I-Welding iyinqubo yokucubungula i-chip ye-SMT iyisixhumanisi esibalulekile, uma kulokhu isixhumanisi esivezwa amaphutha sizothinta ngokuqondile ibhodi lesifunda lokucubungula i-chip lihlulekile futhi lilahliwe, ngakho-ke ekushiseni kudingeka baqonde indlela yokushisela efanele, baqonde izindaba ezifanele okufanele bazigweme. izinkinga.
1. in the processing chip ngaphambi Welding on the pads camera nge flux, usebenzisa insimbi soldering ukubhekana kanye, ukugwema pads uthayela kabi noma oxidized, ukwakheka Welding ezimbi, chip ngokuvamile akudingeki ukubhekana .
2. Sebenzisa ama-tweezers ukubeka ngokucophelela i-chip ye-PQFP ebhodini le-PCB, qaphela ukuthi ungalimazi izikhonkwane.Iqondanise namaphedi futhi uqiniseke ukuthi i-chip ibekwe ngendlela efanele.Setha izinga lokushisa lensimbi libe ngaphezu kuka-300 degrees Celsius, cwilisa ichopho lensimbi libe inani elincane le-solder, cindezela phansi ku-chip ngethuluzi eliqondaniswe nendawo, engeza inani elincane le-solder izikhonkwane ezimbili ezimiswe ngokudayagonali, cindezela phansi ku-chip bese uthengisa izikhonkwane ezimbili ezimiswe ngokudayagonali ukuze i-chip igxilile futhi ingakwazi ukunyakaza.Ngemva kokuhlanganisa i-diagonal, hlola indawo ye-chip kusukela ekuqaleni ukuze ubone ukuthi iqondile yini.Uma kunesidingo, lungisa noma khipha futhi uqondanise indawo ku-PCB kusukela ekuqaleni.
3. Qala ukuthungatha zonke izikhonkwane, kufanele ungeze i-solder esihlokweni se-soldering iron, zonke izikhonkwane zizohlanganiswa nge-solder ukuze izikhonkwane zinamathele emanzini.Thinta ekugcineni kwephinikhodi ngayinye ye-chip ngesihloko se-solder iron kuze kube yilapho ubona i-solder igeleza kumaphini.Lapho u-soldering, namathela esihlokweni se-soldering iron kanye nezikhonkwane ezidayisiwe ngokuhambisana ukuze ugweme ukunqwabelana ngenxa ye-solder eyeqile.
4. Ngemva kokuhlanganisa zonke izikhonkwane, manzisa zonke izikhonkwane nge-solder ukuze uhlanze i-solder.Z emva kokusebenzisa ama-tweezers ukuhlola ukuthi kukhona i-solder yamanga, hlola ukuqedwa, kusukela ebhodini lesifunda eliboshwe nge-flux, kuyoba lula ku-SMD resistive components solder some, ungakwazi kuqala endaweni ye-solder ku-tin, bese ubeka umkhawulo owodwa wengxenye, nama-tweezers wokubamba ingxenye, i-solder ngakolunye uhlangothi, bese ubona ukuthi ibekwe kahle yini;uma isilungisiwe, solder ngakolunye, thengisa ngakolunye.Kudingeka ukuzijwayeza okuningi ukuze ubambe amakhono okuhlanganisa.
Izici ze-NeoDen IN12Creflow oven
1. Isistimu yokuhlunga intuthu eyakhelwe ngaphakathi, ukuhlunga okusebenzayo kwamagesi ayingozi, ukubukeka okuhle nokuvikelwa kwemvelo, okuhambisana kakhulu nokusetshenziswa kwendawo ephezulu.
2. Uhlelo lokulawula lunezici zokuhlanganiswa okuphezulu, ukuphendula ngesikhathi, izinga lokuhluleka eliphansi, ukugcinwa okulula, njll.
3. Ukusetshenziswa kwe-high-performance aluminium alloy heat plate esikhundleni se-tube yokushisa, kokubili ukonga amandla nokusebenza kahle, uma kuqhathaniswa namahhavini agelezayo afanayo emakethe, ukuchezuka kokushisa kwe-lateral kuncishiswe kakhulu.
4. Umklamo wokuvikela ukushisa ukushisa, izinga lokushisa legobolondo lingalawulwa ngokuphumelelayo.
5. Ukulawula okuhlakaniphile, inzwa yokushisa ezwela kakhulu, ukuzinza okusebenzayo kokushisa.
6. I-track drive motor eyenziwe ngokwezifiso ngokwezici zebhande le-B-uhlobo lwe-mesh, ukuqinisekisa isivinini esifanayo nokuphila isikhathi eside.
Isikhathi sokuthumela: Dec-13-2022