Indlela yokuhlola ebonakalayo
Kusetshenziswa ingilazi yokukhulisa (i-X5) noma isibonakhulu esibonakalayo ku-PCBA, ikhwalithi yokuhlanza ihlolwa ngokubheka ukuba khona kwezinsalela eziqinile ze-solder, uthuli nobuhlalu bethini, izinhlayiya zensimbi ezingagxilile nokunye ukungcola.Ngokuvamile kuyadingeka ukuthi i-PCBA surface kufanele ihlanzeke ngangokunokwenzeka futhi kungabikho mikhondo yezinsalela noma ukungcola okufanele kubonakale.Lesi inkomba yekhwalithi futhi ngokuvamile iqondiswe ezidingweni zomsebenzisi, indlela yakhe yokwahlulela yokuhlola kanye nenani lokukhuliswa elisetshenziswa ngesikhathi sokuhlolwa.Le ndlela ibonakala ngokulula kwayo nokusebenziseka kalula.Ububi ukuthi akwenzeki ukuhlola ukungcola phansi kwezingxenye kanye nokungcola okusalela kwe-ionic futhi kulungele izinhlelo zokusebenza ezingafuneki kangako.
Indlela Yokukhipha I-Solvent
Indlela yokukhipha i-solvent yaziwa nangokuthi i-ionic contaminant test test.Kuwuhlobo lokuhlolwa okumaphakathi kokuqukethwe okungcolile kwe-ionic, ukuhlolwa ngokuvamile kusetshenziswa indlela ye-IPC (IPC-TM-610.2.3.25), ihlanzwa i-PCBA, icwiliswe kusixazululo sokuhlola i-ionic degree contamination test (75% ± 2% isopropyl ehlanzekile utshwala kanye namanzi angama-25% e-DI), izinsalela ze-ionic zizoncibilika ku-solvent, iqoqe ngokucophelela isincibilikisi, inqume ukumelana kwayo.
Ukungcola kwe-Ionic kuvame ukutholakala ezintweni ezisebenzayo ze-solder, njenge-halogen ion, i-acid ions, nama-ion ensimbi asuka ekugqwaleni, futhi imiphumela ichazwa njengenani le-sodium chloride (NaCl) elilingana nendawo yeyunithi ngayinye.Okungukuthi, inani eliphelele lalokhu kungcola kwe-ionic (okuhlanganisa kuphela lezo ezingancibilika ku-solvent) lilingana nenani le-NaCl, hhayi elikhona noma elikhona kuphela ebusweni be-PCBA.
Ukuhlola Ukumelana Nokufakwa Kwamanzi Okuphezulu (SIR)
Le ndlela ikala ukumelana nokwahlukanisa kwendawo phakathi kwama-conductor ku-PCBA.Isilinganiso sokumelana nokufakwa kwendawo sibonisa ukuvuza ngenxa yokungcoliswa ngaphansi kwezimo ezihlukahlukene zokushisa, umswakama, i-voltage nesikhathi.Izinzuzo ziwukulinganisa okuqondile nokwamanani;kanye nokuba khona kwezindawo zendawo ze-solder paste kungatholwa.Njengoba i-flux eyinsalela ku-PCBA solder unamathisele ngokuyinhloko ikhona kumthungo phakathi kwedivayisi ne-PCB, ikakhulukazi emalungeni e-solder e-BGAs, okunzima kakhulu ukuwasusa, ukuze kuqhutshekwe uqinisekise umphumela wokuhlanza, noma ukuqinisekisa ukuphepha. (ukusebenza kukagesi) kokunamathisela kwe-solder okusetshenzisiwe, ukukalwa kokumelana kwendawo kumthungo phakathi kwengxenye ne-PCB kuvame ukusetshenziselwa ukuhlola umphumela wokuhlanza we-PCBA.
Izimo ezijwayelekile zokulinganisa i-SIR ukuhlolwa kwamahora angu-170 ku-85°C izinga lokushisa le-ambient, umswakama we-RH ongu-85% kanye nokuchema kokulinganisa okungu-100V.
Umshini Wokuhlanza I-NeoDen PCB
Incazelo
Ukusekelwa komshini wokuhlanza indawo ye-PCB: Isethi eyodwa yohlaka olusekelayo
Ibhulashi: Anti static, high density brush
Iqembu lokuqoqa uthuli: Ibhokisi lokuqoqa ivolumu
Idivayisi ye-Antistatic: Isethi yedivayisi yokungena kanye nesethi yedivayisi yokuphuma
Ukucaciswa
| Igama lomkhiqizo | PCB umshini wokuhlanza indawo |
| Imodeli | PCF-250 |
| Usayizi we-PCB(L*W) | 50*50mm-350*250mm |
| Ubukhulu(L*W*H) | 555*820*1350mm |
| Ubukhulu be-PCB | 0.4-5mm |
| Umthombo wamandla | 1Ph 300W 220VAC 50/60Hz |
| Ukunikezwa komoya | Usayizi wepayipi lokungenisa umoya 8mm |
| Ukuhlanza i-roller enamathelayo | Phezulu*2 |
| Iphepha lothuli elinamathelayo | Umqulu ophezulu*1 |
| Isivinini | 0～9m/min(Iyalungiseka) |
| Landelela ubude | 900±20mm/(noma ngokwezifiso) |
| Isiqondiso sezokuthutha | L→R noma R→L |
| Isisindo(kg) | 80Kg |
Isikhathi sokuthumela: Nov-22-2022