Ezinye izinkinga ezijwayelekile kanye nezixazululo ku-soldering

Igwebu ku-PCB substrate ngemva kokudayiswa kwe-SMA

Isizathu esiyinhloko sokuvela kwamabhamuza osayizi wezinzipho ngemva kokushiselwa kwe-SMA futhi umswakama ofakwe ku-substrate ye-PCB, ikakhulukazi ekucubunguleni amabhodi amaningi.Ngoba ibhodi le-multilayer lenziwe nge-multi-layer epoxy resin prepreg bese licindezelwa kushisa, uma isikhathi sokugcinwa kwe-epoxy resin semi curing piece sisifushane kakhulu, okuqukethwe kwe-resin akwanele, futhi ukususwa komswakama ngokomiswa kwangaphambili akuhlanzekile, kulula ukuthwala umhwamuko wamanzi ngemva kokucindezela okushisayo.Futhi ngenxa ye-semi-solid ngokwayo okuqukethwe kweglue akwanele, ukunamathela phakathi kwezingqimba akwanele futhi kushiye ama-bubbles.Ngaphezu kwalokho, ngemva kokuba i-PCB ithengiwe, ngenxa yesikhathi eside sokugcina kanye nendawo yokugcina enomswakama, i-chip ayibhakwa ngaphambi kwesikhathi ngaphambi kokukhiqizwa, futhi i-PCB eswakanyiswe ibuye ijwayele ukuba namabhamuza.

Isixazululo: I-PCB ingafakwa kwisitoreji ngemva kokwamukelwa;I-PCB kufanele ibhakwe ngaphambilini ku-(120 ± 5) ℃ amahora angu-4 ngaphambi kokubekwa.

Vula isekethe noma ukusoda okungamanga kwephinikhodi ye-IC ngemva kokuhlanganisa

Izimbangela:

I-1) I-coplanarity engalungile, ikakhulukazi kumadivayisi we-fqfp, iholela ekwakhiweni kwephini ngenxa yesitoreji esingalungile.Uma isikhwezi singenawo umsebenzi wokuhlola i-coplanarity, akulula ukuthola.

I-2) Ukungatholakali kahle kwezikhonkwane, isikhathi eside sokugcinwa kwe-IC, ukuphuzi kwezikhonkwane kanye nokungatholakali kahle kwe-solderability yizona zimbangela eziyinhloko zokuhlanganisa amanga.

I-3) I-solder paste inekhwalithi embi, okuqukethwe kwensimbi ephansi kanye nokungatholakali kahle kwe-solderability.I-solder paste ngokuvamile esetshenziselwa ukushisela amadivaysi e-fqfp kufanele ibe nensimbi engekho ngaphansi kwama-90%.

4) Uma izinga lokushisa langaphambi kokushisa liphezulu kakhulu, kulula ukubangela i-oxidation yezikhonkwane ze-IC futhi wenze i-solderability ibe yimbi nakakhulu.

5) Ubukhulu befasitela lesifanekiso sokuphrinta buncane, ukuze inani lokunamathisela kwe-solder alanele.

imigomo yokukhokha:

6) Naka isitoreji sedivayisi, ungathathi ingxenye noma uvule iphakheji.

I-7) Ngesikhathi sokukhiqiza, i-solderability yezingxenye kufanele ihlolwe, ikakhulukazi isikhathi sokugcina i-IC akufanele sibe side kakhulu (ungakapheli unyaka owodwa kusukela ngosuku lokukhiqiza), futhi i-IC akufanele ivezwe ekushiseni okuphezulu nomswakama ngesikhathi sokugcina.

8) Hlola ngokucophelela usayizi wewindi lesifanekiso, okungafanele libe likhulu kakhulu noma libe lincane kakhulu, futhi unake ukufanisa usayizi wephedi le-PCB.