1. Isisindo sebhodi ngokwayo sizobangela ukuguqulwa kokucindezeleka kwebhodi
Okujwayelekilereflow ovenizosebenzisa iketanga ukushayela ibhodi phambili, okungukuthi, izinhlangothi ezimbili zebhodi njenge-fulcrum ukusekela ibhodi lonke.
Uma kunezingxenye ezinzima kakhulu ebhodini, noma ubukhulu bebhodi bukhulu kakhulu, kuzobonisa ukucindezeleka okuphakathi ngenxa yesisindo sawo, okwenza ibhodi ligobe.
2. Ukujula kwe-V-Cut kanye nomugqa wokuxhuma kuzothinta ukuguqulwa kwebhodi.
Ngokuyinhloko, i-V-Cut iyicala lokucekela phansi isakhiwo sebhodi, ngoba i-V-Cut iwukusika ama-grooves eshidini elikhulu lebhodi lokuqala, ngakho-ke indawo ye-V-Cut ijwayele ukuguqulwa.
Umthelela we-lamination material, isakhiwo kanye nehluzo ebhodini lokuguqulwa.
Ibhodi le-PCB lenziwe ngebhodi eliwumgogodla kanye neshidi eliphulukisiwe kancane kanye necwecwe lethusi langaphandle elicindezelwe ndawonye, lapho ibhodi eliwumgogodla necwecwe lethusi lonakaliswa ukushisa lapho kucindezelwa ndawonye, futhi inani lokuguqulwa lincike ku-coefficient of thermal expansion (CTE) izinto ezimbili.
I-coefficient of thermal expansion (CTE) ye-copper foil imayelana ne-17X10-6;kuyilapho i-Z-directional CTE ye-FR-4 substrate evamile ingu-(50~70) X10-6 ngaphansi kwephoyinti le-Tg;(250~350) X10-6 ngenhla kwephoyinti le-TG, futhi i-X-directional CTE ngokuvamile ifana neyefoyili yethusi ngenxa yokuba khona kwendwangu yengilazi.
Ukuguqulwa okubangelwa ngesikhathi sokucutshungulwa kwebhodi le-PCB.
I-PCB board processing process process izimbangela ziyinkimbinkimbi kakhulu zingahlukaniswa zibe ukucindezeleka okushisayo nokucindezeleka kwemishini okubangelwa izinhlobo ezimbili zokucindezeleka.
Phakathi kwabo, ukucindezeleka okushisayo kukhiqizwa ngokuyinhloko ohlelweni lokucindezela ndawonye, ukucindezeleka komshini kukhiqizwa ngokuyinhloko ebhodini lokupakisha, ukuphatha, inqubo yokubhaka.Okulandelayo ingxoxo emfushane yokulandelana kwenqubo.
1. Laminate impahla engenayo.
I-Laminate inezinhlangothi ezimbili, izakhiwo ezilinganayo, azikho ihluzo, i-foil yethusi nendwangu yengilazi i-CTE ayihlukile kakhulu, ngakho-ke ngesikhathi sokucindezela ndawonye cishe akukho ukuguqulwa okubangelwa i-CTE ehlukene.
Kodwa-ke, ubukhulu obukhulu bomshini wokunyathelisa we-laminate kanye nomehluko wokushisa phakathi kwezindawo ezahlukene zepuleti elishisayo kungaholela ekuhlukeni okuncane kwejubane kanye nezinga lokuphulukisa i-resin ezindaweni ezahlukene zenqubo ye-lamination, kanye nomehluko omkhulu ku-viscosity enamandla. ngamanani ahlukene okushisa, ngakho-ke kuzoba nezingcindezi zendawo ngenxa yomehluko wenqubo yokwelapha.
Ngokuvamile, lokhu kucindezeleka kuzogcinwa ngokulingana ngemva kokukhishwa kwe-lamination, kodwa kuzokhishwa kancane kancane ekucubunguleni okuzayo ukuze kukhiqizwe ukubola.
2. Lamination.
I-PCB lamination inqubo iyinqubo eyinhloko yokukhiqiza ukucindezeleka okushisayo, okufana ne-laminate lamination, kuzophinde kukhiqize ukucindezeleka kwendawo okulethwa umehluko wenqubo yokwelapha, ibhodi le-PCB ngenxa yokuqina, ukusatshalaliswa kwezithombe, ishidi eliphulukisiwe kakhulu, njll. ukucindezeleka kwayo okushisayo kuyoba nzima kakhulu ukuqeda kune-laminate yethusi.
Ukucindezeleka okukhona ebhodini le-PCB kukhishwa ezinqubweni ezilandelayo ezifana nokubhoboza, ukubumba noma ukugcoba, okuholela ekuguquguqukeni kwebhodi.
3. Baking izinqubo ezifana solder ukumelana kanye uhlamvu.
Njengoba i-solder imelana ne-inki yokwelapha ayikwazi ukupakishwa phezu komunye, ngakho-ke ibhodi le-PCB lizobekwa ngokuqondile ebhodini lokubhaka le-rack, izinga lokushisa lokumelana ne-solder lingaba ngu-150 ℃, ngaphezu nje kwephoyinti le-Tg le-Tg ephansi, iphuzu le-Tg. ngenhla resin for high nokunwebeka state, ibhodi kulula deformation ngaphansi umphumela self-isisindo noma kuhhavini umoya onamandla.
4. Hot air solder leveling.
Ibhodi evamile eshisayo yokushisa i-solder yokulinganisa ukushisa kwesithando somlilo we-225 ℃ ~ 265 ℃, isikhathi se-3S-6S.ukushisa komoya oshisayo okungu-280 ℃ ~ 300 ℃.
Ibhodi yokukala ye-solder isuka ekamelweni ingene esithandweni, iphume esithandweni kungakapheli imizuzu emibili bese kuba yizinga lokushisa legumbi ngemuva kokucubungula ukugeza kwamanzi.Yonke inqubo yokulinganisa i-solder yomoya oshisayo yenqubo yokushisa nokubandayo kungazelelwe.
Ngenxa yokuthi izinto zebhodi zihlukile, futhi isakhiwo asifani, inqubo eshisayo nebandayo iboshelwe ekucindezelekeni okushisayo, okuholela ku-micro-strain kanye ne-deformation warpage jikelele.
5. Isitoreji.
PCB ibhodi esigabeni semi-eqediwe isitoreji ngokuvamile mpo ifakwe eshalofini, ukulungiswa eshalofini ukungezwani akufanele, noma inqubo isitoreji stacking wabeka ibhodi kuzokwenza ibhodi deformation mechanical.Ikakhulukazi ku-2.0mm ngaphansi komthelela webhodi elincanyana libucayi kakhulu.
Ngaphezu kwezici ezingenhla, kunezici eziningi ezithinta ukuguqulwa kwebhodi le-PCB.
Isikhathi sokuthumela: Sep-01-2022