Khetha bese ubeka umshininezinye izinto ze-SMT ekukhiqizeni nasekucubunguleni kuzovela izinto eziningi ezimbi, njengesikhumbuzo, ibhuloho, ukushisela okubonakalayo, ukushisela okungelona iqiniso, ibhola lamagilebhisi, ubuhlalu bethini njalonjalo.Isifunda esifushane sokucubungula i-SMT SMT kuvame kakhulu esikhaleni esihle phakathi kwamaphini e-IC, kuvame kakhulu ku-0.5mm nangaphansi kwezikhala phakathi kwezikhonkwane ze-IC, ngenxa yesikhala sayo esincane, ukuklanywa kwesifanekiso esingalungile noma ukuphrinta kulula ukukhiqiza ukushiywa okuncane.
Izimbangela nezisombululo:
Imbangela 1:Isifanekiso se-stencil
Isixazululo:
Udonga lwembobo lwensimbi yensimbi lubushelelezi, futhi ukwelashwa kwe-electropolishing kuyadingeka ekukhiqizeni.Ukuvulwa kwe-mesh kufanele kube ngu-0.01mm noma u-0.02mm ububanzi kunokuvulwa kwe-mesh.Imbobo ihlanekezelwe yi-conical, evumela ukukhululwa okusebenzayo kokunamathisela kwethini ngaphansi kwethini, futhi kunganciphisa izikhathi zokuhlanza ze-mesh plate.
Isizathu 2: unamathisele solder
Isixazululo:
I-0.5mm nangaphansi kwe-pitch ye-IC solder paste kufanele ikhethwe ngobukhulu obungu-20 ~ 45um, i-viscosity ngo-800 ~ 1200pa.S
Isizathu 3: Iphrinta yokunamathisela ye-solderukunyathelisa
Isixazululo:
1. Uhlobo lwe-scraper: i-scraper inezinhlobo ezimbili ze-plastic scraper kanye ne-steel scraper.Ukuphrinta kwe-0.5 IC kufanele kukhethe i-scraper yensimbi, ehambisana nokwakheka kwe-solder paste ngemva kokuphrinta.
2. Isivinini sokuphrinta: i-solder paste izoqhubekela phambili kusifanekiso ngaphansi kokucindezela kwe-scraper.Isivinini sokuphrinta esisheshayo sihambisana ne-springback yesifanekiso, kodwa sizovimbela ukuvuza kwe-solder paste;Kodwa ijubane lihamba kancane kakhulu, ukunamathisela kwe-solder ngeke kugoqe kusifanekiso, okuholela ekulungisweni okungalungile kwe-solder paste ephrintiwe ku-solder pad.Ngokuvamile, isivinini sokuphrinta sebanga lesikhala esihle singu-10~20mm/s
3 imodi yokuphrinta: okwamanje imodi yokuphrinta evame kakhulu ihlukaniswe ngokuthi "ukuphrinta kothintana naye" kanye "nokuphrinta okungeyena othintana naye".
Kukhona igebe phakathi kwesifanekiso kanye nemodi yokuphrinta ye-PCB “ukuphrinta okungeyena othintana naye”, inani legebe elijwayelekile lingu-0.5 ~ 1.0mm, inzuzo yalo ifanele ukunamathisela kwe-viscosity solder ehlukile.
Alikho igebe phakathi kwesifanekiso nokuphrinta kwe-PCB kubizwa ngokuthi “contact printing”.Kudinga ukuzinza kwesakhiwo esiphelele, esilungele ukuphrinta isifanekiso se-tin ngokunemba okuphezulu kanye ne-PCB ukugcina othintana naye oyisicaba kakhulu, ngemuva kokuhlukaniswa kokuphrinta kanye ne-PCB, ngakho le ndlela yokufeza ukunemba kokuphrinta okuphezulu, okulungele ikakhulukazi ukuhlukanisa isikhala, i-ultra-fine. isikhala sokuphrinta solder unama.
Isizathu 4: Umshini we-SMTukuphakama kwentaba
Isixazululo:
Ku-0.5mm IC ekukhwezeni kufanele kusetshenziswe ibanga elingu-0 noma ubude obukhwezayo obungu-0~0.1mm, ukuze ugweme ngenxa yokuthi ukuphakama kokukhweza kuphansi kakhulu ukuze kugoqeke ukwakheka kwe-solder paste, okuholela kumjikelezo omfushane we-reflux.
Isikhathi sokuthumela: Aug-06-2021