Ekucutshungulweni kwe-SMT, ama-PCB substrates ngaphambi kokuqala kokucutshungulwa, i-PCB izohlolwa futhi ihlolwe, ikhethwe ukuze ihlangabezane nezidingo zokukhiqiza ze-SMT ze-PCB, futhi abangafanelekile babuyiselwe kumphakeli we-PCB, izidingo ezithile ze-PCB zingadluliselwa kuzo. IPc-a-610c International General Electronics Industry Assembly Standards, okulandelayo ezinye zezidingo eziyisisekelo zokucubungula kwe-SMT kwe-PCB.
1. I-PCB kufanele ibe isicaba futhi ibushelelezi
Izidingo ezijwayelekile ze-PCB ziyisicaba futhi zibushelelezi, azikwazi ukusonteka, noma ekuphrinteni kwe-solder unama kanye nokubekwa komshini we-SMT kuzoveza umonakalo omkhulu, njengemiphumela yokuqhekeka.
2. I-conductivity eshisayo
Emshinini we-reflow soldering kanye nomshini we-wave soldering, kuzoba nendawo yokushisa, ngokuvamile ukushisa i-PCB ngokulinganayo, futhi ekushiseni okuthile, okungcono ukuqhutshwa kokushisa kwe-substrate ye-PCB, kukhiqiza okuncane kakhulu.
3. Ukumelana nokushisa
Ngokuthuthukiswa kwenqubo ye-SMT kanye nezidingo zemvelo, inqubo engenamthofu nayo iye yasetshenziswa kabanzi, kodwa futhi kubangelwa ukunyuka kwezinga lokushisa lokushisela, ukumelana nokushisa kwezidingo eziphakeme ze-PCB, inqubo engenamthofu ekuthengiseni kabusha, izinga lokushisa kufanele ukufinyelela 217 ~ 245 ℃, isikhathi sithatha 30 ~ 65s, ngakho jikelele PCB ukushisa ukumelana 260 degrees Celsius, futhi last 10s izidingo.
4. Ukunamathela kwe-foil yethusi
Amandla okubopha ucwecwe lwethusi kufanele afinyelele ku-1.5kg/cm² ukuvimbela i-PCB ekuweni ngenxa yamandla angaphandle.
5. Izindinganiso zokugoba
I-PCB inezindinganiso ezithile zokugoba, ngokuvamile ukuze ifinyelele ngaphezu kuka-25kg/mm
6. Good conductivity kagesi
I-PCB njengesithwali sezingxenye ze-elekthronikhi, ukuze kuzuzwe ukuxhumana phakathi kwezingxenye, ukuthembela emigqeni ye-PCB ukuqhuba, i-PCB akufanele ibe ne-conductivity enhle kagesi kuphela, futhi imigqa ye-PCB ephukile ayikwazi ukuhlanganisa ngokuqondile, noma ukusebenza kwawo wonke umkhiqizo. kuzodala umthelela omkhulu.
7. Ingakwazi ukumelana nokuwashwa kwe-solvent
I-PCB ekukhiqizeni, ukungcoliswa kalula, ngokuvamile idinga ukugeza amanzi ebhodi nezinye izincibilikisi zokuhlanza, ngakho-ke i-PCB kufanele ikwazi ukumelana nokugeza kwe-solvent, ngaphandle kokukhiqiza ama-bubbles nokunye ukusabela okubi.
Lezi ezinye zezidingo eziyisisekelo ze-PCB efanelekayo ekucutshungulweni kwe-SMT.
Isikhathi sokuthumela: Mar-11-2022