Ngo-2020, kwakhiqizwa ama-chips angaphezu kwesigidi sezigidi emhlabeni wonke, alingana nama-chips angu-130 aphethwe futhi asetshenziswa umuntu ngamunye emhlabeni.Nokho noma kunjalo, ukushoda kwe-chip kwakamuva kuyaqhubeka kubonisa ukuthi le nombolo ayikafinyeleli umkhawulo wayo ophezulu.
Nakuba ama-chips esengavele akhiqizwa ngezinga elikhulu kangaka, ukuwakhiqiza akuwona umsebenzi olula.Inqubo yokukhiqiza ama-chips iyinkimbinkimbi, futhi namuhla sizofaka izinyathelo eziyisithupha ezibaluleke kakhulu: ukufakwa, ukunamathela kwe-photoresist, i-lithography, i-etching, ukufakwa kwe-ion, nokupakisha.
Idiphozithi
Isinyathelo sokubeka siqala nge-wafer, esikwa kusilinda esihlanzekile esingu-99.99% (ebuye sibizwe ngokuthi “i-silicon ingot”) bese sipholishwa kuze kube sekugcineni okubushelelezi kakhulu, bese kufakwa ifilimu elincanyana le-conductor, insulator, noma impahla ye-semiconductor. ku-wafer, kuye ngezidingo zesakhiwo, ukuze ungqimba lokuqala lungaphrintwa kuso.Lesi sinyathelo esibalulekile sivame ukubizwa ngokuthi "i-deposition".
Njengoba ama-chips eba mancane futhi abe mancane, amaphethini wokuphrinta kuma-wafers aba nzima kakhulu.Intuthuko ekufakweni, i-etching kanye ne-lithography ibalulekile ekwenzeni ama-chips abe mancane kakhulu futhi ngaleyo ndlela kuqhubekisele phambili ukuqhutshwa koMthetho ka-Moore.Lokhu kuhlanganisa amasu amasha asebenzisa izinto ezintsha ukwenza inqubo yokubeka icace kakhudlwana.
I-Photoresist Coating
Ama-wafer abe esegcotshwa ngento ezwela ukukhanya ebizwa ngokuthi “photoresist” (ebuye ibizwe ngokuthi “photoresist”).Kunezinhlobo ezimbili zama-photoresists - "ama-photoresists amahle" kanye "nama-photoresists anegative".
Umehluko omkhulu phakathi kwama-photoresists amahle kanye namabi ukwakheka kwamakhemikhali wento kanye nendlela i-photoresist esabela ngayo ekukhanyeni.Endabeni yama-photoresists amahle, indawo evezwe ekukhanyeni kwe-UV ishintsha ukwakheka futhi incibilike kakhulu, ngaleyo ndlela ilungiselele ukushumeka nokubeka.Ama-photoresists angalungile, ngakolunye uhlangothi, enza i-polymerize ezindaweni ezivezwe ekukhanyeni, okwenza kube nzima kakhulu ukuncibilika.Ama-photoresists amahle asetshenziswa kakhulu ekwenziweni kwe-semiconductor ngoba angakwazi ukuthola ukulungiswa okuphezulu, okuwenza abe ukukhetha okungcono kwesiteji se-lithography.Manje kunezinkampani eziningi emhlabeni wonke ezikhiqiza ama-photoresists okukhiqiza ama-semiconductor.
I-Photolithography
I-Photolithography ibalulekile enqubweni yokukhiqiza ama-chip ngoba inquma ukuthi ama-transistors aku-chip angaba mancane kangakanani.Kulesi sigaba, ama-wafers afakwa emshinini we-photolithography futhi atholakala ekukhanyeni okujulile kwe-ultraviolet.Izikhathi eziningi mancane izikhathi eziyizinkulungwane kunohlamvu lwesihlabathi.
Ukukhanya kuvezwa ku-wafer “ngepuleti lemaski” futhi i-lithography optics (ilensi yesistimu ye-DUV) iyashwabana futhi igxilise iphethini yesekethe eklanyelwe kupuleti lemaski ku-photoresist ku-wafer.Njengoba kuchaziwe ngaphambili, lapho ukukhanya kushaya i-photoresist, kwenzeka ushintsho lwamakhemikhali olugxilisa iphethini kupuleti lemaski ku-photoresist coating.
Ukuthola iphethini eveziwe ngendlela efanele kuwumsebenzi onzima, onokuphazanyiswa yizinhlayiyana, ukuhlehla nokunye ukonakala ngokomzimba noma kwamakhemikhali konke okungenzeka kule nqubo.Yingakho ngezinye izikhathi sidinga ukuthuthukisa iphethini yokugcina yokuchayeka ngokulungisa ngokukhethekile iphethini kumaski ukuze senze iphethini ephrintiwe ibukeke ngendlela esifuna ibukeke ngayo.Isistimu yethu isebenzisa “i-computational lithography” ukuhlanganisa amamodeli e-algorithmic nedatha evela emshinini we-lithography namawafa okuhlola ukuze kukhiqizwe idizayini yemaski ehluke ngokuphelele kuphethini yokuchayeka yokugcina, kodwa yilokho esifuna ukukuzuza ngoba leyo ukuphela kwendlela yokuthola iphethini yokuvezwa oyifunayo.
Etching
Isinyathelo esilandelayo ukususa i-photoresist eyonakele ukuze uveze iphethini oyifunayo.Phakathi nenqubo “ye-etch”, iwafa iyabhakwa futhi ithuthukiswe, futhi enye i-photoresist iyawashwa ukuze iveze iphethini ye-3D yesiteshi evulekile.Inqubo yokufaka kufanele yakhe izici eziqhutshwayo ngokunembile nangokungaguquguquki ngaphandle kokuphazamisa ubuqotho okuphelele nokuzinza kwesakhiwo se-chip.Izindlela zokubhala ezithuthukisiwe zivumela abakhiqizi bama-chip ukuthi basebenzise amaphethini asuselwa ku-double, quadruple kanye ne-spacer ukuze bakhe ubukhulu obuncane bemiklamo ye-chip yesimanje.
Njengama-photoresists, i-etching ihlukaniswe ngezinhlobo "ezizomile" kanye "ezimanzi".I-Dry etching isebenzisa igesi ukuchaza iphethini eveziwe ku-wafer.Ukucwiliswa okumanzi kusebenzisa izindlela zamakhemikhali ukuhlanza iwafa.
I-chip inenqwaba yezendlalelo, ngakho-ke ukuqoshwa kufanele kulawulwe ngokucophelela ukuze kugwenywe ukulimaza izendlalelo ezingaphansi zesakhiwo se-chip enezendlalelo eziningi.Uma inhloso ye-etching ukudala i-cavity esakhiweni, kuyadingeka ukuqinisekisa ukuthi ukujula kwe-cavity kulungile.Eminye imiklamo ye-chip enezendlalelo ezingafika kwezingu-175, njenge-3D NAND, yenza isinyathelo sokufaka sibaluleke kakhulu futhi sibe nzima.
Umjovo we-Ion
Uma iphethini isiqoshwe ku-wafer, i-wafer ishaywa ngama-ion aqondile noma angalungile ukuze kulungiswe izici zokuqhuba zengxenye yephethini.Njengempahla yama-wafers, i-silicon yempahla eluhlaza ayiyona insulator ephelele noma umqhubi ophelele.Izakhiwo ze-silicone zokuqhuba ziwela endaweni ethile phakathi.
Ukuqondisa ama-ion ashajiwe ku-silicon crystal ukuze ukugeleza kukagesi kulawulwe ukuze kwakhiwe amaswishi e-elekthronikhi okuyizakhiwo eziyisisekelo ze-chip, ama-transistors, abizwa ngokuthi "ionization", eyaziwa nangokuthi "i-ion implantation".Ngemuva kokuthi isendlalelo senziwe i-ionized, i-photoresist esele esetshenziselwa ukuvikela indawo engagxiliwe iyasuswa.
Ukupakisha
Izinkulungwane zezinyathelo ziyadingeka ukuze udale i-chip ku-wafer, futhi kuthatha ngaphezu kwezinyanga ezintathu ukusuka ekuklanyweni kuya ekukhiqizeni.Ukuze ususe i-chip ku-wafer, isikwa ibe ama-chips ngamanye kusetshenziswa isaha ledayimane.Lawa ma-chips, abizwa ngokuthi "i-bare die," ahlukaniswa kusukela ku-wafer engama-intshi angu-12, usayizi ovame kakhulu osetshenziswa ekwenziweni kwe-semiconductor, futhi ngenxa yokuthi usayizi wama-chips uyahlukahluka, amanye ama-wafer angaqukatha izinkulungwane zama-chips, kuyilapho amanye aqukethe ambalwa kuphela. ishumi nambili.
Lawa mawafa angenalutho abe esebekwa "ku-substrate" - i-substrate esebenzisa i-foil yensimbi ukuqondisa okokufaka nokukhipha amasignali kusukela ku-wafer engenalutho kuya kulo lonke uhlelo.Ibe isimbozwa “ngosinki wokushisa”, isitsha sokuvikela sensimbi esincane, esiyisicaba esiqukethe into epholile ukuze kuqinisekiswe ukuthi i-chip ihlala ipholile ngesikhathi sokusebenza.
Iphrofayela Yenkampani
I-Zhejiang NeoDen Technology Co., Ltd. ibikhiqiza futhi ithumela kwamanye amazwe imishini emincane yokukhetha nendawo kusukela ngo-2010. Isebenzisa i-R&D yethu ecebile enokuhlangenwe nakho, ukukhiqizwa okuqeqeshwe kahle, i-NeoDen izuza idumela elihle kumakhasimende omhlaba wonke.
ngobukhona bomhlaba wonke emazweni angaphezu kwe-130, ukusebenza okuhle kakhulu, ukunemba okuphezulu nokuthembeka kwe-NeoDenImishini ye-PNPzenze zifaneleke ku-R&D, i-prototyping yobungcweti kanye nokukhiqizwa kwenqwaba encane kuya kwemaphakathi.Sihlinzeka ngesixazululo sochwepheshe semishini yokumisa eyodwa ye-SMT.
Engeza: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Zhejiang Province, China
Ucingo: 86-571-26266266
Isikhathi sokuthumela: Apr-24-2022