Enqubweni yokucubungula i-PCBA, kunezinqubo eziningi zokukhiqiza, okulula ukukhiqiza izinkinga eziningi zekhwalithi.Ngalesi sikhathi, kuyadingeka ukuthi uthuthukise njalo indlela yokushisela ye-PCBA futhi uthuthukise inqubo ukuze uthuthukise ngempumelelo ikhwalithi yomkhiqizo.
I. Thuthukisa izinga lokushisa nesikhathi sokushisela
Isibopho se-intermetallic phakathi kwethusi nethini sakha okusanhlamvu, ukwakheka kanye nosayizi wezinhlamvu kuncike ubude besikhathi namandla ezinga lokushisa lapho imishini yokudambisa efanareflow ovennomaumshini we-wave soldering.Isikhathi sokuphendula se-PCBA SMD side kakhulu, kungakhathaliseki ukuthi kungenxa yesikhathi eside sokushisela noma ngenxa yokushisa okuphezulu noma kokubili, kuzoholela esakhiweni sekristalu esimahhadlahhadla, isakhiwo sinogwadule futhi sibhibha, amandla okugunda mancane.
II.Yehlisa ukungezwani kwendawo
Ukuhlangana kwe-tin-lead solder kukhulu kakhulu kunamanzi, ukuze i-solder iyindilinga yokunciphisa indawo yayo engaphezulu (ivolumu efanayo, i-sphere inendawo encane kakhulu engaphezulu uma iqhathaniswa nezinye izimo zejometri, ukuhlangabezana nezidingo zesimo samandla aphansi kakhulu. ).Indima ye-flux ifana nendima yama-ejenti okuhlanza epuleti lensimbi eligcotshwe ngamafutha, ngaphezu kwalokho, ukungezwani kwendawo nakho kuncike kakhulu ezingeni lokuhlanzeka kwendawo kanye nezinga lokushisa, kuphela lapho amandla okunamathela emakhulu kakhulu kunomhlaba. amandla (ukubumbana), i-dip tin ekahle ingenzeka.
III.I-PCBA board dip tin angle
Cishe i-35 ℃ ephakeme kunezinga lokushisa le-eutectic iphuzu le-solder, lapho ithonsi le-solder libekwe endaweni eshisayo eboshwe nge-flux, kwakheka indawo egobayo yenyanga, ngendlela, ikhono lensimbi lokucwilisa ithini lingahlolwa. ngokuma kwendawo yenyanga egobayo.Uma i-solder yenyanga egobayo inomkhawulo ocacile osikiwe ongezansi, omise okwepuleti lensimbi eligcotshisiwe kumaconsi amanzi, noma ijwayele ukuba yindilinga, insimbi ayidayisi.Indawo yenyanga egobile kuphela enwetshwe ibe i-engeli encane engaphansi kuka-30. Ukushisela okuhle kuphela.
IV.Inkinga ye-porosity ekhiqizwa ukushisela
1. Ukubhaka, i-PCB kanye nezingxenye ezivezwe emoyeni isikhathi eside ukuze zibhake, ukuvimbela umswakama.
2. Ukulawula ukunamathisela kwe-solder, unamathisele we-solder oqukethe umswakama ubuye uthambekele ku-porosity, ubuhlalu be-tin.Okokuqala, sebenzisa izinga elihle solder unama, solder unama tempering, govuza ngokusho ukusebenza ukuqaliswa esiqinile, solder unama evezwe emoyeni isikhathi esifushane ngangokunokwenzeka, ngemva kokunyathelisa solder unama, isidingo esifike ngesikhathi reflow soldering.
3. Ukulawulwa komswakama we-workshop, kuhlelwe ukuqapha umswakama we-workshop, ukulawula phakathi kuka-40-60%.
4. Setha ijika elifanele lokushisa kwesithando somlilo, kabili ngosuku ekuhlolweni kwezinga lokushisa kwesithando somlilo, nokwandisa ijika lokushisa lesithando somlilo, izinga lokushisa lokushisa alikwazi ukushesha kakhulu.
5. Flux spraying, in the overUmshini we-SMD wave soldering, inani lokufafaza kwe-flux alikwazi ukuba liningi kakhulu, ukufafaza okunengqondo.
6. Lungiselela ijika lokushisa lesithando somlilo, izinga lokushisa lendawo yokushisa idinga ukuhlangabezana nezidingo, hhayi eziphansi kakhulu, ukuze i-flux iguqe ngokugcwele, futhi isivinini sesithando somlilo asikwazi ukushesha kakhulu.
Isikhathi sokuthumela: Jan-05-2022