula yegesi engcolile esithandweni sokugeleza kabusha kuzothinta ukugeleza komoya oshisayo futhi kunciphise ukusebenza kahle kwe-convection, ngakho-ke idinga ukugaywa kabusha.Uma isithando somlilo se-nitrogen sikhethiwe, ukuze kongiwe i-nitrogen, kuyadingeka ukugaywa kabusha i-nitrogen.I-Flux exhaust gas recovery system kumele ifakwe.

VII.Idivayisi yokunyusa umfutho womoya wekhava yangaphezulu yomshini wokuphinda ugeleze we-solder
Isembozo esiphezulu se-reflow soldering oven singavulwa sisonke ukuze kube lula ukuhlanzwa kwesithando somlilo se-reflow soldering.Lapho ipuleti liwa ngesikhathi sokugcinwa noma ukukhiqizwa kwesithando somlilo sokugeleza kabusha, isembozo esiphezulu sesithando somlilo sokugeleza kufanele sivulwe.

VIII.Isakhiwo somumo womshini wokugcwalisa kabusha
Isakhiwo sangaphandle sishiselwe ngeshidi lensimbi.