Yiziphi Izidingo Zokulawula Izinga lokushisa ze-Reflow Oven?

I-NeoDen IN12 Reflow Oven

1. Geza kabusha ihhaviniendaweni yokushisa ngayinye izinga lokushisa kanye nokuzinza kwesivinini se-chain, kungenziwa ngemva kwesithando somlilo futhi kuvivinywe ijika lokushisa, kusukela ekuqaliseni okubandayo umshini kuya ekushiseni okuzinzile ngokuvamile emaminithini angu-20 ~ 30.
2. Ochwepheshe bomugqa wokukhiqiza we-SMT kufanele barekhode ukulungiselelwa kwezinga lokushisa kwesithando somlilo kanye nesivinini seketango nsuku zonke noma kumkhiqizo ngamunye, futhi benze ukuhlolwa okulawulwayo kokulinganisa ijika lokushisa kwesithando somlilo njalo ukuze kuqashwe ukusebenza okuvamile kwesithando somlilo.i-reflow soldering.I-IPQC izokwenza ukuhlola nokuqondisa.
3. Izidingo zokusetha ijika lokushisa lejika le-solder elingenamthofu:
3.1 Ukusetha ijika lokushisa kusekelwe kakhulu kulokhu:
Ijika elinconyiwe elinikezwe umphakeli wokunamathisela we-solder.
B. PCB sheet impahla, ubukhulu kanye ukujiya.
C. Ukuminyana nobukhulu bezingxenye, njll.

3.2 Izimfuneko zokulungiselelwa kwezinga lokushisa lomlilo elingenamthofu:
3.2.1.Izinga lokushisa eliphakeme langempela lilawulwa ukusuka ku-243 ℃ ukuya ku-246 ℃, futhi ayikho i-BGA ne-QFN IC phakathi kwamabala ayi-100, futhi awukho umkhiqizo onosayizi wephedi phakathi kuka-3MM.
3.2.2.Emikhiqizweni enosayizi we-IC, QFN, BGA ne-PAD ngaphezu kuka-3MM nangaphansi kuka-6MM, izinga lokushisa eliphakeme elilinganisiwe lizolawulwa ku-245-247 degrees.
3.2.3 Kweminye imikhiqizo ye-PCB ekhethekile ene-IC, QFN, BGA noma i-PCB board ukujiya okungaphezu kuka-2MM kanye nosayizi we-PAD ongaphezu kuka-6MM, izinga lokushisa eliphakeme elilinganiselwe lingalawulwa ukusuka ku-247 kuya ku-252 degrees ngokuvumelana nezidingo zangempela.
3.2.4 Uma amapuleti akhethekile afana ne-FPC soft plate kanye ne-aluminium base plate noma izingxenye zinezidingo ezikhethekile, azolungiswa ngokuvumelana nesidingo sangempela (imiyalelo yenqubo yomkhiqizo ikhethekile, ezolawulwa ngokuvumelana neziyalezo zenqubo)
Ukuphawula: Ekusebenzeni kwangempela, uma kukhona okungavamile esithandweni somlilo, ochwepheshe be-SMT nonjiniyela bazonikeza impendulo ngokushesha.3.3 Izidingo eziyisisekelo zejika lokushisa:
A. Indawo yokushisa kuqala: ithambeka lokushisa kuqala ngu-1~3℃/SEC, futhi izinga lokushisa linyuselwe ku-140~150℃.
B. Indawo yokushisa ehlala njalo: 150℃~200℃, imizuzwana engu-60~120
C. Indawo ye-Reflux: ngaphezu kuka-217℃ amasekhondi angu-40~90, enenani eliphakeme elingu-230~255℃.
D. Indawo yokupholisa: indawo yokupholisa ingaphansi kuka-1~4℃/SEC (ngaphandle kwe-PPC ne-aluminium substrate, izinga lokushisa langempela lincike esimweni sangempela)