1. Ngohlelo lwegeleza kabushaihhavini, izingxenye azifakwanga ngokuqondile ku-solder encibilikisiwe, ngakho-ke ukushaqeka okushisayo ezingxenyeni kuncane (ngenxa yezindlela zokushisa ezihlukene, ukucindezeleka okushisayo ezingxenyeni kuzoba kukhulu kwezinye izimo).
2. Ingakwazi ukulawula inani le-solder elisetshenziswe enqubweni ehamba phambili, inciphise iziphambeko zokushisela njenge-welding ebonakalayo, ibhuloho, ukuze izinga lokushisela lihle, ukuhambisana kwe-solder joint kuhle, ukuthembeka okuphezulu.
3. Uma indawo enembile yenqubo ehamba phambili ekubunjweni kwe-solder ye-PCB bese ubeka indawo yezingxenye ibe nokuchezuka okuthile, ngenquboi-reflow solderingumshini, lapho zonke izingxenye zokuphela kwe-welding, iphinikhodi kanye nokumanzisa okuhambisanayo kwe-solder ngasikhathi sinye, ngenxa yomphumela wokungezwani kwe-solder encibilikisiwe, kukhiqiza umphumela wokuma, ukulungisa ngokuzenzakalelayo ukuphambuka, izingxenye zibuyela emuva ukuze zilinganisele indawo ngqo. .
4. I-SMT Reflowihhaviniiwukunamathisela kwe-solder okuqinisekisa ukwakheka okulungile futhi ngokuvamile akuhlangani nokungcola.
5. Umthombo wokushisa wendawo ungasetshenziswa, ngakho-ke izindlela zokushisela ezihlukene zingasetshenziswa ukushisela ku-substrate efanayo.
6. Inqubo ilula futhi umthwalo wokulungisa uncane kakhulu.

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Isikhathi sokuthumela: Mar-10-2021