Isicelo seUmshini wokuhlola we-SMT X-ray- Ukuhlola Chips

Inhloso kanye nendlela yokuhlolwa kwe-chip

Injongo eyinhloko yokuhlolwa kwe-chip ukuthola izici ezithinta ikhwalithi yomkhiqizo kunqubo yokukhiqiza kusenesikhathi nokuvimbela ukukhiqizwa kwenqwaba okungabekezeleleki, ukulungiswa nokulahlwa.Lena indlela ebalulekile yokulawula ikhwalithi yenqubo yomkhiqizo.Ubuchwepheshe bokuhlola i-X-RAY obune-fluoroscopy yangaphakathi busetshenziselwa ukuhlola okungonakali futhi ngokuvamile busetshenziselwa ukuthola amaphutha ahlukahlukene kumaphakheji we-chip, njengokuxebuka kwesendlalelo, ukuphuka, ukuvaleka kanye nobuqotho bebhondi yomthofu.Ngaphezu kwalokho, ukuhlolwa kwe-X-ray okungabhubhisi kungaphinda kubheke iziphambeko ezingase zenzeke phakathi nokukhiqizwa kwe-PCB, njengokungaqondani kahle kahle noma ukuvuleka kwebhuloho, izikhindi noma ukuxhumana okungavamile, futhi kubone ubuqotho bamabhola e-solder ephaketheni.Ayitholi nje kuphela amalunga e-solder angabonakali, kodwa futhi ihlaziya imiphumela yokuhlola ngekhwalithi nangobuningi ukuze kutholwe izinkinga kusenesikhathi.

Umgomo wokuhlolwa kwe-chip wobuchwepheshe be-X-ray

Imishini yokuhlola i-X-RAY isebenzisa ishubhu ye-X-ray ukuze ikhiqize ama-X-ray ngesampula ye-chip, evezwa kumamukeli wesithombe.Imifanekiso yayo enencazelo ephezulu ingakhuliswa ngokuhlelekile izikhathi eziyi-1000, ngaleyo ndlela ivumele ukwakheka kwangaphakathi kwe-chip ukuba kwethulwe ngokucace kakhudlwana, inikeze indlela ephumelelayo yokuhlola ukuze kuthuthukiswe “izinga lokudlula kanye” kanye nokufeza umgomo othi “ziro amaphutha”.

Eqinisweni, ebusweni bemakethe ibonakala ingokoqobo kakhulu kodwa isakhiwo sangaphakathi salawo ma-chips sinamaphutha, kusobala ukuthi awakwazi ukuhlukaniswa ngeso lenyama.Kuphela ngaphansi kokuhlolwa kwe-X-ray lapho "i-prototype" ingavezwa.Ngakho-ke, imishini yokuhlola i-X-ray inikeza isiqinisekiso esanele futhi idlala indima ebalulekile ekuhlolweni kwama-chips ekukhiqizeni imikhiqizo ye-elekthronikhi.

Izinzuzo zomshini we-PCB x ray

1. Izinga lokufakwa kweziphambeko zenqubo lifika kuma-97%.Amaphutha angahlolwa ahlanganisa: i-solder yamanga, uxhumano lwebhuloho, indawo yethebhulethi, i-solder enganele, izimbobo zomoya, ukuvuza kwedivayisi nokunye.Ikakhulukazi, i-X-RAY ingaphinda ihlole i-BGA, i-CSP namanye amadivaysi afihliwe ahlanganisiwe e-solder.

2. Ukuhlolwa okuphezulu.I-X-RAY, imishini yokuhlola ku-SMT, ingahlola izindawo ezingenakuhlolwa ngeso lenyama kanye nokuhlolwa komugqa.Isibonelo, i-PCBA ibhekwa njengenephutha, okusolwa ukuthi i-PCB ikhefu lokuqondisa ungqimba lwangaphakathi, i-X-RAY ingabhekwa ngokushesha.

3. Isikhathi sokulungiselela ukuhlolwa sincishiswe kakhulu.

4. Ingakwazi ukubona ukukhubazeka okungenakutholwa ngokuthembekile ngezinye izindlela zokuhlola, njengalezi: i-solder engamanga, izimbobo zomoya kanye nokubunjwa okubi.

5. Imishini yokuhlola i-X-RAY yamabhodi anezinhlangothi ezimbili kanye nasekaya kaningi kanye kuphela (nomsebenzi we-delamination).

6. Nikeza ulwazi olufanele lwesilinganiso olusetshenziselwa ukuhlola inqubo yokukhiqiza ku-SMT.Njengokuqina kwe-solder paste, inani le-solder ngaphansi kwe-solder joint, njll.