Iyini Inqubo ye-SPI?

Ukucubungula kwe-SMD kuyinqubo yokuhlola engenakugwenywa, i-SPI (I-Solder Paste Inspection) inqubo yokucubungula ye-SMD iyinqubo yokuhlola, esetshenziselwa ukuthola ikhwalithi yokuphrinta kwe-solder yokunamathisela okuhle noma okubi.Kungani udinga imishini ye-spi ngemuva kokuphrinta kokunamathisela kwe-solder?Ngoba idatha evela embonini mayelana ne-60% yekhwalithi ye-solder ibangelwa ukuphrinta kwe-solder okungalungile (okusele kungase kuhlobane ne-patch, inqubo yokugeleza kabusha).

I-SPI ukutholwa kokuphrinta okunamathiselwe kwe-solder okubi,Umshini we-SMT SPIitholakala ngemuva komshini wokuphrinta we-solder unama, lapho i-solder inama ngemva kokuphrinta ucezu lwe-pcb, ngokuxhunywa kwetafula elihambisa impahla emishini yokuhlola ye-SPI ukuze ibone ikhwalithi yayo yokunyathelisa ehlobene.

I-SPI ingathola ukuthi yiziphi izinkinga ezimbi?

1. Ukuthi i-solder paste iyithini

I-SPI ingakwazi ukubona ukuthi ithini yokunyathelisa yomshini wokunyathelisa we-solder unamathisele, uma i-pcb eseduze namaphedi ngisho ne-tin, izoholela kalula kumjikelezo omfushane.

2. Namathisela offset

I-solder paste offset isho ukuthi ukuphrinta kwe-solder paste akuphrintiwe ku-pcb pads (noma ingxenye kuphela ye-solder paste ephrintiwe kuma-pads), i-solder paste printing offset ingase iholele ekuhlanganisweni okungenalutho noma isikhumbuzo esimile kanye nezinye ikhwalithi embi.

3. Thola ubukhulu be-solder paste

I-SPI ibona ubukhulu bokunamathisela kwe-solder, ngezinye izikhathi inani le-solder paste liningi kakhulu, ngezinye izikhathi inani le-solder paste lincane, lesi simo sizobangela i-welding soldering noma i-welding engenalutho.

4. Ukubona flatness we solder unama

I-SPI ithola ukuqina kokunamathisela kwe-solder, ngoba umshini wokunyathelisa we-solder unamathisele uzodilizwa ngemva kokunyathelisa, ezinye zizobonakala zidonsa ithiphu, lapho ukufudumala kungesona isikhathi esifanayo, kulula ukubangela izinkinga zekhwalithi ye-welding.

I-SPI iyibona kanjani ikhwalithi yokuphrinta?

I-SPI ingenye yemishini yomtshina obonayo, kodwa futhi ngokusebenzisa ama-algorithms wesistimu ye-optical kanye nekhompiyutha ukuqedela isimiso sokutholwa, ukuphrinta kokunamathisela kwe-solder, ukuhlola nge-lens yangaphakathi yekhamera ebusweni bekhamera ukuze kukhishwe idatha, bese ukuqashelwa kwe-algorithm kuhlanganiswa. ukutholwa kwesithombe, bese ngedatha yesampula elungile ukuze kuqhathaniswe, uma kuqhathaniswa nokulungile kuze kufike ezingeni kuzonqunywa njengebhodi elihle, uma kuqhathaniswa nokulungile akukhishelwanga i-alamu, ochwepheshe bangaba Ochwepheshe bangasusa ngokuqondile okunesici. amabhodi avela ebhandeni lokuthutha

Kungani ukuhlolwa kwe-SPI kuya kudume kakhulu?

Okusanda kushiwo ukuthi amathuba okushisela amabi ngenxa yokuphrinta kokunamathisela kwe-solder okubangelwa ngaphezu kuka-60%, uma kungenjalo ngemva kokuhlolwa kwe-spi ukunquma okubi, kuyoba ngqo ngemuva kwe-patch, inqubo yokuphinda i-solder, lapho kuqedwa ukushisela bese kuthi ngemva kwe-aoi. ukuhlolwa kutholakale kubi, ngakolunye uhlangothi, ukugcinwa kwezinga lenkathazo kuyoba kubi kakhulu kune-spi ukucacisa isikhathi senkathazo embi (i-SPI isahlulelo sokunyathelisa okubi, ngokuqondile kusukela ebhande lokudlulisa ukuze ukhiphe, ugeze unamathisele) , ngakolunye uhlangothi, ngemva kokushisela, ibhodi elibi lingasetshenziswa futhi, futhi ngemva kokushisela, uchwepheshe angakwazi ukwehlisa ngokuqondile ibhodi elibi ebhandeni lokuthutha.Ingasetshenziswa futhi), ngaphezu kokulungisa ukushisela kuzodala ukumoshwa kwabasebenzi, izinto ezibonakalayo kanye nezimali.