I. I-BGA epakishiwe iyinqubo yokupakisha enezidingo eziphezulu zokushisela ekukhiqizeni i-PCB.Izinzuzo zayo zimi kanje:
1. Iphinikhodi emfushane, ukuphakama komhlangano ophansi, inductance encane ye-parasitic kanye ne-capacitance, ukusebenza kahle kukagesi.
2. Ukuhlanganiswa okuphezulu kakhulu, izikhonkwane eziningi, isikhala esikhulu sephini, i-pin coplanar enhle.Umkhawulo wesikhala sephinikhodi ye-electrode ye-QFP ngu-0.3mm.Lapho uhlanganisa ibhodi lesifunda elishiselwe, ukunemba kokukhuphuka kwe-chip ye-QFP kuqinile kakhulu.Ukuthembeka koxhumano lukagesi kudinga ukubekezelela ukukhwezwa kube ngu-0.08mm.Izikhonkwane ze-electrode ze-QFP ezinezikhala ezincane zincane futhi zintekenteke, kulula ukusonteka noma ukuphuka, okudinga ukuthi ukufana nokuhleleka phakathi kwamaphini webhodi lesifunda kumele kuqinisekiswe.Ngokuphambene, inzuzo enkulu yephakheji ye-BGA ukuthi isikhala sephinikhodi ye-electrode engu-10 sikhulu, isikhala esivamile ngu-1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), ukubekezelela ukukhweza kungu-0.3mm, nokuhlukahluka okujwayelekile -esebenzayoUmshini we-SMTfuthireflow ovenngokuyisisekelo ingahlangabezana nezidingo zomhlangano we-BGA.
II.Nakuba i-BGA encapsulation inezinzuzo ezingenhla, nayo inezinkinga ezilandelayo.Okulandelayo yibubi be-BGA encapsulation:
1. Kunzima ukuhlola nokugcina i-BGA ngemva kokushisela.Abakhiqizi be-PCB kufanele basebenzise i-X-ray fluoroscopy noma ukuhlolwa kwe-X-ray layering ukuze baqinisekise ukwethembeka koxhumo lokushisela ibhodi lesifunda, futhi izindleko zemishini ziphezulu.
2. Izihlanganisi ze-solder zomuntu ngamunye zebhodi lesifunda ziphukile, ngakho-ke yonke ingxenye kufanele isuswe, futhi i-BGA esusiwe ayikwazi ukuphinda isetshenziswe.
Isikhathi sokuthumela: Jul-20-2021