Yiziphi izinzuzo zesiteshi sokusebenza kabusha se-BGA?

Yiziphi izinzuzo ze-Isiteshi sokusebenza kabusha se-BGA?Ake sibheke.

1. Ukukhethwa komsebenzi okunamandla nokuphelele, inkumbulo yezinhlobo eziyisishiyagalombili zamajika okushisa, abasebenzisi bangakhetha noma iyiphi ijika lokushisa ngokuvumelana nezidingo ze-desoldering.

2. Ukushisisa ijika elihlakaniphile, ungakwazi ukuqedela ngokuzenzakalelayo yonke inqubo yokukhipha i-desolder ngokusho kwejika lakho lokushisa esethiwe, okwenza yonke inqubo yokudiliza ibe ngokwesayensi.

3. Ukulungiswa kwezinhlangothi ezintathu zomzimba wesibani, uhlelo lohlaka lwesilayidi oluhlehliswayo, olulungele noma yiziphi izingxenye ze-engeli desoldering, umzimba wesibani se-infrared onokuma kwe-laser, ukuze ukulungisa kube lula kakhudlwana ukubeka kunembe kakhudlwana.

4. Ubuchwepheshe bokulawula izinga lokushisa obuhlakaniphile be-PID, ukulawulwa kwezinga lokushisa kunembe kakhudlwana, ijika liphelele kakhulu, lingagwema ngokuphumelelayo ukukhuphuka kwezinga lokushisa ngokushesha noma ukukhuphuka kwezinga lokushisa okungaphazanyiswa futhi kubangele umonakalo ku-chip noma ibhodi lesifunda.

I-5.I-Ultra-high power preheating melt glue system, kanye nokusetshenziswa kwemishini yokushisa ye-infrared self-developed, ukungena okunamandla, ukufana kokushisa kwedivayisi, ukulawula ukushisa okunembe kakhudlwana.Ingakwazi ukudicilela phansi noma isebenze kabusha i-BGA, i-SMD, i-CSP, i-LGA, i-QFP, i-PLCC ne-BGA yokufaka ibhola, imigqa ehlukahlukene yemigqa yamapulaki namasokhethi ophini (njengesokhethi ye-CPU nomugqa wepulaki we-GAP), ekwazi ngokugcwele ukuhlangabezana nekhompyutha, incwadi yokubhalela, i-e- imidlalo kanye nezinye izidingo ze-BGA zokudiliza / zokuphinda zisebenze, ezifanele ikakhulukazi ukuchithwa kwebhuloho elisenyakatho naseningizimu.

6.Isixhumi esibonakalayo esinomshini womuntu, isibonisi se-LCD esiphelele, yonke inqubo yokushisisa ukuze uyiqonde lapho uthi nhla.

7.Ukubukeka okuqinile, ivolumu engasindi, kusukela ekuqaleni kuya ekupheleni ukukhombisa imodi yokubeka esekelwe kubuchwepheshe, phezulu kwetafula, ukuze ube nesikhala esiningi, imiyalelo yokusebenza elula, ukuze ukwazi ukuyifunda.

Ukucaciswa kwe-BGA Rework Station

Ukunikezwa kwamandla: AC220V±10% 50/60HZ

Amandla: 5.65KW(Max), Ihitha ephezulu (1.45KW)

I-heater engaphansi (1.2KW), IR Preheater (2.7KW), Okunye (0.3KW)

PCB Usayizi: 412*370mm(Max); 6*6mm(Min)

I-BGA Chip Usayizi: 60*60mm(Max); 2*2mm(Min)

IR heater Usayizi: 285 * 375mm

Inzwa yokushisa: 1 pcs

Indlela yokusebenza: 7″ isikrini sokuthinta se-HD

Uhlelo Lokulawula: Isistimu yokulawula ukushisa okuzenzakalelayo V2 (i-software copyright)

Isistimu yokubonisa: 15″ SD isibonisi sezimboni (720P isikrini sangaphambili)

Uhlelo Lokuqondanisa: I-2 Million Pixel SD imaging system yedijithali, ukusondeza okuzenzakalelayo kokubona ngelaser: inkomba yamachashazi abomvu

I-Vacuum Adsorption: Okuzenzakalelayo

Ukunemba Kokuqondanisa: ±0.02mm

Ukulawula izinga lokushisa: Ukulawulwa kwe-thermocouple kohlobo lwe-K-loop ngokunemba kufika ku-±3℃

Idivayisi yokudla: Cha

Ukuma: I-V-groove ene-universal fixture

Ubukhulu: L685*W633*H850mm

Isisindo: 76KG