I. Liyini ibhodi le-HDI?
Ibhodi le-HDI (I-High Density Interconnector), okungukuthi, ibhodi lokuxhumanisa elinomthamo omkhulu, ukusetshenziswa kobuchwepheshe bembobo egqitshiwe engaboni kahle, ibhodi lesifunda elinomthamo omkhulu wokusatshalaliswa komugqa.Ibhodi le-HDI linomugqa wangaphakathi nomugqa wangaphandle, bese kusetshenziswa ukumba, i-metalization yemigodi nezinye izinqubo, ukuze ungqimba ngalunye lomugqa wokuxhumana kwangaphakathi.
II.umehluko phakathi kwebhodi le-HDI ne-PCB evamile
Ibhodi le-HDI ngokuvamile likhiqizwa kusetshenziswa indlela yokuqongelela, uma izingqimba eziningi, izinga lobuchwepheshe lebhodi liphakeme.Ibhodi le-HDI elivamile ngokuyisisekelo liyi-laminated isikhathi esingu-1, i-HDI yezinga eliphezulu lisebenzisa izikhathi ezingu-2 noma ngaphezulu ubuchwepheshe be-lamination, kuyilapho ukusetshenziswa kwezimbobo ezinqwabelene, izimbobo zokugcwalisa, ukubhoboza okuqondile kwe-laser kanye nobunye ubuchwepheshe obuphambili be-PCB.Uma ukuminyana kwe-PCB kukhuphuka ukudlula ibhodi enezingqimba eziyisishiyagalombili, izindleko zokukhiqiza nge-HDI zizoba ngaphansi kunenqubo evamile yokulinganisa umshini oyinkimbinkimbi.
Ukusebenza kukagesi nokunemba kwesignali yamabhodi e-HDI kuphakeme kunama-PCB endabuko.Ngaphezu kwalokho, amabhodi e-HDI anokuthuthukiswa okungcono kwe-RFI, i-EMI, ukukhishwa kwe-static, ukuqhutshwa kwe-thermal, njll. Ubuchwepheshe be-High Density Integration (HDI) bungenza umklamo womkhiqizo wokugcina ube mncane kakhulu, kuyilapho uhlangabezana namazinga aphezulu okusebenza kwe-elekthronikhi nokusebenza kahle.
III.izinto zebhodi ze-HDI
Izinto ze-HDI PCB zibeka phambili ezinye izimfuneko ezintsha, ezihlanganisa ukuzinza okungcono kohlangothi, ukuhamba okungahambisani ne-static nokunganamatheli.izinto ezijwayelekile ze-HDI PCB yi-RCC (ithusi elihlanganiswe ne-resin).kunezinhlobo ezintathu ze-RCC, okuyifilimu ye-polyimide metalized, ifilimu ye-polyimide ehlanzekile, nefilimu ye-polyimide ephonsiwe.
Izinzuzo ze-RCC zifaka: ukushuba okuncane, isisindo esilula, ukuguquguquka nokuvutha, izici zokuhambisana ne-impedance kanye nokuzinza okuhle kakhulu kwe-dimensional.Enqubweni ye-HDI ye-multilayer PCB, esikhundleni seshidi le-bonding lendabuko kanye ne-foil yethusi njenge-insulating medium and conductive layer, i-RCC ingacindezelwa ngamasu okucindezela avamile ngama-chips.Izindlela zokumba okungezona ezomshini njenge-laser zibe sezisetshenziswa ukuze kwakhiwe ukuxhumana kwe-micro-through-hole.
I-RCC ishayela ukwenzeka nokuthuthukiswa kwemikhiqizo ye-PCB isuka ku-SMT (Surface Mount Technology) iye ku-CSP (Chip Level Packaging), isuka emshinini wokumba iye ekubholeni nge-laser, futhi ikhuthaza ukuthuthukiswa nokuthuthuka kwe-PCB microvia, konke okuba yi-HDI PCB impahla ehamba phambili. kwe-RCC.
Ku-PCB yangempela enqubweni yokukhiqiza, ekukhethweni kwe-RCC, kuvame ukuba ne-FR-4 ejwayelekile Tg 140C, FR-4 high Tg 170C kanye ne-FR-4 kanye nenhlanganisela ye-laminate ye-Rogers, esetshenziswa kakhulu namuhla.Ngokuthuthukiswa kobuchwepheshe be-HDI, izinto ze-HDI PCB kufanele zihlangabezane nezidingo ezengeziwe, ngakho-ke izitayela eziyinhloko zezinto ze-HDI PCB kufanele zibe
1. Ukuthuthukiswa kanye nokusetshenziswa kwezinto eziguquguqukayo ngaphandle kokunamathela
2. Ugqinsi lwengqimba ye-dielectric encane kanye nokuchezuka okuncane
3 .ukuthuthukiswa kwe-LPIC
4. Ama-dielectric constants amancane namancane
5. Ukulahlekelwa okuncane nokuncane kwe-dielectric
6. Ukuzinza okuphezulu kwe-solder
7. Ihambisana ngokuqinile ne-CTE (i-coefficient yokunwetshwa kwe-thermal)
IV.ukusetshenziswa kobuchwepheshe bokukhiqiza ibhodi le-HDI
Ubunzima bokwenziwa kwe-HDI PCB buncane ngokukhiqiza, ngokusebenzisa i-metallization nemigqa emihle.
1. Ukukhiqizwa kwe-Micro-through-hole
Ukukhiqizwa kwe-Micro-through-hole kube yinkinga eyinhloko yokukhiqizwa kwe-HDI PCB.Kunezindlela ezimbili eziyinhloko zokumba.
a.Ngokumba okuvamile ngembobo, ukubhola ngomshini kuhlala kuyisinqumo esingcono kakhulu sokusebenza kahle kwakho okuphezulu kanye nezindleko eziphansi.Ngokuthuthuka kwekhono lokwenza imishini, ukusetshenziswa kwayo ku-micro-through-hole nakho kuyavela.
b.Kunezinhlobo ezimbili zokumba nge-laser: i-photothermal ablation kanye ne-photochemical ablation.Owokuqala ubhekisela enqubweni yokushisisa okokusebenza ukuze kuncibilike futhi kuhwamuke ngembobo edlulayo eyakhiwe ngemva kokumuncwa kwamandla aphezulu kwe-laser.Lokhu kokugcina kubhekisela kumphumela wama-photon anamandla aphezulu endaweni ye-UV kanye nobude be-laser obudlula u-400 nm.
Kunezinhlobo ezintathu zamasistimu e-laser asetshenziselwa amaphaneli aguquguqukayo naqinile, okuyi-excimer laser, i-UV laser drilling, ne-CO 2 laser.Ubuchwepheshe be-Laser abufanele nje kuphela ukubhoboza, kodwa futhi ukusika nokwenza.Ngisho nabanye abakhiqizi benza i-HDI nge-laser, futhi nakuba imishini yokumba i-laser ibiza kakhulu, inikeza ukunemba okuphezulu, izinqubo ezinzile kanye nobuchwepheshe obufakazelwe.Izinzuzo zobuchwepheshe be-laser ziyenza ibe indlela esetshenziswa kakhulu ekukhiqizeni okungaboni/okungcwatshwa ngembobo.Namuhla, ama-99% emigodi ye-HDI microvia atholakala ngokumba nge-laser.
2. Ngokusebenzisa i-metallization
Ubunzima obukhulu bokwenza i-metalization ye- through-hole ubunzima bokuthola ukucwecwa okufanayo.Ukuze uthole ubuchwepheshe bokufaka umgodi ojulile wezimbobo ezincane, ngaphezu kokusebenzisa isixazululo sokucwenga esinekhono eliphezulu lokuhlakazeka, isisombululo se-plating kudivayisi yokucwenga kufanele sithuthukiswe ngesikhathi, esingenziwa ngokunyakazisa okuqinile kwemishini noma ukudlidliza, ukunyakazisa kwe-ultrasonic, futhi ukufutha okuvundlile.Ngaphezu kwalokho, umswakama wodonga lwembobo kufanele ukhuphuke ngaphambi kokucwenga.
Ngokungeziwe ekuthuthukisweni kwenqubo, izindlela ze-HDI ngokusebenzisa imbobo ye-metalization zibone intuthuko kubuchwepheshe obukhulu: ubuchwepheshe bokwengeza amakhemikhali, ubuchwepheshe bokucwenga obuqondile, njll.
3. Ulayini Omuhle
Ukuqaliswa kwemigqa emihle kuhlanganisa ukudluliswa kwesithombe okuvamile kanye ne-laser imaging eqondile.Ukudluliswa kwesithombe okuvamile kuyinqubo efanayo ne-etching yamakhemikhali evamile ukuze kwakhe imigqa.
Ukuze uthole isithombe esiqondile nge-laser, alikho ifilimu yezithombe edingekayo, futhi isithombe senziwa ngokuqondile efilimini ye-photosensitive nge-laser.Ukukhanya kwegagasi le-UV kusetshenziselwa ukusebenza, okwenza izixazululo zokuvikela uketshezi zihlangabezane nezidingo zokuxazulula okuphezulu nokusebenza okulula.Ayikho ifilimu yezithombe edingekayo ukuze kugwenywe imiphumela engathandeki ngenxa yokulimala kwefilimu, okuvumela ukuxhumana okuqondile ku-CAD/CAM kanye nokufinyeza umjikelezo wokukhiqiza, okuyenza ifanelekele ukukhiqizwa okulinganiselwe nokuningi.
I-Zhejiang NeoDen Technology Co., LTD., eyasungulwa ngo-2010, ingumkhiqizi ochwepheshe okhethekile emshinini wokukhetha nendawo we-SMT,reflow oven, umshini wokunyathelisa we-stencil, ulayini wokukhiqiza we-SMT nokunyeImikhiqizo ye-SMT.Sineqembu lethu le-R & D kanye nemboni yethu, sisebenzisa i-R&D yethu ecebile enokuhlangenwe nakho, ukukhiqizwa okuqeqeshwe kahle, sazuza idumela elihle kumakhasimende omhlaba wonke.
Kule minyaka eyishumi, sithuthukise ngokuzimela i-NeoDen4, i-NeoDen IN6, i-NeoDen K1830, i-NeoDen FP2636 kanye neminye imikhiqizo ye-SMT, eyathengiswa kahle emhlabeni wonke.
Sikholelwa ukuthi abantu abakhulu nozakwethu benza i-NeoDen inkampani enhle futhi ukuzibophezela kwethu Ekusunguleni, Ukuhlukahluka kanye Nokusimama kuqinisekisa ukuthi i-SMT automation ifinyeleleka kuwo wonke umuntu wokuzilibazisa kuyo yonke indawo.
Isikhathi sokuthumela: Apr-21-2022