Wenzani Umshini Wokulungisa I-BGA?

Isethulo sesiteshi sokuthengisa se-BGA

Isiteshi sokuthengisa se-BGAngokuvamile ibizwa nangokuthi isiteshi se-BGA rework, okuyisisetshenziswa esikhethekile esisetshenziswa kuma-chips e-BGA anezinkinga zokunamathisela noma lapho ama-chips e-BGA amasha edinga ukushintshwa.Njengoba imfuneko yokushisa ye-BGA chip welding iphakeme kakhulu, ngakho-ke ithuluzi lokushisa elijwayelekile alikwazi ukuhlangabezana nezidingo zalo.

Ithebula le-soldering le-BGA lisebenza nezingareflow ovenijika, ngakho-ke kuphumelela kakhulu ukwenza kabusha i-BGA, futhi izinga lempumelelo lingafinyelela ngaphezu kwe-98% uma lenziwa ngetafula elingcono lokunamathisela le-BGA.

Ukuhlukaniswa kwethebula le-BGA rework

1. Imodeli yezandla

Uma i-BGA ibekwe ku-PCB, incike kokuhlangenwe nakho komsebenzisi ukuthi uyinamathisele ngokuya ngohlaka lokuphrinta kwesikrini ku-PCB, elungele ukusebenza kabusha kwe-chip ye-BGA nge-BGA solder ball pitch enkulu (ngaphezulu kuka-0.6).Ngaphandle kwejika lokushisa lapho ukushisisa kwenziwa ngokuzenzakalelayo, yonke eminye imisebenzi idinga ukusebenza mathupha.

2. Imodeli ezenzakalelayo

I-BGA tin ball pitch incane kakhulu (0.15-0.6) ama-chips e-BGA ngokuya esichibini azoba namaphutha futhi abangele kalula ukushisela okubi.Umgomo wokuqondanisa obonakalayo ukusebenzisa isistimu ye-spectroscopic imaging prism ukukhulisa amalunga e-BGA solder namaphedi e-PCB, ukuze izithombe zabo ezikhulisiwe zidlulelane ngemva kokupeshwa okuqondile, okuzogwema amaphutha enzeke ekupeshini.Isistimu yokushisisa izosebenza ngokuzenzakalelayo ngemva kokuqedwa kokuchibiyela, futhi kuzoba nokwaziswa kwe-alamu ye-buzzer ngemva kokuqeda ukushisela.

3. Imodeli ezenzakalelayo

Njengoba igama lisho, le modeli iyisistimu yokusebenza kabusha ezenzakalelayo ngokuphelele, esekelwe ekuqondaneni komshini kwalokhu buchwepheshe obuphezulu bezindlela zobuchwepheshe ukuze kuzuzwe inqubo yokusebenza kabusha ezenzakalelayo ngokugcwele.

Isiteshi se-NeoDen BGA Rework

Ukunikezwa kwamandla: AC220V±10%, 50/60HZ

Amandla: 5.65KW(Max),I-heater ephezulu (1.45KW)

Isishicileli esingaphansi (1.2KW), IR Preheater (2.7KW), Okunye(0.3KW)

PCB Usayizi: 412*370mm(Max); 6*6mm(Min)

I-BGA Chip Usayizi: 60*60mm(Max); 2*2mm(Min)

IR heater Usayizi: 285 * 375mm

Inzwa yokushisa: 1 pcs

Indlela yokusebenza: 7″ isikrini sokuthinta se-HD

Uhlelo Lokulawula: Isistimu yokulawula ukushisa okuzenzakalelayo V2 (i-software copyright)

Isistimu yokubonisa: 15″ SD isibonisi sezimboni (720P isikrini sangaphambili)

Uhlelo Lokuqondanisa: I-2 Million Pixel SD imaging system yedijithali, ukusondeza okuzenzakalelayo kokubona ngelaser: inkomba yamachashazi abomvu

I-Vacuum Adsorption: Okuzenzakalelayo

Ukunemba Kokuqondanisa: ±0.02mm

Ukulawula izinga lokushisa: Ukulawulwa kwe-thermocouple kohlobo lwe-K-loop ngokunemba kufika ku-±3℃

Idivayisi yokudla: Cha

Ukuma: I-V-groove ene-universal fixture

Ubukhulu: L685*W633*H850mm

Isisindo: 76KG