Ukucutshungulwa kwe-PCBA ngesilinganiso empeleni kuwumkhiqizo osuka enqubweni yangaphambili uye enqubweni elandelayo phakathi kwesikhathi esidingekayo ukuze udliwe, khona-ke isikhathi esincane, ukusebenza kahle okuphezulu, ukuphakama kwezinga lesivuno, ngemva kwakho konke, kuphela lapho umkhiqizo wakho ungenazo izinkinga. ukugelezela esinyathelweni esilandelayo.Ngalolu daba sikhuluma ngokukhiqizwa kwamalunga e-solder ku-PCBA welding edonsa ithiphu kanye nesixazululo:
1. Ibhodi lesifunda le-PCB ekushiseni kwesiteji sokushisa liphansi kakhulu, isikhathi sokushisa sifushane kakhulu, ukuze izinga lokushisa le-PCB nengxenye yedivayisi liphansi, izingxenye zokushisela kanye nokumuncwa kokushisa kwe-PCB okukhiqizwa ukuthambekela kwe-convex punch.
2. Izinga lokushisa lokushisela lokubekwa kwe-SMT liphansi kakhulu noma ijubane lebhande lokuthutha lishesha kakhulu, ukuze i-viscosity ye-solder encibilikisiwe ibe nkulu kakhulu.
3. Iphampu ye-electromagnetic wave wave soldering machine ukuphakama kuphezulu kakhulu noma iphinikhodi yinde kakhulu, ukuze iphansi lephini lingakwazi ukuthintana nenani eliphakeme lamagagasi.Ngoba umshini wokugcwalisa i-wave wave wave we-electromagnetic ungamagagasi angenalutho, ugqinsi lwamagagasi angenalutho luyi-4 ~ 5mm.
4. Umsebenzi wokuguquguquka ongemuhle.
5. Izingxenye ze-cartridge ze-DIP ububanzi bokuhola kanye nesilinganiso sembobo ye-cartridge akulungile, imbobo ye-cartridge inkulu kakhulu, ukumunca ukushisa kwephedi enkulu.
Amaphuzu enkinga angenhla ayizici ezibaluleke kakhulu ekukhiqizeni ithiphu yokudonsa ngokuhlanganyela kwe-solder, ngakho-ke kufanele senze ukulungiselelwa okuhambisanayo nokulungiswa kwezinkinga ezingenhla ekucubungulweni kokubekwa kwe-smt, ukuxazulula inkinga ngaphambi kokuba yenzeke, ukuqinisekisa isivuno somkhiqizo kanye isivinini sokulethwa.
1. Izinga lokushisa likathayela lika-250 ℃ ± 5 ℃, isikhathi sokushisela 3 ~ 5s;izinga lokushisa liphansi kancane, ijubane lebhande lokuthutha linciphisa abanye.
2. ukuphakama kwegagasi ngokuvamile kulawulwa ku-2/3 wobukhulu bebhodi eliphrintiwe.Ukwakhiwa kwephinikhodi efakiwe kudinga izikhonkwane zengxenye ukuthi zivezwe kokuphrintiwe
3. Ibhodi le-soldering surface 0.8mm~3mm.
4. Ukushintshwa kwe-flux.
5. I-diameter yembobo yembobo ye-cartridge inkulu ngo-0.15 ~ 0.4mm kunobubanzi bomthofu (umthofu omuhle thatha umugqa ophansi, umthofu owugqinsi uthathe umkhawulo ongaphezulu).
Izici ze-NeoDen IN6 Reflow Oven
1. I-convection egcwele, ukusebenza kahle kwe-soldering.
2. Idizayini yezindawo ezi-6, ilula futhi ihlangene.
3. Ukulawula okuhlakaniphile okunenzwa yokushisa ezwelayo ephezulu, izinga lokushisa lingakwazi ukuzinza ngaphakathi kuka-+ 0.2℃.
4. Isistimu yokuhlunga intuthu ehlanganisiwe yokuqala eyakhelwe ngaphakathi, ukubukeka okuhle kanye ne-eco-friendly.
5. Idizayini yokuvikela ukuvikela ukushisa, izinga lokushisa le-casing lingalawulwa ngaphakathi kwama-40 ℃.
6. Ukunikezwa kwamandla kwasekhaya, kulula futhi kuyasebenziseka.
Isikhathi sokuthumela: Jun-20-2023