I-SMT ingenye yezingxenye eziyisisekelo zezingxenye ze-elekthronikhi, ezibizwa ngokuthi amasu okuhlangana angaphandle, ahlukaniswe angabikho iphinikhodi noma umthofu omfushane, ngokusebenzisa inqubo yokuphinda i-reflow soldering noma i-dip soldering ekuhlanganiseni kokushisela amasu omhlangano wesifunda, futhi manje isithandwa kakhulu imboni yokuhlanganisa i-elekthronikhi indlela.Ngenqubo yobuchwepheshe be-SMT yokukhweza izingxenye ezincane nezilula, ukuze ibhodi lesekethe liqedele umjikelezo ophezulu, izidingo ze-miniaturization, nazo ezisesicelweni samakhono okucubungula we-SMT phezulu.
I. SMT processing solder unama kudingekile ukuze unake
1. Izinga lokushisa eliqhubekayo: isinyathelo esiqandisini sokushisa esingu-5 ℃ -10 ℃, sicela ungehli ngaphansi kuka-0 ℃.
2. Iphelile isitoreji: kufanele ihambisane neziqondiso zesizukulwane sokuqala kuqala, ungafaki ukunamathisela kwe-solder efrijini isikhathi eside kakhulu.
3. Ukuqandisa: Friza inhlama ye-solder ngokwemvelo okungenani amahora angu-4 ngemva kokuyikhipha efrijini, ungasivali isivalo lapho iqhwa.
4. Isimo: Izinga lokushisa leshabhu ngu-25±2℃ kanti umswakama ohlobene ngu-45% -65%RH.
5. Okunamathiselwe kwe-solder endala: Ngemva kokuvula isivalo sesinyathelo sokunamathisela i-solder phakathi kwamahora angu-12 ukuze sisetshenziswe, uma udinga ukusigcina, sicela usebenzise ibhodlela elingenalutho elihlanzekile ukuze uligcwalise, bese livalwa futhi efrijini ukuze uligcine.
6. enanini lokunamathisela ku-stencil: okokuqala enanini le-solder unamathisele ku-stencil, ukuze uphrinte ukuzungezisa ungaweleli ukuphakama kwe-scraper ye-1/2 njengokuhle, hlola ngokucophelela, ukungeza ngenkuthalo izikhathi zokwengeza inani elincane.
II.Umsebenzi wokuphrinta we-chip we-SMT odingekayo ukuze unake
1. I-scraper: impahla ye-scraper ingcono kakhulu yokwamukela i-steel scraper, evumela ukuphrinta ku-PAD solder paste molding kanye nefilimu yokuhlubula.
I-angle ye-Scraper: ukuphrinta ngesandla kwe-45-60 degrees;ukuphrinta ngomshini ngamadigri angama-60.
Isivinini sokuphrinta: manual 30-45mm/min;mechanical 40mm-80mm/min.
Izimo zokuphrinta: izinga lokushisa ku-23±3℃, umswakama ohlobene 45% -65%RH.
2. I-stencil: Ukuvuleka kwe-stencil kusekelwe ebukhulu be-stencil kanye nokuma kanye nengxenye yokuvula ngokusho kwesicelo somkhiqizo.
3. I-QFP/CHIP: isikhala esimaphakathi singaphansi kuka-0.5mm futhi i-0402 CHIP idinga ukuvulwa nge-laser.
I-stencil yokuhlola: ukumisa ukuhlolwa kwe-stencil tension kanye ngesonto, inani le-tension liyacelwa ukuba libe ngaphezu kuka-35N/cm.
Ukuhlanza i-stencil: Uma uphrinta ama-PCB angu-5-10 ngokuqhubekayo, sula i-stencil kanye ngephepha lokusula elingenalo uthuli.Awekho ama-rags okufanele asetshenziswe.
4. I-ejenti yokuhlanza: IPA
I-solvent: Indlela engcono kakhulu yokuhlanza i-stencil ukusebenzisa i-IPA ne-alcohol solvents, ungasebenzisi ama-solvents aqukethe i-chlorine, ngoba izolimaza ukwakheka kwe-solder paste futhi ithinte ikhwalithi.
Isikhathi sokuthumela: Jul-05-2023