Yini i-Bridging

Ukubhula

Ukuxhumeka kwebhuloho kungenye yeziphambeko ezivamile ekukhiqizweni kwe-SMT.Izodala isifunda esifushane phakathi kwezingxenye, futhi kufanele ilungiswe lapho ihlangana nokuxhumeka kwebhuloho.Kunezizathu eziningi zokuxhunywa kwebhuloho

1) Izinkinga zekhwalithi zokunamathisela kwe-solder

① Okuqukethwe kwensimbi ekunamathisele kwi-solder kuphezulu, ikakhulukazi uma isikhathi sokuphrinta siside kakhulu, kulula ukukhuphula okuqukethwe kwensimbi, okuholela ekubhujisweni kwephini le-IC;

② I-solder paste ine-viscosity ephansi futhi iphuphuma ngaphandle kwe-solder pad ngemva kokushisa kwangaphambili;

③ Ukwehla kombhoshongo we-solder paste akulungile, futhi kuchichima ngaphandle kwe-solder pad ngemva kokushisa kwangaphambili;

Isixazululo: lungisa inani le-solder paste noma sebenzisa unamathisele we-solder wekhwalithi ephezulu.

2) Uhlelo lokuphrinta

① Ukunemba okuphindaphindiwe komshini wokunyathelisa akulungile, futhi ukuqondanisa akulungile (ukuqondanisa ipuleti lensimbi akukuhle, ukuqondanisa kwe-PCB akukuhle), okubangela ukunamathisela kwe-solder ukuthi kuphrintwe ngaphandle kwephedi, ikakhulukazi iphimbo elihle le-QFP pad;

② Usayizi nogqinsi lwefasitela lesifanekiso akwakhiwanga ngendlela efanele, futhi ingxubevange ye-Sn Pb yedizayini yephedi ye-PCB ayifani, okuholela ekunamekelweni kwe-solder ngokweqile.

Isixazululo: lungisa iphrinta futhi uthuthukise i-PCB pad coating.

I-3) Kuyisizathu esivamile ekukhiqizeni ukuthi i-solder paste igeleza ngokugcwele ngemva kokucindezelwa ngenxa yokucindezela okukhulu.Ngaphezu kwalokho, uma ukunemba kokubeka kunganele, izingxenye zizoshintsha futhi amaphini we-IC azokonakala.

I-4) Isilinganiso sokushisa kwesithando somlilo sokugeleza sishesha kakhulu, i-solvent in solder paste ayinaso isikhathi sokuvutha.

Isixazululo: lungisa ubude be-axis engu-Z ye-SMT kanye nezinga lokushisa lesithando somlilo esigeleza kabusha.

I-athikili nezithombe ezivela ku-inthanethi, uma kukhona ukwephulwa komthetho pls okokuqala xhumana nathi ukuze ukususe.
I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.

I-Hangzhou NeoDen Technology Co., Ltd

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I-imeyili:info@neodentech.com