Ikhwalithi Ehlanganisiwe Ye-Solder kanye Nokuhlolwa Kokubukeka

Ngokuqhubeka kwesayensi nobuchwepheshe, omakhalekhukhwini, amakhompyutha wethebhulethi kanye neminye imikhiqizo kagesi ilula, mincane, iyaphatheka kumkhuba wentuthuko, ekucutshungulweni kwe-SMT kwezingxenye zikagesi nazo ziba zincane, izingxenye zangaphambili ze-0402 capacitive nazo ziyinombolo enkulu. kasayizi 0201 ozoshintshwa.Indlela yokuqinisekisa ukuthi ikhwalithi yamalungu e-solder ibe yinkinga ebalulekile ye-SMD ephezulu yokunemba.Amalunga e-Solder njengebhuloho lokushisela, ikhwalithi nokuthembeka kwawo kunquma ikhwalithi yemikhiqizo ye-elekthronikhi.Ngamanye amazwi, ohlelweni lokukhiqiza, ikhwalithi ye-SMT ekugcineni iboniswa ngekhwalithi yamalungu e-solder.

Njengamanje, embonini ye-elekthronikhi, nakuba ucwaningo lwe-solder-free solder luye lwathuthuka kakhulu futhi seluqale ukukhuthaza ukusetshenziswa kwalo emhlabeni wonke, futhi izinkinga zemvelo ziye zakhathazeka kakhulu, ukusetshenziswa kwe-Sn-Pb solder alloy soft brazing technology manje kusewubuchwepheshe bokuxhumana obuyinhloko bamasekhethi e-elekthronikhi.

Inhlanganisela ye-solder enhle kufanele ibe emjikelezweni wokuphila wemishini, izakhiwo zayo zemishini kanye nogesi azikona ukwehluleka.Ukubukeka kwayo kuboniswa kanje:

(1) Indawo ephelele futhi ebushelelezi ecwebezelayo.

(2) Inani elifanele le-solder ne-solder ukumboza ngokuphelele ama-pads nemikhondo yezingxenye ezidayisiwe, ukuphakama kwengxenye kulinganiselwe.

(3) ukumanzisa okuhle;unqenqema lwephoyinti lokunamathisela kufanele libe mncane, i-solder kanye ne-pad surface yokumanzisa i-angle engu-300 noma ngaphansi kuhle, ubuningi abudluli ku-600.

I-SMT icubungula okuqukethwe kokuhlolwa kokubukeka:

(1) ukuthi izingxenye azikho yini.

(2) Ukuthi izingxenye zinamathiselwe ngokungalungile.

(3) Awukho umjikelezo omfushane.

(4) ukuthi ukushisela virtual;I-virtual welding yizizathu eziyinkimbinkimbi.

I. isahlulelo sokushisela amanga

1. Ukusetshenziswa kwemishini ekhethekile yomhloli eku-inthanethi ukuze ihlolwe.

2. Okubukwayo nomaUkuhlolwa kwe-AOI.Lapho amalunga e-solder atholakala ukuthi ama-solder amancane kakhulu amanzisa kabi, noma amalunga e-solder phakathi kwe-seam ephukile, noma indawo ye-solder yayiyibhola le-convex, noma i-solder ne-SMD ayiqabuli ukuhlangana, njll., kufanele sinake, ngisho noma kwenzeka ingozi encane efihliwe, kufanele inqume ngokushesha ukuthi kukhona yini iqoqo lezinkinga ze-solder.Isinqumo siwukuthi: bheka uma PCB ngaphezulu endaweni efanayo amalunga solder babe nezinkinga, ezifana nje izinkinga PCB ngamunye, kungase kube solder unama is klwejwa, pin deformation kanye nezinye izizathu, ezifana PCB eziningi endaweni efanayo banezinkinga, ngalesi sikhathi kungenzeka kube yingxenye embi noma inkinga ebangelwa iphedi.

II.Izimbangela kanye nezixazululo ukushisela virtual

1. Idizayini yephedi enesici.Ukuba khona kwephedi le-hole kuyiphutha elikhulu ekuklanyeni kwe-PCB, akudingeki, ungasebenzisi, nge-hole kuzokwenza ukulahlekelwa kwe-solder okubangelwa i-solder enganele;Isikhala sephedi, indawo nayo idinga ukufana okujwayelekile, noma kufanele ilungiswe ngokushesha ukuze idizayinwe.

2. Ibhodi le-PCB line-oxidation phenomenon, okungukuthi, i-pad ayikhanyi.Uma kwenzeka i-oxidation, irabha ingasetshenziswa ukusula ungqimba lwe-oxide, ukuze kuvele kabusha okukhanyayo.pcb ibhodi umswakama, ezifana kusolakala zingafakwa omiswe kuhhavini omiswe.pcb ibhodi has amabala amafutha, amabala umjuluko nokunye ukungcola, lesi sikhathi ukusebenzisa ethanol anhydrous ukuhlanza.

3. Iphrinta ye-solder inamathisele i-PCB, i-solder paste iyakhunyulwa, ihlikihlwe, ukuze inani le-solder linamathisele kumaphedi afanele ukunciphisa inani le-solder, ukuze i-solder inganele.Kufanele kwenziwe ngesikhathi.Izindlela zokwenezela ezitholakalayo zokukhipha impahla noma khetha kancane ngoqalo ukuze ugcwalise ngokugcwele.

4. I-SMD (izingxenye ezifakwe phezulu) zekhwalithi engalungile, ukuphelelwa yisikhathi, i-oxidation, i-deformation, okuholela ekuthengiseni okungamanga.Lesi isizathu esivame kakhulu.

Izingxenye ezine-oxidised azikhanyi.Iphuzu lokuncibilika kwe-oxide liyakhula.

Ngalesi sikhathi ngamadigri angaphezu kwamakhulu amathathu ensimbi kagesi ye-chromium kanye ne-rosin-type flux ingashiselwa, kodwa ngamadigri angaphezu kwamakhulu amabili we-SMT reflow soldering kanye nokusetshenziswa kwe-solder enamatheki engagqwali engagqwali kuyoba nzima ncibilika.Ngakho-ke, i-SMD ene-oxidised akufanele ithengiswe ngesithando somlilo sokugeleza kabusha.Thenga izingxenye kufanele ubone ukuthi ikhona yini i-oxidation, futhi uthenge ngesikhathi ukuze uyisebenzise.Ngokufanayo, i-oxidised solder paste ayikwazi ukusetshenziswa.

FP2636+YY1+IN6


Isikhathi sokuthumela: Aug-03-2023

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