1. Uhlangothi lwenqubo lwenzelwe ohlangothini olufushane.
2. Izingxenye ezifakwe eduze kwegebe zingase zonakaliswe lapho ibhodi lisikwa.
3. Ibhodi le-PCB lenziwe ngezinto ze-TEFLON ezinogqinsi luka-0.8mm.Impahla ithambile futhi kulula ukuyikhubaza.
4. I-PCB isebenzisa inqubo yokuklama i-V-cut kanye ne-slot ende yohlangothi lokudlulisela.Ngenxa yokuthi ububanzi bengxenye yokuxhuma buyi-3mm kuphela, futhi kukhona ukudlidliza kwekristalu okusindayo, isokhethi nezinye izingxenye ze-plug-in ebhodini, i-PCB izophuka ngesikhathi.reflow ovenukushisela, futhi ngezinye izikhathi isenzakalo sokuphuka ohlangothini lokudlulisela kwenzeka ngesikhathi sokufakwa.
5. Ubukhulu bebhodi le-PCB buyi-1.6mm kuphela.Izingxenye ezisindayo ezifana nemojuli yamandla kanye nekhoyili zibekwe phakathi nobubanzi bebhodi.
6. I-PCB yokufaka izingxenye ze-BGA yamukela umklamo webhodi we-Yin Yang.
a.Ukuguqulwa kwe-PCB kubangelwa idizayini yebhodi ye-Yin ne-Yang yezingxenye ezinzima.
b.I-PCB yokufaka i-BGA ehlanganisiwe ithatha idizayini yepuleti ye-Yin ne-Yang, okuholela ekuhlanganiseni okungathembekile kwe-BGA solder
c.Ipuleti elimise okukhethekile, ngaphandle kokuhlanganisa isinxephezelo, lingafaka okokusebenza ngendlela edinga ukufakwa kwamathuluzi futhi kwenyuse izindleko zokukhiqiza.
d.Wonke amabhodi amane okuhlanganisa asebenzisa indlela yokuhlanganisa imbobo yesitembu, enamandla aphansi kanye nokuguqulwa okulula.
Isikhathi sokuthumela: Sep-10-2021