Yiziphi Izinzuzo ze-SMT Processing Technology?

Inqubo yokucubungula ye-SMT:

Okokuqala phezu ephrintiwe wesifunda ibhodi solder enamathela solder unama, futhi ngeUmshini we-SMTizingxenye zetheminali eyinsimbi noma iphinikhodi ngokunembile kuphedi lokubopha lokunamathisela kwe-solder, bese ubeka i-PCB enezingxenye kureflow ovenukushisisa ngokuphelele ukuncibilika kokunamathisela kwe-solder, ngemuva kokupholisa, ukunamathisela kwe-solder, ukuphulukiswa kwe-solder kuyabonakala phakathi kwezingxenye kanye nesekethe ephrintiwe yokuxhuma komshini nogesi.Yiziphi izinzuzo zobuchwepheshe bokucubungula i-SMT?

I. Ukuthembeka okuphezulu nokumelana nokudlidliza okuqinile

Ukucubungula kwe-SMT KUSEBENZISA izingxenye ze-chip, ukwethembeka okuphezulu, idivayisi encane nelula, ngakho ukumelana nokudlidliza kunamandla, kusetshenziswa ukukhiqizwa okuzenzakalelayo, okunokwethenjelwa okuphezulu, isilinganiso esingesihle sokuhlanganisa somthengisi singaphansi kokukodwa ngaphezu kwezinkulungwane eziyishumi, siphansi kune-wave yengxenye yokuxhuma imbobo. I-soldering technology i-oda lobukhulu, ukuqinisekisa ukuthi imikhiqizo ye-elekthronikhi noma izingxenye ze-solder joint defect rate iphansi, Njengamanje, cishe u-90% wemikhiqizo ye-elekthronikhi yamukela ubuchwepheshe be-SMT.

II.Imikhiqizo ye-elekthronikhi mincane ngosayizi futhi iphezulu ekuhlanganiseni

Ivolumu nesisindo sezingxenye ze-SMT cishe zingu-1/10 kuphela walezo zezingxenye ezivamile ze-plug-in.Ngokuvamile, ubuchwepheshe be-SMT bunganciphisa umthamo nesisindo semikhiqizo kagesi ngo-40% -60% no-60% -80%, ngokulandelana.Igridi ye-SMT ye-SMT yokucubungula kanye nezingxenye zokuhlanganisa isuka ku-1.27mm kuya kugridi yamanje engu-0.63mm, eminye ifinyelela kugridi engu-0.5mm, ngobuchwepheshe bokufaka imbobo ukuze kufakwe izingxenye, ingenza ukuminyana komhlangano kube phezulu.

III.Izici zokuvama okuphezulu, ukusebenza okuthembekile

Ngenxa yokunamathiselwe okuqinile kwezingxenye ze-chip, idivayisi ngokuvamile ayinamthofu noma imfushane, okunciphisa umthelela we-parasitic inductance kanye namandla e-parasitic, ithuthukise izici ze-high-frequency yesekhethi, futhi inciphise ukuphazamiseka kozibuthe kanye ne-rf.Amasekhethi aklanywe yi-SMC kanye ne-SMD anemvamisa ephezulu engu-3GHz, kuyilapho izingxenye ze-chip zingu-500MHz kuphela, ezingafinyeza isikhathi sokulibaziseka kokudlulisela.Ingasetshenziswa kumasekhethi anefrikhwensi yewashi engaphezu kuka-16MHz.Ngobuchwepheshe be-MCM, imvamisa yewashi lokugcina eliphezulu lendawo yokusebenza yekhompiyutha ingafinyelela ku-100MHz, futhi ukusetshenziswa kwamandla okwengeziwe okubangelwa ukusabela kwe-parasitic kungancishiswa izikhathi ezingu-2-3.

IV.Thuthukisa ukukhiqiza futhi uqaphele ukukhiqiza okuzenzakalelayo

Ukuze kube okuzenzakalelayo ngokugcwele, ukukhwezwa kwe-PCB enezimbobo njengamanje kudinga ukwanda okungu-40% endaweni ye-PCB yasekuqaleni ukuze inhloko yomhlangano ye-plug-in ezenzakalelayo ikwazi ukufaka ingxenye, ngaphandle kwalokho asikho isikhala esanele sokuphula ingxenye.Umshini we-SMT ozenzakalelayo (SM421/SM411) usebenzisa ukumuncwa kwe-vacuum nozzle kanye nento yokukhipha, ivacuum nozzle incane kunokubukeka kwengxenye, kodwa thuthukisa ukuminyana kokufakwa.Eqinisweni, izingxenye ezincane kanye nezikhala ezinhle ze-QFP zikhiqizwa umshini we-SMT othomathikhi ukuze kuzuzwe ukukhiqizwa okuzenzakalelayo okugcwele.

V. Yehlisa izindleko nezindleko

1. Indawo yokusetshenziswa kwebhodi eliphrintiwe iyancipha, futhi indawo iyi-1/12 yaleyo yobuchwepheshe be- through-hole.Uma ukufakwa kwe-CSP kwamukelwa, indawo izoncishiswa kakhulu.

2. Inani lemigodi yokumba ebhodini eliphrintiwe liyancishiswa ukuze kugcinwe izindleko zokulungisa.

3. Ngenxa yokuthuthukiswa kwezici zemvamisa, izindleko zokulungisa iphutha lesifunda ziyancipha.

4. Ngenxa yobukhulu obuncane nesisindo esincane sezingxenye ze-chip, izindleko zokupakisha, zokuhamba nezokugcina ziyancipha.

5. Ubuchwepheshe bokucubungula i-SMT SMT bungasindisa izinto zokwakha, amandla, okokusebenza, abasebenzi, isikhathi, njll., kunganciphisa izindleko kufikela ku-30% -50%.