1. Amaphedi.
Iphedi iyimbobo yensimbi esetshenziselwa ukuthengisa izikhonkwane zezingxenye.
2. Ungqimba.
Ibhodi lesifunda ngokusho komklamo ohlukile, kuzoba nezinhlangothi ezimbili, ibhodi le-4-ungqimba, ibhodi le-6-layer, ibhodi le-8-layer, njll., inani lezendlalelo ngokuvamile liphindwe kabili, ngaphezu kokuhamba kwesignali ungqimba kukhona ezinye zencazelo yokucubungula ngesendlalelo.
3. Phezu komgodi.
Incazelo ye-perforation iwukuthi uma isifunda singenakufinyelelwa ezingeni lakho konke ukuqondanisa kwesignali, kuyadingeka ukuxhuma imigqa yesignali kuzo zonke izingqimba ngendlela yokubhoboza, ukubhoboza ngokuvamile kuhlukaniswe izinhlobo ezimbili, enye yensimbi. i-perforation, enye ye-non-metallic perforation, lapho ukubhoboza kwensimbi kusetshenziselwa ukuxhuma izikhonkwane zezingxenye phakathi kwezingqimba.Indlela yokubhoboza kanye nobubanzi bembobo incike ezicini zesignali kanye nezidingo zenqubo yesitshalo sokucubungula.
4. Izingxenye.
Ithengiswe ezingxenyeni ze-PCB, izingxenye ezihlukene phakathi kwenhlanganisela yokuqondanisa zingafinyelela imisebenzi ehlukene, kulapho indima ye-PCB.
5. Ukuqondanisa.
Ukuqondanisa kubhekisela emigqeni yesignali phakathi kwamaphini edivayisi exhunyiwe, ubude nobubanzi bokuqondanisa buncike kumvelo yesignali, njengosayizi wamanje, isivinini, njll., ubude nobubanzi bokuqondanisa nakho kuyahlukahluka.
6. Isikrini sikasilika.
Ukuphrinta kwesikrini kungabuye kubizwe ngongqimba lokuphrinta kwesikrini, okusetshenziselwa amadivaysi ahlukahlukene ahlobene nokulebula kolwazi, ukuphrinta kwesikrini kuvamise ukuba mhlophe, ungaphinda ukhethe umbala ngokwezidingo zabo.
7. Isendlalelo sokumelana ne-Solder.
Indima eyinhloko yesendlalelo se-soldermask ukuvikela ubuso be-PCB, ukwakha ungqimba oluvikelayo olunogqinsi oluthile, nokuvimbela ukuthintana phakathi kwethusi nomoya.Isendlalelo sokumelana ne-Solder ngokuvamile siluhlaza, kodwa kukhona nezinketho zesendlalelo ezibomvu, eziphuzi, eziluhlaza okwesibhakabhaka, ezimhlophe, ezimnyama ze-solder.
8. Izimbobo zendawo.
Izimbobo zokubeka zibekwe ukuze kube lula ukufaka noma ukulungisa izimbobo.
9. Ukugcwalisa.
Ukugcwalisa kusetshenziselwa inethiwekhi yomhlabathi yokubeka ithusi, kunganciphisa ngempumelelo i-impedance.
10. Umngcele kagesi.
Umngcele kagesi usetshenziselwa ukunquma ubukhulu bebhodi, zonke izingxenye ebhodini azikwazi ukudlula umngcele.
Izingxenye eziyishumi ezingenhla ziyisisekelo sokubunjwa kwebhodi, izici eziningi noma isidingo sokushisa ku-chip ukuze kuzuzwe uhlelo.
Isikhathi sokuthumela: Jul-05-2022