Izimiso Eziyisishiyagalolunye Eziyisisekelo Zomklamo we-SMB (II)

5. ukukhethwa kwezingxenye

Ukukhethwa kwezingxenye kufanele kuthathe i-akhawunti ephelele yendawo yangempela ye-PCB, ngangokunokwenzeka, ukusetshenziswa kwezingxenye ezivamile.Ungalandeli ngobumpumputhe izingxenye zosayizi omncane ukuze ugweme izindleko ezikhulayo, amadivaysi e-IC kufanele anake ukuma kwephini kanye nokuhlukaniswa kwezinyawo, i-QFP engaphansi kuka-0.5mm yesikhala sonyawo kufanele icatshangelwe ngokucophelela, kunokuba ikhethe ngokuqondile amadivayisi wephakheji ye-BGA.Ngaphezu kwalokho, ifomu lokupakisha lezingxenye, usayizi wokugcina we-electrode, ukuthengiswa, ukuthembeka kwedivayisi, ukubekezelelana kwezinga lokushisa njengokuthi kungakwazi yini ukuzivumelanisa nezidingo ze-solder-free soldering) kufanele kucatshangelwe.
Ngemva kokukhetha izingxenye, kufanele usungule isizindalwazi esihle sezingxenye, okuhlanganisa usayizi wokufaka, usayizi wephinikhodi nomkhiqizi wolwazi olufanele.

6. ukukhetha PCB substrates

I-substrate kufanele ikhethwe ngokuya ngemibandela yokusetshenziswa kwe-PCB kanye nezidingo zokusebenza kwemishini nekagesi;ngokusho kwesakhiwo sebhodi eliphrintiwe ukucacisa inani le-copper-clad surface ye-substrate (ibhodi elilodwa, elihlangene noma elinezingqimba eziningi);ngokusho kobukhulu bebhodi eliphrintiwe, ikhwalithi yendawo yeyunithi ephethe izingxenye zokunquma ubukhulu bebhodi le-substrate.Izindleko zezinhlobo ezahlukene zezinto ziyahluka kakhulu ekukhetheni ama-substrates e-PCB kufanele acabangele lezi zinto ezilandelayo:
Izidingo zokusebenza kukagesi.
Izinto ezifana ne-Tg, CTE, flatness kanye nekhono le-metallization yembobo.
Izici zentengo.

7. idizayini yesifunda ephrintiwe elwa nokugxambukela kwe-electromagnetic

Ngokuphazamiseka kwangaphandle kwe-electromagnetic, kungaxazululwa yizo zonke izindlela zokuvikela umshini futhi kuthuthukiswe idizayini yokulwa nokuphazamiseka kwesekethe.Ukuphazamiseka kwe-electromagnetic emhlanganweni we-PCB uqobo, kusakhiwo se-PCB, ukwakheka kwezintambo, kufanele kucatshangelwe okulandelayo:
Izingxenye ezingase zithinte noma ziphazamisane, ukwakheka kufanele kube kude ngangokunokwenzeka noma kuthathe izinyathelo zokuvikela.
Imigqa yesignali yamafrikhwensi ahlukene, izintambo azihambisani eduze komunye nomunye emigqeni yesignali yefrikhwensi ephezulu, kufanele ibekwe eceleni noma izinhlangothi zombili zocingo oluphansi ukuze zivikeleke.
Ukuze uthole i-high-frequency, i-high-speed circuits, kufanele yakhelwe ngangokunokwenzeka ukuze ibhodi lesifunda eliphrintiwe kabili-layer kanye ne-multi-layer.Ibhodi elinezinhlangothi ezimbili ngakolunye uhlangothi lwesakhiwo semigqa yesignali, olunye uhlangothi lungaklanywa ukuba lube phansi;ibhodi elinezingqimba eziningi lingase libe sengozini yokuphazanyiswa ekuhlelweni kwemigqa yesignali phakathi kongqimba lomhlabathi noma isendlalelo sokuhlinzeka ngamandla;kumasekhethi e-microwave anemigqa yeribhoni, imigqa yesignali yokudlulisela kufanele ibekwe phakathi kwezingqimba ezimbili eziphansi, kanye nogqinsi lowendlalelo yemidiya phakathi kwazo njengoba kudingeka ekubaleni.
Imigqa ephrintiwe yesisekelo se-Transistor kanye nemigqa yamasignali yamafrikhwensi aphezulu kufanele yakhelwe ibe mfushane ngangokunokwenzeka ukuze kuncishiswe ukuphazamiseka kozibuthe noma imisebe ngesikhathi sokudlulisa isignali.
Izingxenye zamafrikhwensi ahlukene awabelani ngomugqa ophansi ofanayo, futhi izintambo eziphansi nezinamandla zamafrikhwensi ahlukene kufanele zendlalwe ngokuhlukana.
Amasekhethi edijithali namasekhethi e-analog awahlanganyeli umugqa womhlabathi ofanayo ngokuphathelene nomhlabathi wangaphandle webhodi lesifunda eliphrintiwe ungaba nokuxhumana okufanayo.
Sebenza ngomehluko omkhulu ongaba khona phakathi kwezingxenye noma imigqa ephrintiwe, kufanele ukhulise ibanga phakathi komunye nomunye.

8. umklamo oshisayo we-PCB

Ngokukhula kobuningi bezingxenye eziqoqwe ebhodini eliphrintiwe, uma ungakwazi ukukhipha ukushisa ngesikhathi esifanele, kuzothinta imingcele yokusebenza yesifunda, futhi ngisho nokushisa okukhulu kuzokwenza izingxenye zihluleke, ngakho-ke izinkinga ezishisayo. ebhodini eliphrintiwe, umklamo kufanele ubhekwe ngokucophelela, ngokuvamile uthathe izinyathelo ezilandelayo:
Ukwandisa indawo ye-foil yethusi ebhodini eliphrintiwe elinezingxenye zamandla aphezulu phansi.
izingxenye ezikhiqiza ukushisa azifakwa ebhodini, noma usinki wokushisa owengeziwe.
amabhodi ama-multilayer umhlabathi wangaphakathi kufanele uklanywe njengenetha futhi usondele emaphethelweni ebhodi.
Khetha uhlobo lwebhodi elikwazi ukumelana nokushisa noma ukumelana nokushisa.

9. I-PCB kufanele yenziwe amakhona ayindilinga

Ama-PCB ane-engeli yesokudla athambekele ekujameni ngesikhathi sokudlulisa, ngakho-ke ekwakhiweni kwe-PCB, ifreyimu yebhodi kufanele yenziwe amakhona ayindilinga, ngokosayizi we-PCB ukuze kunqunywe irediyasi yamakhona ayindilinga.Sika ibhodi bese wengeza umsizi wonqenqema lwe-PCB onqenqemeni olusizayo ukuze wenze amakhona ayindilinga.