Iyini i-BGA welding

I-BGA Welding, ngokumane iwucezu lokunamathisela olunezinto ze-BGA zebhodi lesifunda, ngokusebenzisareflow oveninqubo ukuze kuzuzwe Welding.Lapho i-BGA ilungiswa, i-BGA iphinde ifakwe ngesandla, futhi i-BGA ihlakazwa futhi ihlanganiswe netafula lokulungisa le-BGA namanye amathuluzi.
Ngokusho kwejika lokushisa,reflow soldering umshiniingahlukaniswa izigaba ezine: indawo yokushisa kuqala, indawo yokugcina ukushisa, indawo yokugeleza kabusha nendawo yokupholisa.

1. Indawo yokushisa
Eyaziwa nangokuthi indawo yerempu, isetshenziselwa ukuphakamisa izinga lokushisa le-PCB ukusuka kuzinga lokushisa elizungezile kuya kumazinga okushisa asebenzayo.Kulesi sifunda, ibhodi lesifunda kanye nengxenye inamandla okushisa ahlukene, futhi izinga lawo langempela lokukhuphuka kwezinga lokushisa lihlukile.

2. Indawo yokushisa eshisayo
Ngezinye izikhathi ibizwa ngokuthi indawo eyomile noma emanzi, le ndawo ngokuvamile ihlanganisa amaphesenti angu-30 kuya kwangu-50 wendawo yokushisa.Inhloso eyinhloko yendawo esebenzayo ukuzinzisa izinga lokushisa lezingxenye ku-PCB kanye nokunciphisa ukuhluka kwezinga lokushisa.Vumela isikhathi esanele kule ndawo ukuze ingxenye yamandla okushisa ifinyelele izinga lokushisa lengxenye encane futhi uqinisekise ukuthi ukugeleza ku-solder paste kuhwamuka ngokuphelele.Ekupheleni kwendawo esebenzayo, ama-oxides kuma-pads, amabhola e-solder, nezikhonkwane zezingxenye ziyasuswa, futhi izinga lokushisa lebhodi lonke lilinganiselwe.Kumele kuqashelwe ukuthi zonke izingxenye ze-PCB kufanele zibe nezinga lokushisa elifanayo ekupheleni kwale ndawo, ngaphandle kwalokho ukungena endaweni ye-reflux kuzodala izenzakalo ezihlukahlukene ezimbi zokushisela ngenxa yokushisa okungalingani kwengxenye ngayinye.

3. Indawo ye-Reflux
Ngezinye izikhathi ibizwa ngokuthi indawo yokushisa ephezulu noma yokugcina, le zoni isetshenziselwa ukuphakamisa izinga lokushisa le-PCB lisuka kuzinga lokushisa elisebenzayo liye kuzinga lokushisa eliphakeme elinconyiwe.Izinga lokushisa elisebenzayo lihlala liphansi kancane kunephuzu lokuncibilika le-alloy, futhi izinga lokushisa eliphakeme lihlala lisendaweni yokuncibilika.Ukusetha izinga lokushisa kule ndawo libe phezulu kakhulu kuzodala ukukhuphuka kwezinga lokushisa kudlule u-2 ~ 5 ℃ ngomzuzwana, noma kwenze izinga lokushisa eliphakeme le-reflux libe ngaphezu kwalokho okutuswayo, noma ukusebenza isikhathi eside kungabangela ukugogeka ngokweqile, ukuncipha noma ukushiswa kwesikhumba. PCB, futhi kulimaze ubuqotho bezingxenye.Izinga lokushisa eliphakeme le-reflux liphansi kunalokho okunconyiwe, futhi ukushisela okubandayo nokunye ukukhubazeka kungenzeka uma isikhathi sokusebenza sisifushane kakhulu.

4. Indawo yokupholisa
I-tin alloy powder ye-solder paste kule ndawo incibilikile futhi yamanzisa ngokuphelele indawo ukuze ihlanganiswe futhi kufanele ipholile ngokushesha ngangokunokwenzeka ukuze kube lula ukwakheka kwamakristalu e-alloy, i-solder ekhanyayo ehlangene, ukuma okuhle kanye ne-Angle yokuxhumana ephansi. .Ukupholisa kancane kubangela ukungcola okuningi kwebhodi ukuba kuphule ethini, okuholela ekubeni buthuntu, amachashaza okuthengisa amabi.Ezimweni ezimbi kakhulu, kungase kubangele ukunamathiswa kahle kwe-tin kanye nokuhlangana okubuthakathaka kwe-solder.

I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.

I-Zhejiang NeoDen Technology Co., Ltd

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